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Philips Semiconductors
40 Msps, 10-bit analog-to-digital
interface for CCD cameras
PACKAGE OUTLINE
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
y
36
37
48
1
e
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
A
1
max.
0.20
1.45
mm
1.60
0.05
1.35
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT313-2
2002 Oct 23
X
25
pin 1 index
12
Z D
w
M
b
p
D
H
D
(1)
A
b
c
D
2
3
p
0.27
0.18
7.1
0.25
0.17
0.12
6.9
IEC
JEDEC
136E05
MS-026
A
Z E
24
e
H
E
E
w
M
b
p
13
v
M
A
B
v
M
B
0
2.5
scale
(1)
E
e
H
H
D
E
7.1
9.15
9.15
0.5
6.9
8.85
8.85
REFERENCES
EIAJ
23
A
2
A
A
1
detail X
5 mm
L
L
v
w
y
p
0.75
1.0
0.2
0.12
0.1
0.45
EUROPEAN
PROJECTION
Product specification
TDA8783
SOT313-2
(A )
3
L
p
L
(1)
(1)
Z
Z
D
E
o
0.95
0.95
7
o
0.55
0.55
0
ISSUE DATE
99-12-27
00-01-19
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