5-3. PRINTED WIRING BOARD – EGH BOARD (SIDE B) –
EGH BOARD
D-NE20/NE20LS
:Uses unleaded solder.
(SIDE B)
IC604
1
3
R624
C631
R625
R616
C617
15
15
IC401
*
*
CSP
(Chip Size Package)
5
4
• Semiconductor
Location
Ref. No.
D401
D405
IC401
IC402
IC604
Q401
Q402
Q403
Q404
Q405
Q406
Q602
D-NE20/NE20LS
11
1-863-862- (11)
Location
C-8
A-8
C-9
C-8
B-3
D-8
C-6
D-7
B-8
B-8
B-7
C-6