9
Appendices
9.1
Profile Parameters
Operation of the Q150T is controlled by a process profile. There are several types of
profile as listed in Table 24. Each profile contains a number of adjustable parameters.
The following tables list the parameters available in each type of profile, showing their
default values and allowed ranges.
Name
Material
Sputter Current
(mA)
Sputter Time
(seconds)
Terminate
Thickness (nm)
Maximum Sputter
Time (minutes)
Tooling Factor
Clean target*
Flush chamber*
* Admin group level required to edit this property
10473 - Issue 5
Q150T Sample Preparation System
Table 24
FTM/Timed Sputter Coating parameters
Default
Minimum
Value
Value
Gold
20
1
120
1
1
4.0
0
2.3
0.1
No
No
No
No
78
Maximum
Comment
Value
Target Material required for this
process
50
Coating current
Updated from material list
3600
Timed Sputter only
Stops sputtering at set time.
2000
FTM Terminated Sputter only
Stops sputtering when the FTM
reads this thickness
60.0
FTM Terminated Sputter only
Sets upper limit to sputtering if
FTM thickness has not been
achieved
10
Tooling factor for this process
This is multiplied by that in the
material list.
Yes
Clean target before coating
Yes
Flush chamber with nitrogen
before pumping down.
Q150T - Instruction Manual
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