Samsung HPR4272CX/XAC Service Manual page 105

■ A name of main part of Logic Board and vocabulary.
Item Name
LVDS Connector
①
Y Connector
②
X Connector
③
E-Buffer board Connector
④
F-Buffer board Connector
⑤
Power Connector
⑥
ASIC CHIP
⑦
MICOM LOADING 5PIN CONNECTOR
⑧
(Debug only)
■ About Logic Board
The Logic Board consists of a Logic Main board, which processes the main signal input through LVDS and creates the address
driver output and X,Y drive signals, and a Buffer board, which buffers the output signal and outputs the signal to the Address Driver
IC (TCP IC).
Logic Board
Logic Main
Lower E Buffer board
Buffer Board
Lower F Buffer board
Samsung Electronics
The connector to receive the RGB, H, V, DATAEN and DCLK signals that have been LVDS encoded through the
main board.
The connector to output the control signal for the Y drive board.
The connector to output the control signal for the X drive board.
The connector to output the address data and the control signal to the E-buffer board.
The connector to output the address data and the control signal to the F-buffer board.
The connector to receive power (5V, 3.3V) for the Logic board.
The main processor that generates and outputs the logic drive signal and the address data.
The connector to load the Micom drive program. The program is loaded by connecting to the GA-WRITER.
- Video Signal Processing (W/L, error diffusion, APC)
- Outputs the Address Driver Control and Data Signals to the Buffer board.
- Outputs the XY Drive Board Control Signal
Outputs data and controls signals to the bottom left TCP IC.
Outputs data and controls signals to the bottom right TCP IC.
Description
Function
Circuit Description
Remark
13-15