HCD-GT111/GT222/GT444/GT555
1.
2.
..................................................................
3.
3-6. Back Panel ...................................................................... 12
3-7. MAIN Board ................................................................... 12
3-10. Base Unit ......................................................................... 14
4.
............................................................ 16
5.
6.
7.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of soldering iron around 270 °C during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
2
TABLE OF CONTENTS
.............................................
...................... 20
........................ 21
3
7
9
8.
8-1. Case Section .................................................................... 63
9.
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE
THESE
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
.............................. 73
This appliance is
classified as a CLASS 1
LASER product. This
marking is located on the
rear exterior.
COMPONENTS
WITH
SONY
PARTS