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Recommended Land Pattern Design
●EZACT
b
●EZADT
●EZAST/SS
b
●EZASTB/SSB
c d b
●EZANT
b
• Design to make GND pattern as large as possible, because high
frequency noise is removed from GND terminals of chip RC network.
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
g
P
c
h
b
P
c
g
f2
c
GND
P
f2
GND
P
P
c
g
Land pattern
a
Dimensions
0.75
(mm)
e
Dimensions
1.85
(mm)
Land pattern
a
Dimensions
0.9 to 1.1
0.2 to 0.3
(mm)
f
Dimensions
2.0 to 2.6
3.6 to 4.2
(mm)
Solder resistant
Land pattern
a
Dimensions
1.2 to 1.4
(mm)
e
Dimensions
0.8
2.9 to 3.3
(mm)
Land pattern
a
Dimensions
1.4 to 1.6
(mm)
f1
Dimensions
2.7 to 3.5
(mm)
Land pattern
a
Dimensions
2.3 to 2.5
0.4 to 0.6
(mm)
f
Dimensions
4.3 to 4.7
7.6 to 8.0
(mm)
Chip RC Networks
b
c
d
0.25
1.70
0.35
h
g
P
2.60
0.25
0.60
b
c
d
2.6 to 2.8
0.3 to 0.4
g
P
0.635
b
c
d
0.4
3.1 to 3.3
0.4 to 0.5
f1
f2
P
4.8 to 5.2
0.8
b
c
d
0.35
0.45
0.3
f2
P
3.8
0.65
b
c
d
5.6 to 5.8
0.4 to 0.8
g
P
1.27
Feb. 2006
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