LG F2400 Service Manual
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F2400 SVC cover
2005.4.27 5:35 PM
Page 1
Service Manual
F2400
P/N : MMBD0049401
Date: April, 2005 / Issue 1.0

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Table of Contents
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Summary of Contents for LG F2400

  • Page 1 F2400 SVC cover 2005.4.27 5:35 PM Page 1 Service Manual F2400 P/N : MMBD0049401 Date: April, 2005 / Issue 1.0...
  • Page 2: Table Of Contents

    Table of Contents 1. Introduction ........5 4.10 Key Backlight LED Trouble ....71 4.11 SIM Detect Trouble ......73 1.1 Purpose........... 5 4.12 Ear Jack Trouble......... 74 1.2 Regulatory Information......5 4.13 Camera Trouble ........77 1.3 Abbreviations .......... 7 4.14 RTC Trouble ........
  • Page 4: Introduction

    1. Introduction 1. Introduction 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. Introduction E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.
  • Page 6: Abbreviations

    Global System for Mobile Communications IPUI International Portable User Identity Intermediate Frequency Liquid Crystal Display Low Drop Output Light Emitting Diode LG Electronics OPLL Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop...
  • Page 7 1. Introduction Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory STMR Side Tone Masking Rating Travel Adapter Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter Voltage Controlled Oscillator VCTCXO Voltage Control Temperature Compensated Crystal Oscillator Wireless Application Protocol - 8 -...
  • Page 8: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Classification : Li-ion Capacity min 1000mAh Standard Battery Voltage : 3.7V Cell Weight : 22g Under the minimum current consumption environment Stand by Current (such as paging period 9), the level of standby current is below 4mA.
  • Page 9 2. PERFORMANCE Item Description Specification TX: 890 + n x 0.2 MHz RX: 935 + n x 0.2 MHz (n=1~124) EGSM Frequency Band TX: 890 + (n-1024) x 0.2 MHz RX: 935 + (n-1024) x 0.2 MHz (n=975~1024) TX: 1710 + (n-512) x 0.2 MHz RMS <...
  • Page 10 2. PERFORMANCE Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 600 ~ 1,200 1,200 ~ 1,800 1,800 ~ 3,000 3,000 ~ 6,000 Output RF Spectrum 6,000 (due to modulation) Offset from Carrier (kHz). Max. dBc +0.5 600 ~ 1,200 1,200 ~ 1,800 1,800 ~ 3,000...
  • Page 11 2. PERFORMANCE Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz) Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status GSM, EGSM BER (Class II) < 2.439% @-102dBm Bit Error Ratio BER (Class II) < 2.439% @-100dBm Rx Level Report Accuracy 3 dB 8 3 dB...
  • Page 12 2. PERFORMANCE Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side Tone Distortion Three stage distortion < 10% System frequency 2.5ppm (13 MHz) tolerance 32.768KHz tolerance 30ppm...
  • Page 13 2. PERFORMANCE Item Description Specification Forced shut down Voltage 3.35 0.03 V 1 Li-ion Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 830mAh Switching-mode charger Travel Charger Input: 100 ~ 240 V, 50/60Hz Out put: 5.2V, 800mA <Bluetooth Performance>...
  • Page 14: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 Transceiver (SI4205-BM, U505) The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VCTCXO part. The Aero I transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellular handsets and wireless data modems.
  • Page 15 3. TECHNICAL BRIEF (1) Receiver Part The Aero I transceiver uses a low-IF receiver architecture which allows for the on chip integration of the channel selection filters, eliminating the external RF image reject filters and the IF SAW filter required in conventional superheterodyne architectures. A.
  • Page 16 3. TECHNICAL BRIEF Figure. 3-2 SI4205 RECEIVER PART B. Intermediate frequency (IF) and Demodulation A quadrature image-reject mixer downconverts the RF signal to a 100KHz intermediate frequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 to 1989.9 MHz, and is internally divided by 2 for GSM 850 and E-GSM 900 modes.
  • Page 17 3. TECHNICAL BRIEF (2) Transmitter Part The transmit (Tx) section consists of an I/Q baseband upconverter, and offset phaselocked loop (OPLL) and two output buffers that can drive external power amplifiers (PA), one for the GSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz) and PCS 1900 (1850-1910MHz) bands.
  • Page 18 3. TECHNICAL BRIEF B. OPLL The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2 for the GSM 850 and E-GSM 900 bands.
  • Page 19 3. TECHNICAL BRIEF (3) Frequency Synthesizer Figure. 3-4 SI4205 FREQUENCY SYNTHESIZER PART The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode.
  • Page 20: Power Amplifier Module (Sky77325, U501)

    3. TECHNICAL BRIEF 3.2 Power Amplifier Module (SKY77325, U501) The SKY77325 is a high-power, high-efficiency power amplifier module with integrated power control. The device is self-contained with 50Ω input and output terminals. The power control function is also incorporated, eliminating the need for directional couplers, detector diodes, power control ASICs and other power control circuitry;...
  • Page 21: 26 Mhz Clock (Vctcxo, X502)

    3. TECHNICAL BRIEF 3.3 26 MHz Clock (VCTCXO, X502) The 26 MHz clock(X502) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 26 MHz. It is used within the Si4205, analog base band chipset (U101, AD6537), digital base band chipset (U102, AD6527), and MIDI (U203) chipset. Figure 3-6 VCTCXO CIRCUIT DIAGRAM 3.4 Power Supplies for RF Circuits (RF LDO, U503) Two regulators are used for RF circuits.
  • Page 22: Bluetooth Section Description (M601)

    3. TECHNICAL BRIEF 3.5 Bluetooth Section Description (M601) Figure. 3-5 Functional Block Diagram 1.General description ARM-450-2CSP(M601) is a Bluetooth module. The Bluetooth system consists of a radio section and a baseband link control section. It consists of Bluetooth Transceiver chip, a EEPROM, a X-tal, a Balun and a band pass filter.
  • Page 23 3. TECHNICAL BRIEF 1. General description ABM-450-2CSP(M601) : bluetooth module NLAS4717FCT1(U610) : Analog switch for control signal switching. BH28FB1WHFV(U611) : provide power for bluetooth clock. TC7SH08FS(U602) : PCM Sync Clock rate converter for bluetooth clock. (to 8kHz) 2. Specification Bluetooth V1.1 or 1.2Compliant Transmit Power + 4dBm(Class2) 1.8V to 3.6V I/O Operation...
  • Page 24: Main Processor Baseband Block Diagram

    3. TECHNICAL BRIEF 3.6 Main Processor Baseband Block Diagram The F2400 Phone is made up of one PCB. In part of the keypad and LCD display, there is a main PCB. Figure 1: MAIN PCB BLOCK DIAGRAM Ear Jack Camera...
  • Page 25 3. TECHNICAL BRIEF 3.6.1 Logic Explanation AD6527 Figure 3: TOP LEVEL BLOCK DIAGRAM OF THE AD6527 INTERNAL ARCHITECTURE AD6537 1) BUS Arbitration Subsystem i. It is to work as a cross point for data accesses between the three main busses ii.
  • Page 26 3. TECHNICAL BRIEF DSP subsystem It consists of ADI DSP, Viterbi coprocessor, Ciphering unit and a cache memory/controller system The DSP can run at a maximum clock frequency of 91MHz at 1.8V The Viterbi and ciphering accelerators enable a very efficient implementation of the channel equalization, encryption and decryption tasks MCU subsystem It consists of an ARM7TDMI central processing unit, a boot ROM, a clock generation and access control module.
  • Page 27 3. TECHNICAL BRIEF Figure 4: SYSTEM INTERCONNECTION OF AD6527/6527B EXTERNAL INTERFACE - 28 -...
  • Page 28 The AD6527 check status periodically in call mode if SIM card is inserted or not. Interface by SIM_DATA, SIM_CLK, SIM_RST SIM_DATA: This pin receives and sends data to SIM card. F2400 support only 3.0 volt interface SIM card. SIM_CLK: clock 3.5MHz frequency.
  • Page 29 3. TECHNICAL BRIEF AD6537B Figure 5: AD6537B FUNCTION BLOCK DIAGRAM - 30 -...
  • Page 30 3. TECHNICAL BRIEF 1) Baseband Transmit section i. The AD6537B Baseband Transmit Section is designed to support GMSK for both single-slot and multislot applications. ii. The 6537B includes a digital GMSK modulator which is used for GSM Applications. The transmit channel consists of a iii.
  • Page 31 3. TECHNICAL BRIEF 3) Auxiliary section i. This section includes an Automatic Frequency Control(AFC) DAC, voltage reference buffers, an Auxiliary ADC, and light controllers. ii. This section also contains AUX ADC and Voltage Reference • AFC DAC: 13 bits • The Auxiliary ADC provides : - two differential inputs for temperature sensing.
  • Page 32 3. TECHNICAL BRIEF 4) Voiceband section i. Receive audio signal from microphone. F2400 use differential configuration. ii. Send audio signal to speaker. F2400 use differential configuration. iii. This section provides an audio codec with a digital-to-analog converter and an analog-to-digital converter, a ring tone volume controller, a microphone interface, and multiple analog input and output channels.
  • Page 33 3. TECHNICAL BRIEF 5) Power Management Figure 10 : AD6537B POWER MANAGEMENT SECTION 1 1 Power up sequence logic The AD6537B controls power on sequence Power on sequence - If a battery is inserted, the battery powers the 8 LDOs. - Then if PWRONKEY is detected, the LDOs output turn on.
  • Page 34 3. TECHNICAL BRIEF Figure 11 : AD6537B POWER MODE LOGIC 1 1 LDO block There are 8LDOs in the AD6537B. - VCORE : supplies Digital Baseband Processor core and AD6537 digital core (1.8V, 80mA) - VMEM : supplies external memory and the interface to the external memory on the digital baseband processor (1,8V or 2.8V, 150mA) - VEXT : supplies Radio digital interface and high voltage interface (2.8V, 170mA) - VSIM : supplies the SIM interface circuitry on the digital processor and SIM card (1.8V or 2.85V,...
  • Page 35 3. TECHNICAL BRIEF 1 1 Battery Charging block i. It can be used to charge Lithium Ion batteries. Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware. ii. Charging Process - Check charger is inserted or not - Exception: When battery voltage is lower than 3.2V, the precharge(low current charge mode) starts firstly.
  • Page 36: Memory

    3. TECHNICAL BRIEF 3.7 Memory Figure 13 : 128+64 MEMORY CIRCUIT DIAGRAM 1) 256Mb Flash Memory + 64Mb PSRAM Intel Memory 2) 16 Bit Parallel Data Bus 3) ADD01 – ADD23 4) RF Calibration Data stored in Flash - 37 -...
  • Page 37: Lcd Module

    3. TECHNICAL BRIEF 3.8 LCD Module Figure 14 : LCD CIRCUIT DIAGRAM 1) Dual LCD : Main -128 x 160 Dots, 65k Color TFT-LCD Sub – 96 x 96 65k OLED 2) White Backlight LED : 2EA 3) Backlight LED Driver : AAT2805(ANALOGIC Tech.) 4) LCD Bias Voltage : 2V8_VEXT from AD6537B(ANALOG DEVICE) - 38 -...
  • Page 38: Audio Section

    3. TECHNICAL BRIEF 3.9 AUDIO SECTION Figure 15 : AUDIO CIRCUIT DIAGRAM 1) MIC and Receiver operate at the differential mode by using AIN1P/N and AOUT1P/N in AD6537B. 2) MIC Bias Voltage : 2.5 VMIC from AD6537B 3) Earphone has a single-ended mode by using the AIN2P, AOUT3P. - 39 -...
  • Page 39 3. TECHNICAL BRIEF Figure 16 : AUDIO LOGIC IN AD6537B - 40 -...
  • Page 40: Midi Section

    3. TECHNICAL BRIEF 3.10 MIDI Figure 17 : MIDI CIRCUIT DIAGRAM 1) Speaker Output : Balanced Mode by SPOUT1 and SPOUT2 in YMU762 Chip. 2) MIDI Chip Interface : • Controlled by _MIDI_CS, _MIDI_RST, _MIDI_IRQ, _WR, _RD, DATA [08...15] ports •...
  • Page 41: Battery Charging Block

    3. TECHNICAL BRIEF 3.11 Battery Charging Block Figure 18 : CIRCUIT FOR BATTERY CHARGING AT AD6537B A. VCHARGE : Voltage Source supplied from TA which is connected to I/O Connecter. B. ISENSE : Decide the time to stop the charging and the charging current value by measuring this value.
  • Page 42: Camera Section

    3. TECHNICAL BRIEF 3.12 Camera Figure 18 : CIRCUIT FOR BATTERY CHARGING AT AD6537B A. Camera Interface : Allows you to use the built-in camera to take photos with the phone. The phone encodes up to 640 x 480 size with free size support. B.
  • Page 43: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RX Trouble Test Points Figure 4-1 Checking Flow - 44 -...
  • Page 44 4. TROUBLE SHOOTING (1) Checking Regulator Circuit Test Points Figure 4-2 Circuit Diagram Checking Flow - 45 -...
  • Page 45 4. TROUBLE SHOOTING (2) Checking VCTCXO Circuit Test Points Checking Flow Figure 4-3 Circuit Diagram Waveform Graph 4-1(a) Graph 4-1(b) - 46 -...
  • Page 46 4. TROUBLE SHOOTING (4) Checking Ant SW & Mobile SW Test Points Figure 4-5 Circuit Diagram Waveform ANT SW Control GSM& DCS RX Mode Graph 4-3 ANT_SW1 ANT_SW2 GSM_TX HIGH DCS_TX HIGH Table 4-2 - 47 -...
  • Page 47 4. TROUBLE SHOOTING Checking Flow - 48 -...
  • Page 48 4. TROUBLE SHOOTING (5) Checking SAW Filter Circuit Test Points Circuit Diagram Checking Flow - 49 -...
  • Page 49 4. TROUBLE SHOOTING (6) Checking RX IQ Test Points Circuit Diagram Waveform Checking Flow - 50 -...
  • Page 50: Tx Trouble

    4. TROUBLE SHOOTING 4.2 TX Trouble Test Points Checking Flow - 51 -...
  • Page 51 4. TROUBLE SHOOTING (1) Checking Regulator Circuit Test Points U503. 5 U503. 3 Figure 4-9 Circuit Diagram Checking Flow Check Pin 5. Check Pin 5. RF 2.85VO.K? Pin 6.High ? Changing the Board Regulator Circuit is OK Replace U503 See next Page to check VCTCXO - 52 -...
  • Page 52 4. TROUBLE SHOOTING (2) Checking VCTCXO Circuit Test Points Checking Flow Circuit Diagram Waveform - 53 -...
  • Page 53 4. TROUBLE SHOOTING (3) Checking Ant SW & Mobile SW Test Points SW500. RF SW500. ANT U504.5 U504.3 C642 (VC1) C639 (VC2) Figure 4 -11 Circuit Diagram Checking Flow Graph 4 -6(a) Graph 4 -6(a) Graph 4 -6(b) Graph 4 -6(b) - 54 -...
  • Page 54 4. TROUBLE SHOOTING (3) Checking Ant SW & Mobile SW - 55 -...
  • Page 55 4. TROUBLE SHOOTING (4) Checking PAM Control Signal Test Points Circuit Diagram PA_EN (R502) TX_RAMP (R509) Waveform Graph 4 -7 Checking Flow Check TX_RAMP and PA_EN Check TX_RAMP and PA_EN Check if there is Check if there is Any Major Difference or not Any Major Difference or not Download S/W Download S/W...
  • Page 56 4. TROUBLE SHOOTING (5) Checking TX IQ Test Points Waveform Circuit Diagram Checking Flow - 57 -...
  • Page 57: Power On Trouble

    4. TROUBLE SHOOTING 4.3 Power On Trouble - 58 -...
  • Page 58 4. TROUBLE SHOOTING R399 C126 C124 U101 D101 C101 R112 C119 - 59 -...
  • Page 59: Charging Trouble

    4. TROUBLE SHOOTING 4.4 Charging Trouble Q101 R120 D102 CN202. 4,5 PIN - 60 -...
  • Page 60 4. TROUBLE SHOOTING - 61 -...
  • Page 61: Lcd Trouble

    4. TROUBLE SHOOTING 4.5 LCD Trouble C417 U402 CN601.9,23 PIN C401 - 62 -...
  • Page 62 4. TROUBLE SHOOTING - 63 -...
  • Page 63: Receiver Trouble

    4. TROUBLE SHOOTING 4.6 Receiver Trouble R105 R104 - 64 -...
  • Page 64: Speaker Trouble

    4. TROUBLE SHOOTING 4.7 Speaker Trouble R213 R214 U204 C215 C216 C217 U203 R218 R219 - 65 -...
  • Page 65 4. TROUBLE SHOOTING C211 C219 C217, C216 C217, C216 - 66 -...
  • Page 66: Mic Trouble

    4. TROUBLE SHOOTING 4.8 MIC Trouble C108 R235 C226 R234 R232 R231 C225 C223 - 67 -...
  • Page 67 4. TROUBLE SHOOTING - 68 -...
  • Page 68: Vibrator Trouble

    4. TROUBLE SHOOTING 4.9 Vibrator Trouble Q402 R1100 R1101 D202.1 - 69 -...
  • Page 69 4. TROUBLE SHOOTING - 70 -...
  • Page 70: Key Backlight Led Trouble

    4. TROUBLE SHOOTING 4.10 Key Backlight LED Trouble - 71 -...
  • Page 71 4. TROUBLE SHOOTING - 72 -...
  • Page 72: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.11 SIM Detect Trouble - 73 -...
  • Page 73: Ear Jack Trouble

    4. TROUBLE SHOOTING 4.12 Ear Jack Trouble U201 C201 R201 R207 R208 J201 R209 - 74 -...
  • Page 74 4. TROUBLE SHOOTING - 75 -...
  • Page 75 4. TROUBLE SHOOTING - 76 -...
  • Page 76: Camera Trouble

    4. TROUBLE SHOOTING 4.13 Camera Trouble 2V85_VCAM CAMERA CTL IC 2V8_C_PWR 2V85_VCAM Q400 SI1305 2V85_VCAM VDDS C630 C403 L_RESET_N C622 C627 C623 L_DATA00 L_DA0 VDDL 0.1u 0.01u L_DATA01 L_DA1 L_DATA02 L_DA2 VDDI1 L_DATA03 L_DA3 VDDI2 L_DATA04 L_DA4 L_DATA05 L_DA5 VDDC1 C641 C888 L_DATA06...
  • Page 77 4. TROUBLE SHOOTING Switch f or Camera Camera Sensor Camera Chip Sensor Pow er(Q400) Connector (CN3) (U613) Pin11 Pin3 Pin10 Pow er IC for Camera (U612) • CAMERA Operation - U404(Camera Chip) is controlled by DBB. - The Power is supplied to U400(2.85V). •...
  • Page 78 4. TROUBLE SHOOTING - 79 -...
  • Page 79: Rtc Trouble

    4. TROUBLE SHOOTING 4.14 RTC Trouble X101 R113 - 80 -...
  • Page 80: Indicated Led Trouble

    4. TROUBLE SHOOTING 4.15 Indicated LED Trouble C297 R296 U210 Charge Indicator C298 VBAT R298 R299 C299 LD201 SML-521MUWT86 VCHARGE VBAT R297 U210 NLAST4599DFT2 INDLED_R COM 5 INDLED_G 4 NC R296 C298 C297 0.1u 2.7K 0.1u RPWRON - 81 -...
  • Page 81: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.16 Folder on/off Trouble C411 R1107 C412 FLIP SWITCH 2V8_VEXT R1107 FLIP OUTPUT C411 GND2 C412 PGND GND1 0.01u U403 A3212EEH - 82 -...
  • Page 82 4. TROUBLE SHOOTING - 83 -...
  • Page 83: Bluetooth Trouble

    4. TROUBLE SHOOTING 4.17 Bluetooth Trouble Test Point R660 R652 R653 R673 R659 C674 M601 R650 C671 ANT1 Figure 4-34 Circuit Diagram - 84 -...
  • Page 84 5. DOWNLOAD AND CALIBRATION Bluetooth Power on BLUE_ Is BLUE_RST signal shape similar Replace U102 to Fig 1 during powering on Bluetooth? BT_EN at Replace U102 2V8_VBT at C674=2.8V? 2V8_VBT at C671=2.8V? R660=2.8V? Check 2V8_VBT Replace (U611) PCB pattern Figure 1. Blue_RST Figur 4 -32 Blue RST Bluetooth Power off...
  • Page 85: Download And Calibration

    5. DOWNLOAD AND CALIBRATION 5. DOWNLOAD AND CALIBRATION 5.1 Download A. Download Setup Figure 6-1 describes Download setup. Figure 5-1. Download Setup - 86 -...
  • Page 86 5. DOWNLOAD AND CALIBRATION B. Download Procedure 1. Access Flash loader program in PC and select Erase.(Don’t check OWCD) 1. Select Erase 2. Check FFE000 3. Don' t Check OWCD 2. Press Start and Wait until Erase is completed.(Code øµø™erase) 1.
  • Page 87 5. DOWNLOAD AND CALIBRATION 3. Press Write to start Download and press Key to choose software (AlchemyData.mot) 1. Change Address and Size 2. Don’t Check 3. Press Start and OWCD Wait 4. Choose software 1. Press 2. Press - 88 -...
  • Page 88 5. DOWNLOAD AND CALIBRATION 5. Wait until converting from MOT to BIF is completed(Don’t check OWCD) 2. Wait until completion 1. Don’t Check OWCD 6. Press Start and Power on the phone using JIG remote Power on(Switch 1) - 89 -...
  • Page 89 5. DOWNLOAD AND CALIBRATION 7. Wait until Sending Block is completed 8. Press Write to start Download and press Key to choose software(CodeData.mot) - 90 -...
  • Page 90 5. DOWNLOAD AND CALIBRATION 9. Choose software 10. Wait until Sending Block is completed 1. Wait Until Sending Block is completed - 91 -...
  • Page 91: Calibration

    5. DOWNLOAD AND CALIBRATION 5.2 Calibration A. Equipment List Table 5-1. Calibration Equipment List Equipment for Calibration Type / Model Brand Wireless Communication Test Set HP-8960 Agilent RS-232 Cable and Test JIG RF Cable Power Supply HP-66311B Agilent GPIB interface card HP-GPIB Agilent Calibration &...
  • Page 92 5. DOWNLOAD AND CALIBRATION Figure 5-3. The top view of Test JIG C. Test Jig Operation Table 5-2. Calibration Equipment List Power Source Description Power Supply usually 4.0V Travel Adaptor Use TA, name is TA-20G(24pin) Table 5-3. Calibration Equipment List Switch Number Name Description...
  • Page 93 5. DOWNLOAD AND CALIBRATION Table 5-4. Calibration Equipment List LED Number Name Description LED 1 Power Power is provided for Test Jig. LED 2 Indicate charging state of the phone battery LED 3 UART Indicate data transfer state through the UART port LED 4 Indicate data transfer state through the MON port 1.
  • Page 94: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM The Block Diagram of the Baseband Part - 95 -...
  • Page 95 Note - 96 -...
  • Page 96: Circuit Diagram

    USC3 USB BOOT INT CLOCK KEY_COL2 KEYPADCOL2 USC4 USC4 NAME Approved USB BOOT EXT CLOCK KEY_COL3 KEYPADCOL3 USC5 USC5 KEY_COL4 KEYPADCOL4 USC6 USC6 DRAWING Iss. Notice No. Date Name Ver.1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 97 -...
  • Page 97 R225 C219 SPVSS R244 R212 16POLY 40POLY Section Sign & Name Date Sheet/Sheets MODEL F2400 Designer Checked DRAWING AUDIO / PreCharge NAME Approved DRAWING Iss. Notice No. Date Name Ver.1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 98 -...
  • Page 98 VSS2 _ADV _ADV MEMORY, MMI, I/O VSS3 NAME VSS4 _OE1 Approved KIM N.S VSS5 _OE2 VSS6 _RST _RESET VSS7 WAIT _WAIT VSS8 BURSTCLK DRAWING Iss. Notice No. Date Name Ver.1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 99 -...
  • Page 99 PGND GND1 0.01u Section Date Sign & Name Sheet/ U403 A3212EEH F2400 Sheets MODEL Designer Checked DRAWING CAMERA IC/ CHARGE PUMP NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. Ver.1.0 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 100 -...
  • Page 100 (1608) S_CLK (GPO_21) R1108 S_DATA (GPO_20) C654 C653 C652 C651 Section Date Sign & Name Sheet/Sheets F2400 MODEL Designer Checked DRAWING NAME Approved DRAWING Iss. Notice No. Date Name Ver.1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 101 -...
  • Page 101 MLED2 MLED3 CN600 MOTOR C656 VA603 capacitor Section Date Sign & Name Sheet/ MODEL Sheets F2400 Designer Checked DRAWING LCD CONNECTOR NAME Approved DRAWING Iss. Notice No. Date Name Ver.1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 102 -...
  • Page 102: Pcb Layout

    8. PCB LAYOUT - 103 -...
  • Page 103 8. PCB LAYOUT - 104 -...
  • Page 104: Engineering Mode

    9. ENGINEERING MODE 9. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945#*#.Pressing END will switch back to non –...
  • Page 105 9. ENGINEERING MODE E. ADC (Analog to Digital Converter) [1-5] This displays the value of each ADC. • MVBAT ADC (Main Voltage Battery ADC) [1-5-1] • AUX ADC (Auxiliary ADC) [1-5-2] • TEMPER ADC (Temperature ADC) [1-5-3] F. BATTERY [1-6] •...
  • Page 106: Rf Test [Menu 2]

    9. ENGINEERING MODE 9.2 RF Test [MENU 2] Radio Frequency Test A. SAR Test [2-1] This menu is to test the Specific Absorption Rate. • SAR Test On [2-1-1] : Phone continuously process TX only. Call – setup equipment is not required. •...
  • Page 107: Trace Option [Menu 4]

    9. ENGINEERING MODE H. Camera [3-8] Camera preview mode is activated 9.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 9.5 Call Timer [MENU 5] A. All calls [5-1] This displays total conversation time. User cannot reset this value. B.
  • Page 108: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW - 109 -...
  • Page 110: Replacement Parts

    Description Part Number Specification Color Remark GSM(FOLDER) TGFF0051702 Titan Silver AAAY00 ADDITION AAAY0066001 Titan Silver MCJA00 COVER,BATTERY MCJA0011806 F2400 ORGTS Titan Silver APEY PHONE APEY0186702 Titan Silver ACAZ00 CAP ASSY ACAZ0002106 REAR_LEFT(F2400 ORGTS) Titan Silver MCCH00 CAP,SCREW MCCH0034706 REAR_LEFT(F2400 ORGSV)
  • Page 111 LABEL,BARCODE MLAC0003401 EZ LOOKS(user for mechanical) MPBZ00 MPBZ0081201 F2300 EUAAS(CAMERA CNT, FOLDER) Black MPBZ01 MPBZ0081202 F2300 EUAAS(LCD CNT, FOLDER)) Black MPBZ02 MPBZ0083601 F2400 ORGTS(LCD LEFT) Black MPBZ03 MPBZ0083602 F2400 ORGTS(LCD RIGHT) Black MTAB00 TAPE,PROTECTION MTAB0051001 MAIN WINDOW MTAB01 TAPE,PROTECTION MTAB0051101...
  • Page 112: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark SACY00 PCB ASSY,FLEXIBLE SACY0026001 PCB ASSY, SACB00 SACB0017701 FLEXIBLE,INSERT SACE00...
  • Page 113 CAMERA SVCY0003901 CMOS ,VGA ,7.8*8.0*5.2 Main:1.77"(128*160) TFT Sub:1.17"(96*96) 65K OLED SVNM00 LCD MODULE SVLM0010301 ,34.5*46.4*5.15(Typ.) ,Compact Size,Toppoly LTPS LCD ACGM00 COVER ASSY,REAR ACGM0048001 F2400 ORGTS Titan Silver MCJL00 COVER,GUIDE MCJL0001006 F2400 ORGTS Titan Silver MCJN00 COVER,REAR MCJN0028006 F2400 ORGTS Titan Silver...
  • Page 114 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C106 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C107 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C108 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP C109 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C110 CAP,CERAMIC,CHIP ECCH0000120...
  • Page 115 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C203 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C206 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C207 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C208 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C209 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 116 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C379 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C400 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C401 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C402 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C403 CAP,CERAMIC,CHIP ECCH0000155...
  • Page 117 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C599 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C600 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C602 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C603 CAP,CERAMIC,CHIP ECCH0000117...
  • Page 118 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C906 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C907 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C910 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C998 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C999 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP CN202 CONNECTOR,I/O ENRY0002202...
  • Page 119 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark 2.9*1.9*0.8(t) ,0.7 W,20 V,-6.0 A,R/TP ,NDC652P Q101 TR,FET,P-CHANNEL EQFP0004201 upgrade(substitution) item Q201 TR,BJT,ARRAY EQBA0000406 SC-70 ,0.2 W,R/TP ,CDMA,Common use Q400 TR,FET,P-CHANNEL EQFP0004501 SOT-323 ,0.29 W,1.8 V,0.86 A,R/TP ,P-Chanel MOSFET Q402 TR,BJT,NPN EQBN0007101...
  • Page 120 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R204 RES,CHIP ERHY0000291 330K ohm,1/16W,J,1005,R/TP R205 RES,CHIP ERHY0000265 20K ohm,1/16W,J,1005,R/TP R206 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R207 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R208 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP R209 RES,CHIP ERHY0000265...
  • Page 121 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R310 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R311 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R312 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R313 RES,CHIP ERHY0000230 330 ohm,1/16W,J,1005,R/TP R315 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R346 RES,CHIP ERHY0000265...
  • Page 122 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R658 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R659 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R660 RES,CHIP ERHY0000230 330 ohm,1/16W,J,1005,R/TP R888 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP SW500 CONN,RF SWITCH ENWY0002201 ANGLE ,SMD ,0.8 dB, 148-TERMINAL BGA ,148 PIN,R/TP ,GSM ANALOG U101 EUSY0169301...
  • Page 123 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C299 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C350 VARISTOR SEVY0000702 14 V,10% ,SMD , C411 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP C412 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP FL301 FILTER,EMI/POWER...
  • Page 124 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R384 RES,CHIP ERHY0000230 330 ohm,1/16W,J,1005,R/TP LEADLESS CHIP ,6 PIN,R/TP ,HALL-EFFECT SWITCH IC / U403 EUSY0129502 2.0*3.0*0.8 SPFY00 PCB,MAIN SPFY0099001 FR-4 ,1 mm,STAGGERED-8 , SNGF00 ANTENNA,GSM,FIXED SNGF0005002 3.0 ,-2.0 dBd,Gray ,EGSM + DCS Intenna, Adv.
  • Page 125: Accessory

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark MHBY00 HANDSTRAP MHBY0002101 T5100 RUSSV Square Coupling, Cow Leather Metalic Silver 3.7 V,1000 mAh,1 CELL,PRISMATIC ,GS-9(L1500) EUAOR SBPL00...

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