Table of Contents
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TABLE OF CONTENTS
........................................................... 3
2. GENERAL ....................................................................
3-1. Front Panel Assembly ....................................................... 12
3-2. Back Panel Assembly ....................................................... 12
3-3. Table Assembly ................................................................ 13
3-4. Mechanism Deck Assembly ............................................. 13
3-5. Base Unit Assembly ......................................................... 14
4. TEST MODE ...............................................................
5-1. Mechanical Adjsument ..................................................... 16
5-2. Electrical Block Checking ................................................ 22
6-1. Circuit Boards Location ................................................... 24
6-2. IC Pin Function
(CXD2545Q) ................................................................ 25
• IC303 System Control (CXP84332-Q27Q) ................. 28
6-3. Block Diagram ................................................................. 31
6-4. Printed Wiring Board - BD, DISP Section - ............... 35
6-5. Schematic Diagram - BD, DISP Section - .................. 39
6-6. Printed Wiring Board - MAIN Section - ..................... 43
6-7. Schematic Diagram - MAIN Section - ........................ 47
6-8. IC Block Diagrams ........................................................... 51
7-1. Case and Back Panel Section ........................................... 54
7-2. Disc table Section ............................................................. 55
7-3. Front panel Section ........................................................... 56
7-4. Mechanism Section-1 (CDM-40) ..................................... 57
7-5. Mechanism Section-2 (CDM-40) ..................................... 58
7-6. Base Unit Section-1 (KSM-213BKN/M-N) ..................... 59
7-7. Base Unit Section-2 (KSM-213BKN/M-N) ..................... 60
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
4
15
........................................ 61
- 2 -
MODEL IDENTIFICATION
- BACK PANEL -
US Model
Canadian Model
AEP,German Model : 2π
E Model
Singapore Model
Austrarian Model
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
The laser component in this product
is capable of emitting radiation
exceeding the limit for Class 1.
4-982-813-
: 0π
: 1π
: 3π
: 4π
: 5π
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
This caution label
is located inside
the unit.
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