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DIMENSIONS
Type I
1.0
3.4
.039
.134
0.2
Terminal #3
.008
3.4
.134
0.3
.012
C L
0.8 dia.
.031 dia.
OP
±0.2
3.3
FP
±.008
TTP
.130
3.7 max.
2.3 max.
.146
.091
C0.1
0.25
.004
.010
±0.05
1.2
dia.
±.002
.047
dia.
NOTES
1. Soldering operations
1) For manual soldering;
By using 18W Max. (iron tip temperature:
320°C
608°F
Max.) soldering should be
completed within 3 seconds.
2) For reflow soldering;
Perform soldering reflow at a peak sur-
face temperature of the PC board not to
exceed 245°C 473°F. See the below rec-
ommended temperature profile.
Recommended condition for
reflow temperature profile
245
473
220
428
150
302
Preheating
within 2 min.
3) During soldering, care should be taken
not to apply excessive stress to the termi-
nals as the resulting deformation may
cause malfunction. Excessively high sol-
der tab temperature and soldering iron
wattage should also be avoided as these
factors may harm switching performance.
2. Setting of the operation object
In setting the operation object; keep the
following distance between the switch bot-
tom and the operation object at T.T.P. (To-
tal Travel Position)
Type II
1.0
.039
Terminal #3
Terminal #1
1.5
.059
Terminal #2
OP
±0.2
4.5
1.2
±.008
.177
.047
FP
TTP
4.9 max.
3.5 max.
2.3
.193
.138
.091
0.15 max.
.006
ABP811161P: 2.3 to 2.9mm
.091 to .114 inch
ABP811261P: 3.5 to 4.1mm
.138 to .161 inch
3. Quality Check under Actual Loading
Conditions
To assure reliability, check the switch un-
der actual loading conditions. Avoid any
situation that may adversely affect switch-
ing performance.
4. Environment
1) These switches do not have a sealed
construction. As such, the construction of
the equipment in which the switches are
to be installed should be given careful
consideration when the switches are to be
used in locations where corrosive gases,
with 30 sec.
silicon or other substances which will ad-
versely affect the contacts are used,
where there is a high concentration of
dust or where the switches may be ex-
posed to condensation or water. Using
switches in locations like these may cause
malfunctioning.
2) Avoid using this switch in high-temper-
ature, high-humidity or condensation-
forming environments and avoid allowing
droplets of water to remain on the switch
or come into contact with it. These condi-
tions may interfere with the performance
of the switch (resulting in short-circuiting,
0.2
.008
Terminal #1
Terminal #2
C L
0.8 dia.
.031 dia.
2.9
.114
2.3
.091
0.15 max.
C0.1
0.25
.006
.004
.010
±0.05
1.2
dia.
±.002
.047
dia.
01/2006
Recommended PC board pattern
(Top view)
1.1
3.7
.043
.146
0.7
.028
+0.2
1.3
dia. hole
−0
+.008
.051
dia. hole
−0
Schematic
SPST-NO
Terminal #1
Terminal #3
Terminal #2
migration, etc.). Use the type with the gold
contacts in applications involving trains,
aircraft, motor vehicles or medical equip-
ment where the switch must satisfy safety
and high reliability requirements. Please
consult with us for the applications re-
quired high reliability.
3) Because the humidity range differs de-
pending on the ambient temperature, the
humidity range indicated below should be
used. Continuous operation of the switch
is possible within this range, but continu-
ous use near the limit of the range should
be avoided.
• This humidity range does not guarantee
permanent performance.
Humidity, %R.H.
85
Tolerance range
(Avoid freezing when
(Avoid
used at temperatures
condensation
lower than 0°C 32°F)
when used at
temperatures
higher than 0°C 32°F)
5
–25
0
–13
+32
Temperature, °C
ABP8
mm
inch
1.1
.043
1.5
.059
80
176
°F
141
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