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Tool Description
Description #1 Torx screw driver
Description #2 Cross screw driver
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Unfix system side cover screw*1 then remove side cover.
2.
Remove front panel from system.
3.
Displug all cable connector from motherboard and all devices.
4.
Unfix Front IO cable screw*1 then remove it.
5.
Unfix PSU screw*4 then remove it
6.
Unfix MB screw*8 then remove it from chassis
7.
Remove coin cell battery on MB.
8.
Remove WLAN cards
9.
Remove Memory
10. Remove H/S screw*4 then remove it from MB
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Tool Size (if
applicable)
T15
6mm
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