Related Manuals for Philips TDA7050T
Summary of Contents for Philips TDA7050T
- Page 1 DATA SHEET TDA7050T Low voltage mono/stereo power amplifier Product specification File under Integrated Circuits, IC01 INTEGRATED CIRCUITS July 1994...
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Page 2: General Description
Philips Semiconductors Low voltage mono/stereo power amplifier GENERAL DESCRIPTION The TDA7050T is a low voltage audio amplifier for small radios with headphones (such as watch, pen and pocket radios) in mono (bridge-tied load) or stereo applications. Features Limited to battery supply application only (typ. 3 and 4 V) - Page 3 Philips Semiconductors Low voltage mono/stereo power amplifier RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage Peak output current Total power dissipation Storage temperature range Crystal temperature A.C. and d.c. short-circuit duration at V = 3,0 V (during mishandling)
- Page 4 Philips Semiconductors Low voltage mono/stereo power amplifier CHARACTERISTICS 3 V; f 1 kHz; R 32 ; T PARAMETER Supply Supply voltage Total quiescent current Bridge-tied load application (BTL); see Fig.4 Output power = 3,0 V; d = 10% = 4,5 V; d...
- Page 5 Philips Semiconductors Low voltage mono/stereo power amplifier Fig.2 Output power across the load impedance (R Measurements were made at f = 1 kHz; d Fig.3 Output power across the load impedance (R Measurements were made at f = 1 kHz; d...
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Page 6: Application Information
Philips Semiconductors Product specification Low voltage mono/stereo power amplifier TDA7050T APPLICATION INFORMATION Fig.4 Application diagram (BTL); also used as test circuit. Fig.5 Application diagram (stereo); also used as test circuit. July 1994... - Page 7 Philips Semiconductors Low voltage mono/stereo power amplifier PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm pin 1 index DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT max. 0.25 1.45 1.75 0.25 0.10 1.25...
- Page 8 Philips Semiconductors Low voltage mono/stereo power amplifier SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities.
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Page 9: Life Support Applications
Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.