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TABLE OF CONTENTS
1.
2.
Location of Controls ....................................................... 6
Setting the Time .............................................................. 7
3.
......................................................... 8
4.
.............................................................. 11
5.
6.
DECK Section ................................................................. 13
TUNER Section .............................................................. 16
CD Section ...................................................................... 18
7.
................................................................. 20
(East European, CIS models only) - .............................. 21
7-2. Block Diagram - CD Section - ...................................... 23
7-3. Block Diagram - TAPE DECK Section - ...................... 25
7-4. Block Diagram - MAIN Section (1/2) - ........................ 27
7-5. Block Diagram - MAIN Section (2/2) - ........................ 29
POWER SUPPLY Section - ........................................... 31
Schematic Diagrams ....................................................... 33
(East European, CIS models only) - .............................. 34
(East European, CIS models only) - .............................. 35
7-10. Printed Wiring Board - CD Section - ........................... 37
7-11. Schematic Diagram - CD Section - ............................... 39
7-12. Printed Wiring Boards - CD MOTOR Section - .......... 41
7-13. Schematic Diagram - CD MOTOR Section - .............. 43
7-14. Printed Wiring Board - TAPE DECK Section - ........... 45
7-15. Schematic Diagram - TAPE DECK Section - .............. 47
7-16. Printed Wiring Board - LEAF SW Section - ............... 49
7-17. Schematic Diagram - LEAF SW Section - .................. 49
7-18. Printed Wiring Board - MAIN Section - ...................... 51
7-19. Schematic Diagram - MAIN Section (1/4) - ............... 53
7-20. Schematic Diagram - MAIN Section (2/4) - ................ 55
7-21. Schematic Diagram - MAIN Section (3/4) - ................ 57
7-22. Schematic Diagram - MAIN Section (4/4) - ................ 59
7-23. Printed Wiring Board - PANEL Section - .................... 61
7-24. Schematic Diagram - PANEL Section - ....................... 63
7-25. Printed Wiring Board - CD-SW Section - .................... 65
7-26. Schematic Diagram - CD-SW Section - ...................... 65
7-27. Printed Wiring Board - HP Section - ........................... 67
7-28. Schematic Diagram - HP Section - .............................. 68
7-29. Printed Wiring Boards - POWER AMP Section - ....... 69
7-30. Schematic Diagram - POWER AMP Section - ............ 71
- TRANSFORMER Section - ........................................ 73
- TRANSFORMER Section - ........................................ 74
7-33. IC Pin Function Description ........................................... 81
8.
9.
............................................... 3
....................... 13
................................................ 86
............................... 95
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
The following caution label is located inside the unit.
- 3 -
SECTION 1
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