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5-1. Circuit Boards Location
CONTROL (POWER) board
HEADPHONE board
LCD board
TC board
POWER board
TRANS board
SECTION 5
DIAGRAMS
CONTROL (VOL) board
BATT COM board
TUNER board
BATT board
CONTROL (CD) board
L-R/REG board
MAIN board
PDW board
CD board
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
•
: internal component.
f
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• WAVEFORMS
– TUNER Section –
1
IC2 w; (XOUT)
1.4 Vp-p
13.3 µ s
500 mV/DIV, 4 µ s/DIV
– MAIN Section –
4
IC801 ua (XT2)
3.6 Vp-p
30.5 µ s
1 V/DIV, 10 µ s/DIV
17
17
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. p: pF.
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
•
: internal component.
f
• 2 : nonflammable resistor.
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• H : adjustment for repair.
• Total current is measured with no cassette installed.
• Power voltage is dc 9 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
f
: MW/LW
E
: PB
a
: REC
J
: CD
– TC Section –
– CD Section –
2
3
Q301 collector (TAPE REC)
IC701 rk (XOUT)
3.1 Vp-p
18 µ s
59 ns
1 V/DIV, 10 µ s/DIV
1 V/DIV, 20 ns/DIV
5
IC801 ug (X2)
3.7 Vp-p
238 ns
1 V/DIV, 100 ns/DIV
CFD-EX35L
4.2 Vp-p
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