HP Disk Carrier Blade for bh3710 Manual
Site preparation guide
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Summary of Contents for HP Disk Carrier Blade for bh3710
- Page 1 Carrier Grade Blade Server bh3710 Site Preparation Guide Edition 2.0 Manufacturing Part Number: bh3710_SitePrep July 2002 U.S.A. © Copyright 2002-2004 Hewlett-Packard Development Company, L.P..
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Page 2: Audience Assumptions
Hewlett-Packard shall not be liable for errors contained herein or for incidental or consequential damages in connection with the furnishing, performance, or use of this material. Hewlett-Packard assumes no responsibility for the use or reliability of its software on equipment that is not furnished by Hewlett-Packard. -
Page 3: Table Of Contents
Contents 1. HP Carrier Grade Blade Server bh3710 Overview Introduction ............... . . 7 Site Preparation Guide Contents. - Page 4 Contents Cooling Requirements ............. . 32 Humidity Level .
- Page 5 Figures Figure 1-1. Blade Server Front View ..........8 Figure 1-2.
- Page 6 Figures...
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Page 7: Hp Carrier Grade Blade Server Bh3710 Overview
HP Carrier Grade Blade Server bh3710 Overview Introduction HP Carrier Grade Blade Server bh3710 Overview Introduction HP Carrier Grade Blade Server bh3710 provides customers with a single chassis that will accommodate 10 full size Compact PCI (CPCI) standard blades (6U x 160mm) (called Server Blades) in the front slots and 10 half size CPCI blades (6U x 80mm) called Rear Transition Module (RTM) Server Blades, in the rear slots. -
Page 8: Front View
HP Carrier Grade Blade Server bh3710 Overview Front View Front View The components available at the front of this 6 EIA unit high (6U) server are: • Ten individual Compact PCI slots supporting defined configurations for 1-slot and 2-slot PCAs •... -
Page 9: Rear View
HP Carrier Grade Blade Server bh3710 Overview Rear View Rear View The components available at the rear of this 6 EIA unit high (6U) server are: • Two hot swap N+1 inlet modules • 10 individual Compact PCI slots supporting defined configurations for blades Figure 1-2 Blade Server Rear View Chapter 1... -
Page 10: Air Flow
HP Carrier Grade Blade Server bh3710 Overview Air Flow Air Flow Blade Server The Blade Server utilizes a right-side front to left side back cooling scheme. Six fans integrated on a vertical tray cool the system. Refer to Appendix A for System Specifications. Air enters the vent along the right front and side surface of the chassis and passes through the front and rear card cage, then travels out through the left rear and side surface. -
Page 11: Power Supply
HP Carrier Grade Blade Server bh3710 Overview Air Flow Power Supply Each power supply contains cooling fans. Cool air flows through each power supply from front to back. Because they are separated by the solid bottom of the card cage, power supply air and blade server air do not mix. -
Page 12: System Backplane
HP Carrier Grade Blade Server bh3710 Overview System Backplane System Backplane The passive system backplane is located in the Blade Server to accommodate front and rear blades. Ten Compact PCI slots are located on each side. Figure 1-5 Blade Server Backplane, rear view Figure 1-6 Blade Server Backplane, front view DC Power Supplies... - Page 13 HP Carrier Grade Blade Server bh3710 Overview DC Power Supplies Both modules reside in the lower bay of the chassis. They are accessed from both the front and rear of the chassis as illustrated in Figure 1-7 and Figure 1-8. Each power supply has two visible LEDs that display operating conditions: •...
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Page 14: Figure 1-7 Hp Blade Server Dc Power Inlet Module (Rear View)
HP Carrier Grade Blade Server bh3710 Overview DC Power Supplies • A yellow LED illuminates whenever the power supply is in a fault condition. Figure 1-7 HP Blade Server DC Power Inlet Module (rear view) Chapter 1... -
Page 15: Figure 1-8 Hp Blade Server Dc Power Supply (Front View)
HP Carrier Grade Blade Server bh3710 Overview DC Power Supplies Figure 1-8 HP Blade Server DC Power Supply (front view) Chapter 1... -
Page 16: Bp2200 Server Blade
HP Carrier Grade Blade Server bh3710 Overview bp2200 Server Blade bp2200 Server Blade The Blade Server contains one bp2200 server blade that comes factory installed and is pre-configured with HP-UX. The bp2200 server blade is double-wide and resides in slots 1 and 2. A label matches the blade to the chassis slot with the logo shown in the figure below. -
Page 17: Installing Optional Fibre Channel (Fc) Disk Carriers
HP Carrier Grade Blade Server bh3710 Overview Installing Optional Fibre Channel (FC) Disk Carriers Installing Optional Fibre Channel (FC) Disk Carriers Additional storage capacity for server blades can be added using the FC disk carrier with one or two additional drives installed. The carrier and drives utilize two slots and can be installed in slots 3/4, 5/6, and 7/8. -
Page 18: Figure 1-13 Cooling Air Flow
HP Carrier Grade Blade Server bh3710 Overview Fan Assemblies The two systems are separate and do not provide cooling for each other. See figure below for airflow information. Figure 1-13 Cooling Air Flow Cooling Fan Airflow (out) PS Airflow (out) PS Airflow (in) Cooling Fan Airflow (in) Chapter 1... -
Page 19: Server Blade Fan Tray
HP Carrier Grade Blade Server bh3710 Overview Server Blade Fan Tray Server Blade Fan Tray The Server Blade Fan Tray is a single unit located in a vertical housing on the right side of the Blade Server front. The Tray must be removed and replaced within 20 seconds to keep the system from shutting down. Fans in the Tray are not individually replaceable. -
Page 20: Power Supply Fans
HP Carrier Grade Blade Server bh3710 Overview Power Supply Fans Power Supply Fans Power Supply Fans are integral to the power supply and can only be changed by removing and replacing the power supply. Figure 1-15 Power Supply Fans Power Supply Cooling Fans Slot Blockers Any slot that is not occupied by a blade must contain a slot blocker to channel cool air in the proper direction and to maintain the cooling system pressure. -
Page 21: Blade Server Racking Information
HP Carrier Grade Blade Server bh3710 Overview Blade Server Racking Information Blade Server Racking Information The racking kit enables the installation of the bh3710 chassis into a rack. Rack kit installation documentation is shipped with each server inside the rack kit box. Racking information may also be found at the Web site at: http://www.hp.com/racksolutions Chapter 1... - Page 22 HP Carrier Grade Blade Server bh3710 Overview Blade Server Racking Information Chapter 1...
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Page 23: General System And Facility Guidelines
General System and Facility Guidelines This chapter provides general computer facility guidelines for planning and preparing the site. Careful site planning and preparation ensures trouble-free installation and reliable operation of HP Blade Servers. Factors that may contribute to less than optimal equipment operation are also highlighted. Refer to Appendix A-3 for more information on guidelines specific to the Blade Server. -
Page 24: Electrical Load Requirements (Circuit Breaker Sizing)
General System and Facility Guidelines Electrical Load Requirements (Circuit Breaker Sizing) Electrical Load Requirements (Circuit Breaker Sizing) Appendix A summarizes electrical power load (KVA input) requirements for this HP server but additional capacity should be added for equipment upgrading or expansion. It is good practice to derate power distribution systems for one or more of the following reasons: •... -
Page 25: Distribution Hardware
General System and Facility Guidelines Distribution Hardware Precautions have been taken during power distribution system design to provide immunity to power outages of less than one cycle. However, testing cannot conclusively rule out loss of service. Therefore, adherence to the following guidelines provides the best possible performance of power distribution systems for HP server equipment: •... -
Page 26: Grounding Systems
Power distribution systems consist of several parts. Hewlett-Packard recommends that these parts be solidly interconnected to provide an equipotential ground to all points. -
Page 27: Cabinet Performance Grounding (High Frequency Ground)
Regardless of the grounding connection method used, the raised floor should be grounded as an NOTE absolute safety minimum. Hewlett-Packard recommends the following approaches: • Excellent—Add a grounding grid to the subfloor. The grounding grid should be made of copper strips mounted to the subfloor. -
Page 28: Equipment Grounding Implementation Details
11/30/99 Equipment Grounding Implementation Details Connect all Hewlett-Packard equipment cabinets to the site ground grid as follows: 1. Attach one end of each ground strap to the applicable cabinet ground lug. 2. Attach the other end to the nearest pedestal base (raised floor) or cable trough ground point (nonraised floor). -
Page 29: System Installation Guidelines
NOTE In domestic installations, the proper receptacles should be installed prior to the arrival of Hewlett-Packard equipment. Refer to the appropriate installation guide for installation procedures. Wiring Connections Expansion and contraction rates vary among different metals. Therefore, the integrity of an electrical connection depends on the restraining force applied. -
Page 30: Environmental Factors
General System and Facility Guidelines Environmental Factors Environmental Factors The environmental factors discussed in this section are: • “Computer Room Preparation” • “Space Requirements” • “Floor Loading” • “Cooling Requirements” • “Humidity Level” • “Dust and Pollution Control” • “Metallic Particulate Contamination” •... -
Page 31: Floor Loading
General System and Facility Guidelines Environmental Factors Delivery plans should include the possible removal of walls or doors. The physical dimensions for applicable computers and peripheral equipment are summarized in Appendix A, “System Specifications and Requirements.” Operational Space Requirements Other factors must be considered along with the basic equipment dimensions. Reduced airflow around equipment causes overheating, which can lead to equipment failure. -
Page 32: Cooling Requirements
Raised floor loading is a function of the manufacturer's load specification and the positioning of the equipment relative to the raised floor grid. While Hewlett-Packard cannot assume responsibility for determining the suitability of a particular raised floor system, it does provide information and illustrations for the customer or local agencies to determine installation requirements. - Page 33 General System and Facility Guidelines Environmental Factors Basic Air Conditioning Equipment Requirement The cooling capacity of the installed air conditioning equipment for the computer room should be sufficient to offset the computer equipment dissipation loads, as well as any space envelope heat gain. This equipment should include: •...
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Page 34: Humidity Level
General System and Facility Guidelines Environmental Factors An air distribution system should be zoned to deliver an adequate amount of supply air to the cooling air intake vents of the computer system equipment cabinets. Supply air temperature should be maintained within the following parameters: •... -
Page 35: Dust And Pollution Control
General System and Facility Guidelines Environmental Factors Low humidity contributes to undesirably high levels of electrostatic charges. This increases the CAUTION electrostatic discharge (ESD) voltage potential. ESD can cause component damage during servicing operations. Paper feed problems on high-speed printers are usually encountered in low-humidity environments. -
Page 36: Electrostatic Discharge (Esd) Prevention
Although this problem is relatively rare, it may be an issue within your computer room. Since metallic contamination can cause permanent or intermittent failures on your electronic equipment, Hewlett-Packard strongly recommends that your site be evaluated for metallic particulate contamination before installation of electronic equipment. -
Page 37: System Specifications And Requirements
System Specifications and Requirements Table A-1 System Specifications Description Specification Dimensions (H, W, D) 10.5 x 17 x 14 in (26.25 x 42.50 x 35.00 cm) Weight (configured) approximately 51 lbs (23.4 Kg) Input Power Operational: -40 to -70 VDC (Margin included) Recommended: -48 to -60 VDC Temperature... - Page 38 System Specifications and Requirements Table A-2 Power Consumption (Maximum) (Continued) Power Required Power Supply 750.0 Watts a. These wattage values are used to perform the calculations in Table A-3, “Power Consumption and Air Conditioning Requirement Summary.” Table A-3 Power Consumption and Air Conditioning Requirement Summary Multiply Qty.
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Page 39: Power Plug Configuration
Power Plug Configuration The power cable designed for the DC Blade Server is shown below. Figure B-1 bh3710 DC Power Plug The end of the power cable where the male plug goes will be unterminated. Appendix B... - Page 40 Power Plug Configuration Appendix B...
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Page 41: Conversion Factors And Formulas
Conversion Factors and Formulas These conversion factors and formulas will assist in data calculation for systems that do not conform specifically to the configurations listed in this Site Preparation Guide. Conversion factors used in this document and additional conversion factors that may be helpful in determining factors required for site preparation are provided. -
Page 42: Formulas
Conversion Factors and Formulas Formulas Formulas KVA =Voltage x Current (amps) Watts =VA x PF BTU =Watts x 3.41 Appendix C... -
Page 43: Glossary
Glossary Apparent power A value of power for AC circuits result of filter capacitor impedance. These large that is calculated as the product of RMS current filter capacitors act like a short circuit, producing an times RMS voltage, without taking the power factor immediate inrush surge current with a fast rise into account. - Page 44 Glossary PCI Currently, the most popular local I/O bus, the power consumption that a customer will most likely Peripheral Component Interconnect (PCI) bus was experience and can use for power budgeting developed by Intel and introduced in 1993. purposes. PICMG A consortium of companies involved in Vapor seal A vapor seal is an essential part of utilizing PCI for embedded applications.
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Page 45: Index
Index acoustics fan assemblies altitude, maximum fibre channel and LAN rear transition module blade American Society of Heating, Refrigerating, and Air-Conditioning Engineers, Inc. fibre channel disk carrier apparent power floor ASHRAE Standard 52-76 floor loading term definitions floor plan grid loading raised floor systems backplane... - Page 46 Index online uninterruptible power supply (UPS) watt, definition overview weight wire selection wiring connections peripheral component interconnect (PCI) power consumption panel quality supply supply fans system protection power factor, definition power plug configuration power supply labeling printed circuit assembly (PCA) printed circuit board (PCB) raceway systems racking kit...