This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
DVD-ROM drive specifications ........................ 101 SAS and SATA hard drive specifications ....................101 Acronyms and abbreviations ...................... 103 Index ............................105 Contents 5...
HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material.
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HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione.
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La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.
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Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:...
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HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
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Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
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No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. Customer self repair 12...
Illustrated parts catalog Mechanical components Item Description Assembly part Spare part Customer number number self repair (on page 6) Access panel 463177-002 602505-001 Mandatory Air baffle 579551-001 602508-001 Mandatory Hardware kit — 602506-001 Mandatory a) Fan blank 507009-001 — — b) Optical blank 505953-001 —...
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Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
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Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
System components Item Description Assembly Spare part Customer part number number self repair (on page 6) System components Full-length expansion board shipping bracket* — 618597-001 Mandatory Hot-plug fan 463172-001 496066-001 Mandatory Hot-plug power supplies — — — a) 460 W 499249-001 511777-001 Mandatory...
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Item Description Assembly Spare part Customer part number number self repair (on page 6) b) 2.0-GHz, 8C AMD Opteron™ Model 578023-001 583751-001 Optional 6128HE* ** c) 2.3-GHz, 8C AMD Opteron™ Model 6134* 578022-002 583752-001 Optional d) 2.4-GHz, AMD Opteron™ Model 6136* ** 578022-001 583753-001 Optional e)) 2.1-GHz, 12C AMD Opteron™...
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Item Description Assembly Spare part Customer part number number self repair (on page 6) c) 2-GB, dual-rank, PC3-10600, registered 500202-161 595094-001 Mandatory d) 4-GB, dual-rank, PC3-10600, registered 591750-171 595096-001 Mandatory e) 8-GB, dual-rank, PC3-10600, registered 500205-171 595097-001 Mandatory f) 2-GB, quad-rank, PC3-10600E 500209-161 595101-001 Mandatory...
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Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
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Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver (provided inside the server) • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 80) Safety considerations Before performing service procedures, review all the safety information.
Extend the server from the rack (on page 27). If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.
To reduce the risk of personal injury, be careful when pressing the server rail-release latches and sliding the server into the rack. The sliding rails could pinch your fingers. Remove the server from the rack To remove the server from an HP, Compaq branded, telco, or third-party rack: Removal and replacement procedures 27...
Power down the server (on page 26). Extend the server from the rack (on page 27). Disconnect the cabling and remove the server from the rack. For more information, refer to the documentation that ships with the rack mounting option. Place the server on a sturdy, level surface.
Cable management arm with right-hand swing NOTE: To access some components, you may need to remove the cable management arm. To access the product rear panel components, open the cable management arm: Power down the server (on page 26). Swing open the cable management arm. Remove the cables from the cable trough.
Hot-plug SAS hard drive To remove the component: CAUTION: For proper cooling do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations ("SAS and SATA hard drive LED...
To replace the component, reverse the removal procedure. Hot-plug power supply WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
Remove the hot-plug power supply. WARNING: To reduce the risk of electric shock or damage to the equipment, do not connect the power cord to the power supply until the power supply is installed. To replace the component: Slide the hot-plug power supply into the power supply bay. Connect the power cord to the power supply.
Remove the three T-10 Torx screws, and then detach the front bezel. To replace the component, reverse the removal procedure. Access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: For proper cooling do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed.
Extend or remove the server from the rack ("Remove the server from the rack" on page 27, "Extend the server from the rack" on page 27). Remove the access panel ("Access panel" on page 33). Disconnect the cable from the optical drive. Remove the optical drive.
Extend or remove the server from the rack ("Remove the server from the rack" on page 27, "Extend the server from the rack" on page 27). Remove the access panel ("Access panel" on page 33). Disconnect the cable from the optical drive. Remove the optical drive ("Optical drive"...
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Configuration Fan bay 1 Fan bay 2 Fan bay 3 Fan bay 4 Fan bay 5 Fan bay 6 Fan blank Fan blank 1 processor 2 processors For a single-processor configuration, four fans and two blanks are required in specific fan bays for redundancy.
Remove the fan. CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. To replace the component, reverse the removal procedure. Power supply backplane To remove the component: Power down the server (on page 26).
Remove the power supply backplane. To replace the component, reverse the removal procedure. SFF hard drive backplane To remove the component: Power down the server (on page 26). Extend or remove the server from the rack ("Remove the server from the rack"...
Remove the hard drive backplane. To replace the component, reverse the removal procedure. SFF hard drive cage To remove the component: Power down the server (on page 26). Extend or remove the server from the rack ("Remove the server from the rack"...
Remove the hard drive cage. To replace the component, reverse the removal procedure. LFF hard drive backplane To remove the component: Power down the server (on page 26). Extend or remove the server from the rack ("Remove the server from the rack"...
Remove the hard drive backplane. To replace the component, reverse the removal procedure. LFF hard drive cage To remove the component: Power down the server (on page 26). Extend or remove the server from the rack ("Remove the server from the rack"...
Remove the hard drive cage. To replace the component, reverse the removal procedure. Full-length expansion board shipping bracket CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser cage. Power down the server (on page 26).
If full-length expansion boards are installed, remove the full-length expansion board shipping bracket as indicated. PCI riser cage To remove the component: CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser cage. Power down the server (on page 26).
Remove the PCI riser cage. To replace the component, reverse the removal procedure. Expansion slot covers CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser cage. CAUTION: For proper cooling do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed.
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To remove slot cover 1 or 4, push in on the retainer to release it, and then slide out the cover. To remove slot covers 2 and 3, lift up on the latch, remove the latch, and then remove the cover. Removal and replacement procedures 45...
To remove slot covers 5 and 6, push down on the latch, rotate the latch down, and then remove the cover. Expansion boards Half-length expansion board To remove the component: Power down the server (on page 26). Extend the server from the rack (on page 27). Remove the access panel ("Access panel"...
Remove the expansion board. To replace the component, reverse the removal procedure. Full-length expansion board To remove the component: Power down the server (on page 26). Extend the server from the rack (on page 27). Remove the access panel ("Access panel"...
To replace the component, reverse the removal procedure. Battery-backed write cache procedures Two types of procedures are provided for the BBWC option: • Removal and replacement of failed components: Removing the cache module (on page 48) Removing the battery pack (on page 49) •...
Set up a recovery server station using an identical server model. Do not install any internal drives or BBWC in this server. (HP recommends this option.) Find a server that has enough empty drive bays to accommodate all the drives from the failed server and that meets all the other requirements for drive and array migration.
If the array controller has failed, remove the cache module ("Removing the cache module" on page 48) and battery pack ("Removing the battery pack" on page 49) from the failed array controller, and install the cache module and battery pack on an array controller in the recovery server. If the server has failed, remove the controller ("Half-length expansion board"...
If the amber LED is not illuminated, remove the controller from the server, and then continue with the next step. Open the ejector latches on each side of the cache module connector. Normally, the cache module is ejected from the cache module connector. If the module is not ejected automatically, remove the cache module.
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up. Extend the server from the rack (on page 27).
Power down the server (on page 26). CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up.
CAUTION: For proper cooling do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. Power down the server (on page 26). Extend or remove the server from the rack ("Remove the server from the rack"...
Remove the fan cage. To replace the component, reverse the removal steps. Press down on the top of each fan to be sure it is seated properly. Heatsink To remove the heatsink: Power down the server (on page 26). Extend or remove the server from the rack ("Remove the server from the rack"...
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Open the heatsink retaining bracket, and then remove the heatsink. To replace the heatsink: Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. Remove the heatsink protective cover. Removal and replacement procedures 56...
Install the heatsink. Close and lock the heatsink retaining latches. Install the air baffle ("Air baffle" on page 53). Install the PCI riser cage ("PCI riser cage" on page 43). Install the access panel ("Access panel" on page 33). Install the server into the rack. Power up the server.
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CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number. To remove a processor: Power down the server (on page 26). Extend or remove the server from the rack ("Remove the server from the rack"...
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CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. To replace a processor: IMPORTANT: Be sure the processor remains inside the processor installation tool. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. Align the processor installation tool with the socket and install the spare processor.
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Press the tabs on the processor tool to release the processor, and then remove the processor tool. Removal and replacement procedures 60...
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Close the processor retaining latch and the processor socket retaining bracket. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. Removal and replacement procedures 61...
Install the heatsink. Close and lock the heatsink retaining latches. Install the air baffle ("Air baffle" on page 53). Install the access panel ("Access panel" on page 33). Install the server into the rack. Power up the server. Memory configurations This server supports 2 GB to 256 GB of system memory using DDR3 2-GB, 4-GB, 8-GB, and 16-GB memory modules across 24 memory sockets.
Advanced ECC memory Advanced ECC memory is the memory protection mode for this server. In Advanced ECC, the server does not fail because of correctable memory errors. The server provides notification if the level of correctable errors exceeds a pre-defined threshold rate. Advanced ECC provides additional protection over standard ECC because it is possible to correct certain memory errors that would otherwise be uncorrectable and result in a server failure.
When installing memory modules, observe the following population rules: • Use only HP memory modules listed in the DL385 QuickSpecs. • Advanced ECC is not available if x4 and x8 memory modules are mixed in channels (A and B), (C and D), or both, but standard ECC is still available.
QR 1066 MHz — 3 SR SR 1333 MHz 1333 MHz 1066 MHz — 3 DR DR 1333 MHz 1066 MHz 800 MHz DR 1066 MHz — 3 mixed SR 1333 MHz 1066 MHz 800 MHz DR 1333 MHz DR 1066 MHz SR 1333 MHz 800 MHz 667 MHz...
Remove the DIMM. To replace the component, reverse the removal procedure. Battery replacement If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack.
Remove the battery. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. Systems Insight Display To remove the component: Power down the server (on page 26). Extend or remove the server from the rack ("Remove the server from the rack"...
Remove the Systems Insight Display. To replace the component, reverse the removal procedure. Front left bezel To remove the component: Power down the server (on page 26). Extend or remove the server from the rack ("Remove the server from the rack"...
Remove the three T-10 Torx screws, and then detach the front bezel. To replace the component, reverse the removal procedure. Power supply cage assembly To remove the component: Power down the server (on page 26). Access the product rear panel (on page 28). Remove all power supplies ("Hot-plug power supply"...
Remove the power supply cage assembly. To replace the component, reverse the removal procedure. System board To remove the component: Power down the server (on page 26). Remove all power supplies ("Hot-plug power supply" on page 31). Remove the server from the rack (on page 27). Remove the access panel ("Access panel"...
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Open the heatsink retaining bracket, and then remove the heatsink. Open the processor retaining latch and the processor socket retaining bracket. Removal and replacement procedures 71...
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Using the processor tool, remove the processor from the system board. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. Disconnect all cables connected to the system board. Remove the retaining screw at the rear of the chassis. Loosen the system board thumbscrews.
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Prepare the processor socket on the spare system board: Remove the processor socket protective cover. Open the processor retaining latch and the processor socket retaining bracket. Install the processor socket cover onto the processor socket of the failed system board. Install the processor on the spare system board.
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If the processor has separated from the installation tool, carefully re-insert the processor in the tool. Align the processor installation tool with the socket and install the spare processor. CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket.
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Press the tabs on the processor tool to release the processor, and then remove the processor tool. Close the processor retaining latch and the processor socket retaining bracket. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing.
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Apply all the grease to the top of the processor in the following pattern to ensure even distribution. Install the heatsink. Install all components removed from the failed system board. Install the access panel ("Access panel" on page 33). Install the power supplies ("Hot-plug power supply"...
If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP authorized service provider for a replacement system board and TPM board.
Cabling SAS hard drive cabling Connect the SAS power cable from the primary drive cage (drive cage containing drives 1 - 8) to the primary SAS power connector on the system board. If a secondary drive cage (drive cage containing drives 9 - 16) is installed, connect a SAS power cable from the secondary drive cage to the secondary SAS power connector on the system board.
Japanese (http://www.hp.com/support/ProLiant_TSG_jp) HP Insight Diagnostics HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation.
HP strongly recommends that you install HP Insight Remote Support software to complete the installation or upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or HP contractual support agreement. HP Insight Remote Support supplements your monitoring 24 x 7 to ensure maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s...
USB support HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM.
Component identification Front panel components Item Description Quick release levers (2) Serial number label Systems Insight Display Hard drive bays SATA optical drive bay Video connector USB connectors (2) Front panel LEDs and buttons Item Description Status UID LED button Blue = Activated Flashing blue = System being remotely managed Off = Deactivated...
Item Description Status Health LED Green = Normal Flashing amber = System degraded. To identify a component in a degraded state, see "Systems Insight Display LEDs (on page 89)." Flashing red = System critical. To identify a component in a critical state, see "Systems Insight Display LEDs (on page 89)."...
Rear panel LEDs and buttons Item Description Status Power supply 2 Green = Normal power LED Off = System is off or power supply has failed. Power supply 1 Green = Normal power LED Off = System is off or power supply has failed. UID LED button Blue = Activated Flashing blue = System being remotely managed...
System board components Item Description Processor 2 memory sockets Front I/O connector USB tape connector* SATA optical drive connector USB connector Power supply backplane connector System maintenance switch System battery connector TPM connector NMI jumper Primary riser connector SD card connector Secondary riser connector Secondary SAS power connector Primary SAS power connector...
Item Description Fan 4 connector Processor 1 socket Fan 5 connector Processor 2 socket Fan 6 connector *Connect the USB tape power connector to the secondary SAS power connector. System board switches System maintenance switch Position Default Function Off = iLO 3 security is enabled. On = iLO 3 security is disabled.
• Short the NMI jumper pins • Use the iLO Virtual NMI feature For more information, see the whitepaper on the HP website (http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00797875/c00797875.pdf). DIMM slots DIMM slots are identified by the numbers 1 through 12. Component identification 88...
Systems Insight Display LEDs Item Description Status NIC LEDs Off = No link to network Flashing green = Network link and activity Green = Network link Power Cap LED Off = Server in standby Flashing amber = Power cap exceeded Green = Power cap configured AMP Status LED Off = Not enabled...
Systems Insight Display Health LED color Status LED and color DIMM in slot X has failed. DIMM (amber) Amber DIMM in slot X is in a pre-failure condition. One or more DIMMs have failed. Test each bank of DIMMs DIMM (amber) by removing all other DIMMs.
• LFF device bay numbering SAS and SATA hard drive LEDs Item Description Fault/UID LED (amber/blue) Online LED (green) SAS and SATA hard drive LED combinations Online/activity Fault/UID LED Interpretation LED (green) (amber/blue) On, off, or flashing Alternating amber The drive has failed, or a predictive failure alert has been received and blue for this drive;...
Online/activity Fault/UID LED Interpretation LED (green) (amber/blue) Amber, flashing Do not remove the drive. Removing a drive may terminate the Flashing regularly regularly (1 Hz) current operation and cause data loss. (1 Hz) The drive is part of an array that is undergoing capacity expansion or stripe migration, but a predictive failure alert has been received for this drive.
FL/FH denotes full-length, full-height. HL/FH denotes half-length, full-height. LP denotes low profile. • The PCIe2 x16 riser supports a maximum power of 225W with an HP power cable. This cable must be used for PCIe card wattages greater than 75W.
A fully-charged battery can normally preserve data for at least two days. The battery lifetime also depends on the cache module size. For further information, refer to the controller QuickSpecs on the HP website (http://www.hp.com). Double blink, then The cache microcontroller is waiting for the host controller to —...
LED3 pattern LED4 pattern Interpretation One blink per The battery pack is below the minimum charge level and is being — second charged. Features that require a battery (such as write cache, capacity expansion, stripe size migration, and RAID migration) are temporarily unavailable until charging is complete.
Green LED Amber LED Interpretation Flashing (2 Hz) One of the following conditions exists: Flashing (2 Hz) Alternating with Alternating with • The charging process has timed out. green LED amber LED • The capacitor pack is not connected. The flash code image failed to load. The flash code is corrupt.
Specifications Environmental specifications Specification Value Temperature range* 10°C to 35°C (50°F to 95°F) Operating -30°C to 50°C (-22°F to 122°F) Shipping -30°C to 60°C (-22°F to 140°F) Storage 28°C (82.4°F) Maximum wet bulb temperature Relative humidity (noncondensing)** 10% to 90% Operating 5% to 95% Non-operating...
Power supply specifications The following specifications provide information on the parameters of the power supplies as they were designed. For more information on configuring power for a specific server, see the HP website (http://www.hp.com/go/proliant-energy-efficient). Depending on installed options, the server is configured with one of the following power supplies: •...
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800 W at 100V AC input Rated peak power 900 W at 120V AC input 1200 W at 200V to 240V AC input • HP ProLiant 1200 W DC Power Supply Specification Value Input requirements -36V to -72V DC Rated input voltage...
Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.com/configurator/). CD-ROM drive specifications Specification Value CD-ROM (modes 1 and 2); mixed mode (audio and data combined); CD-DA; Photo Disk formats CD (single/multiple-session), CD-XA ready;...
DVD-ROM drive specifications Specification Value DVD (single and double layer), DVD-5, DVD-9, DVD-10, DVD-R, CD-ROM Mode 1 Disk formats & 2, CD-DA, CD-XA (Mode 2, Form 1 & 2), CD-I (Mode 2, Form 1 & 2), CD-I ready, CD-Bridge, CD-R, PhotoCD (single and multi-session) 4.7 GB (DVD-5), 8.5 GB (DVD-9), 9.4 GB (DVD10), 550 Mb (Mode 1, 12 cm), Capacity 640 Mb (Mode 2, 12 cm), 180 Mb (8 cm)
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Item 36-GB SAS drive 72-GB SAS drive 60-GB SATA drive 15 mm 15 mm 9 mm Height Serial ATA Interface 3 GB/sec 3 GB/sec 1.5 GB/sec Transfer rate 10,000 rpm 10,000 rpm 5,400 rpm Rotational speed Bytes per sector 512 71,132,960 143,374,737 117,231,408...
Acronyms and abbreviations ABEND abnormal end Automatic Server Recovery BBWC battery-backed write cache double data rate FBWC flash-backed write cache iLO 3 Integrated Lights-Out 3 Integrated Management Log non-maskable interrupt NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays PCIe peripheral component interconnect express PCI-X peripheral component interconnect extended...
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POST Power-On Self Test RBSU ROM-Based Setup Utility Rapid Deployment Pack serial attached SCSI SATA serial ATA trusted platform module unit identification universal serial bus Acronyms and abbreviations 104...
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