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HP dx5150 Series Disassembly Instructions Manual

Microtower, atx board
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HP-00007-01, Appendix 3
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model
HP Business Desktop dx5150 Series
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0
Items Requiring Selective Treatment
1.1
Items listed below are classified as requiring selective treatment.
1.2
Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
Batteries
Mercury containing components
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardants
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Components and waste containing
asbestos
Components, parts and materials
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances
Description
Microtower, ATX board
Notes
With a surface greater than 10
square cm
All types including standard
alkaline and lithium coin or button
style batteries
For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
Includes background illuminated
displays with gas discharge lamps
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
HP Restricted
2-Jun-2005
Qty in product.
2 (sys board &
P/S board)
1
0
0
0
0
2 (2 in P/S)
0
0
0
0
0
0
0
Page 1

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Summary of Contents for HP dx5150 Series

  • Page 1 HP Business Desktop dx5150 Series Microtower, ATX board Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment. Items Requiring Selective Treatment Items listed below are classified as requiring selective treatment.

  • Page 2: System Board

    HP-00007-01, Appendix 3 2-Jun-2005 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable)
  • Page 3 HP-00007-01, Appendix 3 2-Jun-2005 POWER SUPPLY PCA ( continued ) Remove the power supply PCA from the power supply (see Figure 11 below) Cut the two capacitors (C4, C5) (see Figure 12 below) solder joint using dikes (see Figure 13 below), and then remove the capacitors.
  • Page 4 HP-00007-01, Appendix 3 2-Jun-2005 Illustrations FIGURE 1: Removing the access panel FIGURE 2: System board FIGURE 3: Removing the heatsink assembly FIGURE 4: Heatsink screw locations FIGURE 5: Removing the processor FIGURE 6: Removing the system board HP Restricted Page 4...
  • Page 5 HP-00007-01, Appendix 3 2-Jun-2005 FIGURE 7: System board screw locations FIGURE 8: Removing the power supply FIGURE 9: Power supply with cover removed FIGURE 10: Switch and Inlet cables FIGURE 11: Power supply PCA FIGURE 12: Capacitors C4 and C5...
  • Page 6 HP-00007-01, Appendix 3 2-Jun-2005 FIGURE 13: Dikes FIGURE 14: Type 1 battery holder FIGURE 15: Type 2 battery holder FIGURE 16: Type 3 battery holder HP Restricted Page 6...