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HCD-GT22/GT44/GT55
Q Q
3 7 6 3 1 5 1 5 0
T E
L
1 3 9 4 2 2 9 6 5 1 3
w w w
HCD-GT22/GT44/GT55
7-11. PRINTED WIRING BOARD – TC Board –
• Semiconductor
Location
Ref. No. Location
D301
B-1
D401
B-3
IC301
B-1
IC401
B-3
A
Q301
C-1
Q302
C-2
Q303
C-2
Q304
C-2
Q305
C-3
Q306
C-3
Q401
C-3
Q402
C-2
Q403
C-2
Q404
B-3
Q405
B-3
Q406
B-3
Q407
C-1
Q408
A-4
Q409
A-3
Q410
B-3
Q453
B-4
B
Q454
B-4
Q455
B-4
C
x
a o
y
.
i
http://www.xiaoyu163.com
8
• See page 27 for Circuit Boards Location.
1
2
(Page 37)
MAIN BOARD
J
CN202
TC BOARD
10
2
1
11
CN008
R405
R487
C401
R441
R406
C402
C351
JW310
R424
D301
R324
C412
R319
R323
C327
R320
C433
C353
R428
C352
Q
Q
C318
3
7
6
3
JR304
JR320
W302
C354
R310
JR315
JR319
JR310
JR308
R309
D
D
Q403
G S
G S
Q301 Q302
R301
1
3
C356
C301
C302
R322
CN301
R321
HP1
(PB HEAD)
(DECK-A)
u 1 6 3
.
34
34
http://www.xiaoyu163.com
2
4
9
9
8
: Uses unleaded solder.
3
LP302
R482
E
R350
R442
R483
R349
R451
E
IC401
R452
R408
R407
D401
C406
C405
C414
R455
C413
C418
Q455
C417
E
R412
R414
R411
R429
R413
Q405
R427
C430
JW308
JR305
JR301
JR302
R430
R432 R431
R450
1
5
1
5
0
8
9
2
4
JW303
R433
Q402
T001
E
B
W301
JW312
B E
R307
R435
R462
JR307
R461
JW319
R464
R463
JW320
C462
JW317
HRPE1
REC/PB/
ERASE HEAD
(DECK-B)
m
c o
2
9
9
4
R486
R481
JR313
JW307
B
R453
C453
C454
R457
C452
9
8
2
9
9
R458
R456
LP301
11
JW315
(11)
1-872-797-
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