Sony MZ-RH10 Service Manual page 24

MZ-RH10
• Note For Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
f : internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
* Replacement of IC401, IC501, IC601 and IC801 used in
this set requires a special tool.
• MAIN board is multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in this diagrams.
• Lead Layouts
surface
Lead layout of conventional IC CSP (chip size package)
MZ-RH10
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
•
f : internal component.
• C : panel designation.
Note: Note:
The components identi- Les composants identifiés par
fied by mark 0 or dotted une marque 0 sont critiques
line with mark 0 are criti- pour la sécurité.
cal for safety. Ne les remplacer que par une
Replace only with part pièce por tant le numéro
number specified.
spécifié.
• A : B+ Line.
• Power voltage is dc 1.5 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAYBACK
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E
: PLAYBACK
j
: REC
J
: OPTICAL IN
F
: LINE IN
d
: USB input from PC
G : USB output to PC
N : MIC IN
* Replacement of IC401, IC501, IC601 and IC801 used in
this set requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
• Waveforms
IC501 8 (RFO)
1 7
(MD play mode)
1.0 Vp-p
500 mV/DIV, 500 ns/DIV
IC501 ra (FE)
2 8
(MD play mode)
Approx.
280 mVp-p
100 mV/DIV, 500 ns/DIV
IC501 rs (TE)
3 9
(MD play mode)
Approx.
100 mVp-p
200 mV/DIV, 500 ns/DIV
IC351 6 (MCK)
4
1.8 Vp-p
44.3 ns
1 V/DIV, 20 ns/DIV
IC491 5 (EXT)
5
(MD play mode)
3.2 Vp-p
5.6 µ s
1 V/DIV, 2 µ s/DIV
IC801 <czz (OSCO)
6
2.6 Vp-p
44.3 ns
1 V/DIV, 20 ns/DIV
24 24
IC301 8 (BCLK)
2.2 Vp-p
354 ns
1 V/DIV, 100 ns/DIV
IC301 9 (MCLK)
2.5 Vp-p
88 ns
1 V/DIV, 50 ns/DIV
IC301 q; (LRCK)
2,3 Vp-p
22.8 µ s
1 V/DIV, 10 µ s/DIV