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LG G5200 Service Manual

Lg gsm phone service manual
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GSM Phone
SERVICE MANUAL
MODEL : G5200/W5200
P/N : MMBD0015801
JUNE, 2002

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Summary of Contents for LG G5200

  • Page 1 GSM Phone SERVICE MANUAL MODEL : G5200/W5200 P/N : MMBD0015801 JUNE, 2002...

  • Page 2: Table Of Contents

    Table Of Contents 3.10 Display and Interfaces ......28 1. INTRODUCTION ........3.11 Keypad Switches and Scanning ..29 1.1 Purpose ..........4 3.12 Microphone ......... 30 1.2 Regulatory Information ......4 3.13 Earpiece ..........31 A. Security ..........4 3.14 Hands-free Interface ......
  • Page 3 7. BLOCK DIAGRAM ......106 12. AUTO CALIBRATION ....121 7.1 Main Board ........106 12.1 Overview ........121 7.2 FPCB ..........107 12.2 Requirements ....... 121 7.3 RF ............ 107 12.3 Menu and settings ......121 12.4 AGC ..........123 8.
  • Page 4 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the G5200. - 3 -...

  • Page 5: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the G5200 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

  • Page 6: Notice Of Radiated Emissions

    1. INTRODUCTION E. Notice of Radiated Emissions The G5200 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

  • Page 7: Abbreviations

    Global System for Mobile Communications IPUI International Portable User Identity Intermediate Frequency Liquid Crystal Display Low Drop Output Light Emitting Diodet G5200 LG GSM Phone LG Electronics OPLL Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loopr...
  • Page 8 1. INTRODUCTION Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter Voltage Controlled Oscillator VCTCXO Voltage Control Temperature Compensated Crystal Oscillator Wireless Application Protocol - 7 -...

  • Page 9: Performance

    GSM, EGSM: -108 dBm, DCS: -107 dBm TX output power GSM, EGSM: 32 dBm (Level 5) DCS: 29.5 dBm (Level 0) GPRS compatibility Class 10 (This only applies to G5200) SIM card type 3V Small Display 128 dots LCD(Main) , 96...

  • Page 10: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification Item Description Specification TX: 890 + n 0.2 MHz RX: 935 + n 0.2 MHz (n = 1 ~ 124) EGSM Frequency Band TX: 890 + (n – 1024) 0.2 MHz RX: 935 + (n – 1024) 0.2 MHz (n = 975 ~ 1024) TX: 1710 + (n –...
  • Page 11 2. PERFORMANCE Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 600 ~ 1,200 1,200 ~ 1,800 1,800 ~ 3,000 3,000 ~ 6,000 Output RF Spectrum 6,000 (due to modulation) Offset from Carrier (kHz). Max. dBc +0.5 600 ~ 1,200 1,200 ~...
  • Page 12 2. PERFORMANCE Item Description Specification GSM, EGSM BER (Class II) < 2.439% @-102 dBm Bit Error Ratio BER (Class II) < 2.439% @-100 dBm RX Level Report Accuracy 3 dB 8 3 dB Frequency (Hz) Max.(dB) Min.(dB) Sending Response 1,000 2,000 3,000 3,400...
  • Page 13 2. PERFORMANCE Item Description Specification ≤ 30 ppm 32.768KHz tolerance Full power < 243 mA (GSM, EGSM) ; < 209 mA (DCS) Power Consumption Standby - Normal < 4 mA (Max. power) GSM/ Level 7 (Battery Capacity 750mA): Up to 180 Min Talk Time GSM/ Level 12 (Battery Capacity 750mA): Up to 300 Min Under conditions, Up to 200 hours:...

  • Page 14: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 General Descreption The RF parts consists of a transmitter part,a receiver part,a synthesizer part,a voltage supply part,a VCTCXO part. And the main RF Chipset CX74017[U411]is a single-chip dual-band transceiver for the extended global system for mobile communication[E- GSM900MHz]/Digital communication system[DCS1800MHz] voice and data transfer applications.

  • Page 15: Rf Front End

    3. TECHNICAL BRIEF A. RF front end RF front end consists of Antenna Switch(U405), dual band LNAs integrated in transceiver(U411). The Received RF signals (GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed into the antenna or mobile switch. An antenna matching circuit is between the antenna and the mobile switch.

  • Page 16: Transmitter Part

    3. TECHNICAL BRIEF 3.3 Transmitter Part The Transmitter part contains CX74017 active parts and PAM, APC IC, coupler and Antenna Switch. The CX74017 active part consists of a vector modulator and offset phase-locked loop block(OPLL) including down-converter, phase detector, loop filter and dual band transmit VCO which can operate at either final RF output frequency.

  • Page 17: Opll

    3. TECHNICAL BRIEF B. OPLL The offset mixer down converts the feedback Tx RF signal using LO to generate a IF modulating signal. The IF signal goes via external passive bandpass filter to one port of the phase detector. The other side of the phase detector input is LO signal. The phase detector generates an error current proportional to the phase difference between the modulated signal from the offset mixer and the reference signal from the LO.

  • Page 18: Tx Apc Part

    3. TECHNICAL BRIEF The counter and mode settings of the synthesizer are also programmed via 3-wire interface. 13MHz Figure 3-3. Synthesizer Block diagram D. TX APC Part The AD8315[U412] is a dual band RF power controller for RF power amplifiers operating in the 850MHz to 2GHz range.

  • Page 19: 13 Mhz Clock

    3. TECHNICAL BRIEF 3.4 13 MHz Clock The 13 MHz clock (VC-TCXO-208C) consists of a TCXO (Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the CX74017 RF Main Chip, BB Analog chip-set (AD6521), and Digital (AD6522). Figure 3-4.

  • Page 20: Digital Main Processor

    3. TECHNICAL BRIEF 3.6 Digital Main Processor The AD6522 is an ADI designed processor. Figure 3-6. Top level block diagram of the AD6522 internal architecture. BUS Arbitration Subsystem It is to work as a cross point for data accesses between the three main busses. EBUS is for external accesses, primarily from Flash memory for code and data.
  • Page 21 3. TECHNICAL BRIEF MCU subsystem It consists of an ARM7TDMI central processing unit, a boot ROM, a clock generation and access control module. The maximum clock frequency for the ARM7TDMI is 39 MHz at 2.45 V. The main clock is 13MHz and it is provided by VCTCXO. The Clock & BS(Bus Select) generator make internal clock by multiplying the main clock by 1X, 1.5X, 2X and 3X.
  • Page 22 3. TECHNICAL BRIEF Figure 3-7. System interconnection of AD6522 external interfaces - 21 -...
  • Page 23 3. TECHNICAL BRIEF Interconnection with external devices RTC block interface Countered by external X-TAL The X-TAL oscillates 32.768KHz LCD module interface Controlled by LCD_MAIN/SUB_CS, LCD_RES, LCD_A0, /WR, /RD, DATA [00...07] ports Table 3-3. Description LCD_MAIN_CS LCD chip enable. Each LCD has CS pin LCD_SUB_CS LCD_RES This pin resets LCD module.
  • Page 24 The AD6522 check status periodically in call mode if SIM card is inserted or not, but the AD6522 don't check in deep sleep mode. Interface by SIM_IO, SIM_CLK, SIM_RST Table 3-5. Description This pin receives and sends data to SIM card. G5200 support only 3.0 SIM_IO volt interface SIM card. SIM_CLK Clock 3.5MHz frequency.

  • Page 25: Analog Main Processor

    3. TECHNICAL BRIEF 3.7 Analog Main Processor AD6521 Figure 3-9. AD6521 function block diagram - 24 -...
  • Page 26 AFC DAC: 13 bits IDAC: 10 bits Voiceband section Receive audio signal from MIC. G5200 use differential configuration. Send audio signal to Receiver. G5200 use differential configuration. It interconnect with external device like main microphone, main receiver, ear-phone and Hands free...

  • Page 27: Power Management

    3. TECHNICAL BRIEF 3.8 Power Management ADP3408 Figure 3-10. ADP3408 inner block diagram. Power up sequence logic The ADP3408 controls power on sequence Power on sequence If a battery is inserted, the battery powers the 6 LDOs. Then if PWRONKEY is detected, the LDOs output turn on. REFOUT is also enabled Reset is generated and send to the AD6522 - 26 -...
  • Page 28 VMEM 2.80 V (is provided to Flash) Battery charging block It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries. G5200 use Li-Ion battery only. Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware.

  • Page 29: Memories

    EL Backlight EL Backlight G5200 has dual type LCD. There are the control output LCD_MAIN/SUB_CS which is derived from AD6522, this acts as the chip select enable for the Main/Sub LCD. AD6522 uses DATA[00:07] pins to send data for displaying graphical text onto the each LCD ( Main/Sub ).

  • Page 30: Keypad Switches And Scanning

    3. TECHNICAL BRIEF 3.11 Keypad Switches and Scanning The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 25switches (S301-S325), connected in a matrix of 5 rows by 5 columns, as shown in Figure, except for the power switch (S310), which is connected independently.

  • Page 31: Microphone

    3. TECHNICAL BRIEF 3.12 Microphone The microphone is soldered to the main PCB. The audio signal is passed to VINNORP (#K8) and VINNORN (#K7) pins of AD6522. The voltage supply 2V45_VCORE is output from ADP3408, and is a bias voltage for both the VINNOR (through R105) and VINAUX (through R104) lines. The VINNOR or VINAUX signal is then A/D converted by the Voiceband ADC part of AD6521.

  • Page 32: Earpiece

    3. TECHNICAL BRIEF 3.13 Earpiece The earpiece is driven directly from AD6521 VOUTNORP (#K8) and VOUTNORN (#K7) pins and the gain is controlled by the PGA in an AD6521. The earpiece is located in the handset floder front panel, and the signals are routed to it via FPCB connector between Main Board and FPCB board. But, The VOUTNORP signal has to be selected by the control signal “SPK_EN”.

  • Page 33: Hands-Free Interface

    3. TECHNICAL BRIEF 3.14 Hands-free Interface The audio out (VOUTAUXP & VOUTAUXN) to the hands-free kit consists of a pair of differential signals from AD6521 auxiliary outputs (#K9, #K6), which are tracked down the board to carkit connector (CN301) at the base of the handset. The DC level of the signal is supplied to the VOUTAUX pin.

  • Page 34: Lcd Back-Light Illumination

    3. TECHNICAL BRIEF 3.17 LCD Back-light Illumination In LCD Back-light illumination, there is an EL driver in sub LCD side of LCD Module, which is driven by BACKLIGHT(EL_EN) line from AD6522. Figure 3-15. LCD Back-light Illumination. 3.18 Multi-Color LED Illumination In multi-color LED illumination, there is an LED chip and three TRs in sub LCD side of LCD Module, which is driven by LED_G, LED_B and LED_Main line from AD6522.

  • Page 35: Speaker & Midi Ic

    3. TECHNICAL BRIEF 3.19 Speaker & MIDI IC Figure 3-17. Speaker & MIDI IC MA-3 is a synthesizer LSI for mobile phones that realize advanced game sounds. This LSI has a built-in speaker amplifier, and thus, is an ideal device for outputting sounds that are used by mobile phones in addition to game sounds and ringing melodies that are replayed by a synthesizer.

  • Page 36: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Components SW401 U405 U401 N401 U407 N409 U408 U411 U412 Y401 U414 U413 RF components Reference Description Reference Description U401 AND Gate U412 APC IC U405 Antenna Switch U413 Inverter U407 DCS RF SAW Filter U414 U408 GSM RF SAW Filter...
  • Page 37 4. TROUBLE SHOOTING RX Check Area - 36 -...
  • Page 38 4. TROUBLE SHOOTING 4.1-1 Checking Regulator Circuit U414.6 U414.1 - 37 -...
  • Page 39 4. TROUBLE SHOOTING 4.1-2 Checking VCTCXO Circuit Y401.3 Y401.4 Graph 4-1. VCTCXO 13MHz Graph 4-2. VCTCXO 2.7V - 38 -...
  • Page 40 4. TROUBLE SHOOTING 4.1-3 Checking Control Signal TP4043(RXEN) TP409(LE) TP407(Data) TP408(Clock) Graph 4-3. RF Control Signal - 39 -...
  • Page 41 4. TROUBLE SHOOTING 4-1-4 Checking Ant SW & Mobile SW U405.10 U405.2 SW401.2 U401.1 R405 U401.6 SW401.1 U405.11 U405.1 Table 4-1. ANT SW Control Logic - 40 -...
  • Page 42 4. TROUBLE SHOOTING Graph 4-4. ANT SW Control GSM. DCS RX Mode Graph 4-5. Dual AND Gate input For GSM RX Mode Graph 4-6. Dual AND Gate input For DCS RX Mode Table 4-2. ANT SW Control Logic - 41 -...
  • Page 43 4. TROUBLE SHOOTING 4-1-5 Checking Saw Filter Circuit U407.3 U407.1 U408.3 U408.1 - 42 -...

  • Page 44: Checking Rx Iq

    4. TROUBLE SHOOTING 4-1-6 Checking RX IQ RXIN RXQN RXIP RXQP Graph 4-7. RX IQ Signal Graph 4-8. RX I Signal (Extended) - 43 -...

  • Page 45: Tx Trouble

    4. TROUBLE SHOOTING 4.2 Tx Trouble Rx Check Area - 44 -...

  • Page 46: Checking Regulator Circuit

    4. TROUBLE SHOOTING 4-2-1 Checking Regulator Circuit If you already Check this point while checking RX part, You can Skip this Test U414.1 U414. 2 U414.6 - 45 -...

  • Page 47: Checking Vctcxo Circuit

    4. TROUBLE SHOOTING 4-2-2 Checking VCTCXO Circuit If you already Check this point while checking RX part, You can Skip this Test Y401. 3 Y401. 4 Graph 4-9. VCTCXO 13MHz Graph 4-10. VCTCXO 2.7V - 46 -...

  • Page 48: Checking Control Signal

    4. TROUBLE SHOOTING 4-2-3 Checking Control Signal. Graph 4-11. RF Control Signal Graph 4-12. TXEN, TXRAMP, TXPA TP409(LE) TXEN (R425) TXRAMP TXPA (R427) TP407(Data) (R405) TP408(Clock) - 47 -...

  • Page 49: Checking Tx Iq

    4. TROUBLE SHOOTING 4-2-4 Checking TX IQ TXQN C463 100P TXQP TXIN C464 100P TXIP TXQN TXIN TXQP TXIP Graph 4-13. TX IQ Signal - 48 -...

  • Page 50: Checking Rf Tx Level

    4. TROUBLE SHOOTING 4-2-5 Checking RF TX Level N401. 3 U409. 1 R407 N401. 1 L405 R411 L408 C432 U409. 8 U412. 1 R472 - 49 -...
  • Page 51 4. TROUBLE SHOOTING 4-2-6 Checking Ant SW & Mobile SW U405. 3 SW401. 2 U405. 8 U405. 5 U401. 1 R405 U401. 6 SW401. 1 U405. 11 U405. 2 Table 4-1. ANT SW Control Logic - 50 -...
  • Page 52 4. TROUBLE SHOOTING 4-2-6 Checking Ant SW & Mobile SW Graph 4-14. ANT SW Control Graph 4-15. ANT SW Control DCS TX Mode GSM TX Mode Graph 4-16.Dual AND Gate input Graph 4-17.Dual AND Gate input For DCS TX Mode For GSM TX Mode Table 4-3.
  • Page 53 4. TROUBLE SHOOTING 4-2-7 Receiver RF Level - 52 -...
  • Page 54 4. TROUBLE SHOOTING Test Points of Rx Level - 53 -...
  • Page 55 4. TROUBLE SHOOTING 4-2-8 Transmitter RF Level - 54 -...
  • Page 56 4. TROUBLE SHOOTING 4-2-8 Transmitter RF Level 7 , 8 9 , 10 Test Points of Tx Level - 55 -...
  • Page 57 4. TROUBLE SHOOTING 4-2-9 Test Points for RF Components U401. 3 U401. 7 TXPA TXEN(R425) (R405) TXRAMP(R427) 13MHz CLock RF 2.85V 2V7_VCTCXO TXQN RXQN TXQP RXQP TXIN RXIN TXIP RXIP Test Points for RF components - 56 -...
  • Page 58 4. TROUBLE SHOOTING • Test Points for RF Components TP408(PLL_Clock) TP409(PLL_LE) TP409(PLL_LE) TP407(PLL_Data) Test Points for RF components (Keypad Side/Lower) - 57 -...
  • Page 59 4. TROUBLE SHOOTING • Baseband components (Component Side) U101 U102 U103 D101 D102 U201 X101 CN101 U105 Q302 U205 U106 U202 U203 U302 U204 CN302 Baseband components (Component Side) Reference Description Reference Description U101 PMIC U205 U102 P-Channel FET U302 Analog Switch U103 Analog Main Processor...
  • Page 60 4. TROUBLE SHOOTING • Baseband components (Keypad Side) D301 Q101 Q301 MIC101 U301 Baseband components (Keypad Side) Reference Description Reference Description U301 Hall Sensor D301 Dual Diode Q301 Transistor MIC101 C-MIC Q302 Transistor - 59 -...

  • Page 61: Power On Trouble

    4. TROUBLE SHOOTING 4.3 Power on Trouble Setting : Connect PIF, and set remote switch off at PIF. - 60 -...
  • Page 62 4. TROUBLE SHOOTING POWER-ON KEY signal input These powers should be necessary to power on. This signal should go HIGH when the power-on procedure is completed. Pin 25 (VTCXO=2.7V) Pin 22 (VCORE=2.45V) Pin 21 (VMEM=2.8V) Pin 1 (PWRON_EN) Pin 2 (Power Key) Pin 6 (VRTC>1.2V) - 61 -...

  • Page 63: Charging Trouble

    4. TROUBLE SHOOTING 4.4 Charging Trouble Setting : Connect PIF, and set remote switch off at PIF. - 62 -...
  • Page 64 4. TROUBLE SHOOTING The charging current will flow into this direction. R102 U102 D101 - 63 -...

  • Page 65: Lcd Trouble

    4. TROUBLE SHOOTING 4.5 LCD Trouble Setting : Connect PIF and power on. - 64 -...
  • Page 66 4. TROUBLE SHOOTING CN301 Soldering Check If the FPCB has a problem, the control signals for LCD cannot be transmitted properly. - 65 -...

  • Page 67: Receiver Trouble

    4. TROUBLE SHOOTING 4.6 Receiver Trouble Setting : After initializing GSM MS test equipmemt, connect PIF and power on. Make a test call to 112. Set audio part at test equipment as PRBS or continuous wave, not echo. Set the volumn max. - 66 -...
  • Page 68 4. TROUBLE SHOOTING PMIC (U101) RECEIVER C206 U202. 4 Soldering Check U202. 5 From the U103(AD6521) To Receiver at LCD module via CN301 C206 U202 From the U103(AD6521) The Circuit Diagram of the receiver path. Refer to page 2 of the complete circuit diagram for detail. - 67 -...
  • Page 69 4. TROUBLE SHOOTING U202. 4 U202. 5 C206 (REC-) The waveforms of the audio signals at each point - 68 -...

  • Page 70: Speaker Trouble

    4. TROUBLE SHOOTING 4.7 Speaker Trouble Setting : Connect PIF to the phone, and power on. Enter the engineering mode, and set "Melody on" at "BB Test-Buzzer" menu. - 69 -...
  • Page 71 4. TROUBLE SHOOTING C209, C211, R213, R215 U205 C221 U203 R222, R227 Speaker Pin 26 CN301 Pin 25 Soldering Check in LCD Module - 70 -...
  • Page 72 4. TROUBLE SHOOTING These four components make up the analog amplifier stage of melody. C209, R213, C211, R215 This is the melody IC. U203 To the speaker at LCD module via CN301. The Power for analog part of the melody IC. The voltage is 3.3V R227 R222 The Power for digital part of the...

  • Page 73: Mic Trouble

    4. TROUBLE SHOOTING 4.8 Mic Trouble Setting : After initializing GSM MS test equipment, connect PIF to the phone, and power on. Make a test call to 112. Make a sound in front of microphone. - 72 -...
  • Page 74 4. TROUBLE SHOOTING R105 R108 C118 R110 R112 C132 C129 Q101.3 MIC101 - 73 -...
  • Page 75 4. TROUBLE SHOOTING R105 C118 R108 MIC101 The voltage at this point goes to almost 0V when the mic is activated. Mic activating signal Mic is activated when this signal goes to HIGH The signal flow of R110, R112 the microphone to C129, C132 U103(AD6521) MIC+...

  • Page 76: Vibrator Trouble

    4. TROUBLE SHOOTING 4.9 Vibrator Trouble Setting : Connect PIF to the phone, and power on. Enter the engineering mode, and set "Vibrator On" at "BB Test-Vibrator" menu. START Is the voltage at pin 3 Check the soldering of R309. Resolder R309.
  • Page 77 4. TROUBLE SHOOTING Pin 22 Soldering Check in LCD Module CN301 Vibrator R301 Q301.3 R309 Q301.2 When the vibrator works, the current flow in this directoin. From the vibrator at LCD module via CN301. When the vibrator works, the signal at this point goes to 2.8V.

  • Page 78: Backlight Trouble

    4. TROUBLE SHOOTING 4.10 Backlight Trouble Setting : Connect PIF to the phone, and power on. Enter engineering mode, and set "Backlight on" at "BB test-Backlight" menu. - 77 -...
  • Page 79 4. TROUBLE SHOOTING R321 Q302.2 R319 - 78 -...

  • Page 80: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.11 Folder on/off Trouble Setting : Connect PIF to the phone, and power on. - 79 -...
  • Page 81 4. TROUBLE SHOOTING R310 U301.1 U301.2 The voltage at this point goes from 2.8V to 0 V when the folder is closed. To U105(AD6522) This component operate when a magnet get close here. - 80 -...

  • Page 82: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.12 SIM Detect Trouble Setting : Insert the SIM into CN101. Connect PIF to the phone, and power on. - 81 -...
  • Page 83 4. TROUBLE SHOOTING PIN 5 PIN 7 PIN 1 PIN 3 - 82 -...

  • Page 84: Earphone Trouble

    4. TROUBLE SHOOTING 4.13 Earphone Trouble Setting : After initializing GSM test equipment, connect PIF to the phone and power on. - 83 -...
  • Page 85 4. TROUBLE SHOOTING - 84 -...
  • Page 86 4. TROUBLE SHOOTING - 85 -...
  • Page 87 4. TROUBLE SHOOTING - 86 -...

  • Page 88: Hfk Trouble

    4. TROUBLE SHOOTING 4.14 HFK Trouble R104 C168 C117 R103 R106 C124 R208 R209 R201 CN201 U201.1 R210 R212 L201 U204.6 R211 U204.5 U204.1 R230, R231 - 87 -...
  • Page 89 4. TROUBLE SHOOTING This part makes the mic bias of the ear-mic. Mic bias and path for the ear-mic Refer to the page 1 of the complete circuit diagram for detail. The direction of the audio To U103(AD6521) These resistors make the reference voltage.
  • Page 90 4. TROUBLE SHOOTING Setting : After initializing GSM test equipment, connect PIF to the phone and power on. - 89 -...
  • Page 91 4. TROUBLE SHOOTING - 90 -...
  • Page 92 4. TROUBLE SHOOTING - 91 -...
  • Page 93 4. TROUBLE SHOOTING R333 U204.1 U204 U204.5 CN302 R156 CN302.1 CN302.9 ~ C171 CN302.12 R170 C168 R104 C117 R103 R106 C124 CN201 L201 R158 R328 Check Point ( 0V when HFK is 2.8V activated.) R205 - 92 -...
  • Page 94 4. TROUBLE SHOOTING The HFK detect signal CN302 R328 R333 The audio signals from & to the HFK The circuit diagram of the part of CN302 Refer to the page 3 of the complete circuit diagram. The HFK detect signal This point goes to 0 V when the HFK is activated.
  • Page 95 4. TROUBLE SHOOTING The direction of the audio signal from the mic of the HFK The audio signal from the mic of the HFK to U103(AD6521) To U103 This part is same with that of the ear-mic. (AD6521) Refer to the page 1 of the complete circuit diagram for detail. The signal flow when the HFK is activated.

  • Page 96: Assembly Instruction

    5. ASSEMBLY INSTRUCTION 5. ASSEMBLY INSTRUCTION 5.1 Disassembly 1. Remove the battery, antenna and screws as shown above. Figure 5-1. Removing Battery pack, screws and Antenna 2. Carefully lift up the bottom of Rare Cover first, then hold the covers and twist them. Figure 5-2.
  • Page 97 5. ASSEMBLY INSTRUCTION 3.Finally carefully remove the rear-cover from the hooks on the top of front-cover. Figure 5-3. Disassembly from the hooks - 96 -...
  • Page 98 5. ASSEMBLY INSTRUCTION 4. Remove the pin shown below to unlock the PCB. Figure 5-4. Unlocking and removing the PCB - 97 -...
  • Page 99 5. ASSEMBLY INSTRUCTION 5. Use a sharp awl to push away the antenna-bushing. Figure 5-5. Removing Antenna-bushing 6. Use a tweezers to remove the Battery Locker. Figure 5-6. Removing battery locker - 98 -...
  • Page 100 5. ASSEMBLY INSTRUCTION 7. Remove the buttons. Figure 5-7. Removing buttons 8. Push away the hinge to remove the folder. Figure 5-8. Detaching Folder - 99 -...
  • Page 101 5. ASSEMBLY INSTRUCTION 9. Remove a hinge from the folder. Then detach screw caps and screws Figure 5-9. Removing hinge and screws 10. Place the folder on a desk. Then hold the hinge and push it down carefully. Finally, detach it from the rest hooks shown above. Firure 5-10.
  • Page 102 5. ASSEMBLY INSTRUCTION 11. Detach the rest components as shown below. Figure 5-11. Disassembly of Rest components 12. Use a ‘ - ’ driver to lift up the end-side of sub-window. Figure 5-12. Detaching sub-window. - 101 -...

  • Page 103: Download

    6. DOWNLOAD 6. DOWNLOAD 6.1 Download Setup Figure 6-1. Download Setup Condition. Disconnect TA to the Jig and phone have a battery ➝ Check the Battery up to two blocks more - 102 -...

  • Page 104: Download Procedure

    6. DOWNLOAD 6.2 Download Procedure (1)Select Erase. OWCD = Overwrite (2)Check! Cal Data 1. Access Flash loader program in PC & Select Erase. (3)Don t (Don Check OWCD) Check 2. Check Address & Size (Addr. : 1004000, Size : 7FC000) OWCD Press Start &...
  • Page 105 6. DOWNLOAD 5. Select Key to Choose Mot. File 6. Select Mot. File & Press Open 7. Wait until MOT. To BIF. Converting is completed (Just Check Verify. Don’t Check OWCD) - 104 -...
  • Page 106 6. DOWNLOAD Press Start & Power ON Using Jig 8. Press Start & Power on the phone Using Jig Remote Power On (Switch1) Turn on Switch 1 9. Wait until Sending Block end - 105 -...

  • Page 107: Block Diagram

    7.1 Main Board The G5200 is made up of two PCBs. In lower part of the folder, there is a main board. And in the upper part of the folder, there is a FPCB. Below you can see the block diagram of both PCBs.

  • Page 108: Fpcb

    7. BLOCK DIAGRAM 7.2 FPCB Figure 7-2. FPCB Blockdiagram. 7.3 RF Figure 7-3. RF Blockdiagram. - 107 -...
  • Page 109 7. BLOCK DIAGRAM - 108 -...

  • Page 110: Circuit Diagram

    8. CIRCUIT DIAGRAM 8. CIRCUIT DIAGRAM 8.1 Baseband Interface 2V45_VAN R105 C118 C123 (2012) VBAT 2V45_VCORE 2V8_VMEM 2V45_VCORE 2V45_VRTC C163 C126 R108 SP107 R110 C129 MIC101 100N OB-22S40-C33 C109 C110 C130 C164 100N R112 C132 (2012) 100N DATA(0:15) ACCESSORY MIC VCHARGE C116 R101...

  • Page 111: Midi

    8. CIRCUIT DIAGRAM 8.2 MIDI 2V45_VCORE 2V45_VCORE 2V45_VCORE 2V8_VMEM U201 R210 R211 R208 MAX9077 R230 HOOK_DETECT R231 JACK_DETECT R212 R209 330K 330K VOUTNORN REC- C206 Receiver Path (1608) REC+ Headset jack CN201 100nH L201 HEADSET_MIC_P R205 HFK_MIC_P R201 HEADSET_SPK_P C138 9001-8905-040 (2012) R218...

  • Page 112: Kye, I/F & Lcd Con

    8. CIRCUIT DIAGRAM 8.3 KEY, I/F & LCD CON KEYPAD S310 I/F CONNECTOR POWERKEY ON/OFF 2V8_VMEM S304 S308 SIDEKEY SIDEKEY S325 DOWN KEYROW(0:4) HKEYROW MENU HKEYCOL VBAT VCHARGE KEYROW(0) CN302 S315 S314 S313 S302 S301 R323 USC(0) R324 SOFT2 USC(1) KEYROW(1) R325 USC(2)
  • Page 113 8. CIRCUIT DIAGRAM 8.4 RF RF2.85V RF2.85V RXIP R424 C466 ANT401 100P C428 ANT_PAD_LGX L410 100N RXIN U412 AD8315 C430 C433 100N RXQP R421 RFIN VPOS R425 C465 COMM ENBL TXEN R427 2.2K 100P R423 VSET TXRAMP FLTR VAPC RXQN C438 C435 R420...

  • Page 114: Pcb Layout

    9. PCB LAYOUT 9. PCB LAYOUT - 113 -...
  • Page 115 9. PCB LAYOUT - 114 -...

  • Page 116: Engineering Mode

    10. ENGINEERING MODE 10. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.
  • Page 117 10. ENGINEERING MODE C. Backlight [1-3] This menu is to test the LCD Backlight and Keypad Backlight. • Backlight On [1-3-1] : LCD Backlight and Keypad Backlight light on at the same time. • Backlight Off [1-3-2] : LCD Backlight and Keypad Backlight light off at the same time. •...

  • Page 118: Rf Test [Menu 2]

    10. ENGINEERING MODE H. Audio [1-8] This is a menu for setting the control register of Voiceband Baseband Codec chip. Although the actual value can be written over, it returns to default value after switching off and on the phone. •...

  • Page 119: Mf Mode [Menu 3]

    10. ENGINEERING MODE 10.3 MF Mode [MENU 3] This manufacturing mode is designed to do the baseband test automatically. Selecting this menu will process the test automatically, and phone displays the previous menu after completing the test. A. All auto test [3-1] LCD, LED, Backlight, Vibrator, Buzzer, and Key Pad are tested in order for a certain time.

  • Page 120: Trace Option [Menu 4]

    10. ENGINEERING MODE 10.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 10.5 Call Timer [MENU 5] A. All calls [5-1] This displays total conversation time. User cannot reset this value. B.

  • Page 121: Stand Alone Test

    11. Stand alone Test 11. STAND ALONE TEST 11.1 Introduction This manual explains how to examine the status of RX and TX of G5200/W5200 model. A. Tx Test TX test- this is to see if the transmitter of G5200/W5200 is activating normally B.

  • Page 122: Auto Calibration

    12. Auto Calibration 12. AUTO CALIBRATION 12.1 Overview AutoCal (Auto Calibration) is the PC side calibration tool that perform Rx and Tx calibration with Agilent 8960 or other equipment. AutoCal generate calibration data by communicating with phone and measuring equipment and write it into calibration data block of flash memory in GSM phone. 12.2 Requirements •...
  • Page 123 12. Auto Calibration • Connection © Connect to phone : Connect to the phone which you want to measure. This procedure checks whether the PC is connected to “Ag8960” or not. If not connected to “Ag8960” try to connect to “Ag8960”. After that it performs sync. procedure with phone.

  • Page 124: Agc

    12. Auto Calibration 12.4 AGC This procedure is for Rx calibration. In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the result window will show correction values per every power level and gain code and the same measure is performed per every frequency.

  • Page 125: Exploded View & Replacement Part List

    13. EXPLODED VIEW & REPLACEMENT PART LIST 13. EXPLODED VIEW & REPLACEMENT PART LIST 13.1 Exploded View - 124 -...
  • Page 126 3.0 V,0.085 A,10 * 25 ,G5200 VIBRATOR SUSY00 SUSY0006201 SPEAKER ASSY ,8 ohm,86 dB,15 mm,G5200 SPEAKER SURY00 SURY0005401 RECEIVER ASSY ,99 dB,32 ohm,13 * 2.7 ,G5200 REEIVER SACY00 SACY0005501 PCB ASSY,FLEXIBLE G5200 LCD, LCD Connector(Header, Socket) MHGD00 MHGD0001001 HOLDER,LCD MAIN , 37.8X44.9...

  • Page 127: Accessories

    Service Remark SGDY00 SGDY0003003 DATA CABLE LG-510W/G510, CABLE W/O POWER BULK (DK-16G) SGEY00 SGEY0002901 EAR PHONE/EAR MIKE SET G7000, G5200 3P EAR MIC (EM-LG412GS) SGCC00 SGCC0001803 CIGARETTE LIGHT ADOPTER CLA (CLA-16G) SSAD00 SSAD0007803 ADAPTOR, AC-DC 100-240V, 50 Hz, 5.2 V, 850 mA, (RUSSIA(CIS) : TA-15GR)

  • Page 128: Replacement Part List

    Please refer to the ‘Exploded View’ SJMY00 VIBRATOR, MOTOR Please refer to the ‘Exploded View’ SUMY00 SUMY0004101 MICROPHONE FPCB , -42 dB, 6 * 1.3 , G5200 C-MIC SURY00 RECEIVER Please refer to the ‘Exploded View’ SUSY00 SPEAKER Please refer to the ‘Exploded View’...

  • Page 129: Main Pcb

    13. EXPLODED VIEW & REPLACEMENT PART LIST < Main PCB > Level Location No. Part No. Description Specification Service Remark SAFY00 PCB ASSY, MAIN Please refer to the ‘Exploded View’ C101 ECCH0000371 CAP, CERAMIC, CHIP 0.22 uF, 50V, Z, Y5V, HD, 2012, R/TP C102 ECCH0000379 CAP, CERAMIC, CHIP...
  • Page 130 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Part No. Description Specification Service Remark C169 ECCH0000120 CAP, CERAMIC, CHIP 39 pF, 50V, J, NP0, TC, 1005, R/TP C171 ECCH0000182 CAP, CERAMIC, CHIP 0.1 uF, 10V, K, X5R, HD, 1005, R/TP C201 ECCH0000122 CAP, CERAMIC, CHIP...
  • Page 131 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Part No. Description Specification Service Remark C441 ECCH0000115 CAP, CERAMIC, CHIP 22 pF, 50V, J, NP0, TC, 1005, R/TP C442 ECCH0000130 CAP, CERAMIC, CHIP 150 pF, 50V, J, SL, TC, 1005, R/TP C443 ECTZ0003801 CAP, TANTAL, CHIP, MAKER...
  • Page 132 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Part No. Description Specification Service Remark Q301 EQBN0007101 TR, BJT, NPN EMT3, 0.15 W, R/TP, LOW FREQUENCY Q302 EQBN0004801 TR, BJT, NPN SMT6, 0.2 W, R/TP, R101 ERHY0000246 RES, CHIP 2K ohm, 1/16W, J, 1005, R/TP R102 ERHY0001103...
  • Page 133 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Part No. Description Specification Service Remark R304 ERHY0000241 RES, CHIP 1K ohm, 1/16W, J, 1005, R/TP R306 ERHY0000241 RES, CHIP 1K ohm, 1/16W, J, 1005, R/TP R307 ERHY0000201 RES, CHIP 0 ohm, 1/16W, J, 1005, R/TP R309 ERHY0000241...
  • Page 134 R472 ERHY0000201 RES, CHIP 0 ohm, 1/16W, J, 1005, R/TP S304 ESCY0002501 SWITCH, TACT 12 V, 0.05 A, HORIZONTAL, 220 G, G5200 TACK S/W S308 ESCY0002501 SWITCH, TACT 12 V, 0.05 A, HORIZONTAL, 220 G, G5200 TACK S/W SW401 ENWY0001901 CONN, RF SWITCH ANGLE, SMD, 0.5 dB, H: 2.6 mm, •’1.8...
  • Page 135 MEMO - 134 -...

This manual is also suitable for:

W5200

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