QuickSpecs
Overview
1. Access Panel
2. Up to two Intel® Xeon® 5000 Sequence processors
3. Small form factor (SFF) hot-plug drive bays (standard BTO
models)
4. Local I/O connector
At A Glance
At A Glance
At A Glance
At A Glance
This document covers the HP ProLiant BL460c server blade only. For more information on HP BladeSystems c-Class Infrastructure
and HP BladeSystem c-Class Interconnect Components, please see the following QuickSpecs:
HP BladeSystem c-Class Enclosures QuickSpecs:
HP BladeSystem c3000 Enclosure QuickSpecs:
http://h18000.www1.hp.com/products/quickspecs/12790_na/12790_na.html
HP BladeSystem c7000 Enclosure QuickSpecs:
http://h18000.www1.hp.com/products/quickspecs/12810_na/12810_na.html
HP BladeSystem c-Class Interconnect Components QuickSpecs:
http://h18000.www1.hp.com/products/quickspecs/12524_na/12524_na.html
The HP ProLiant BL460c provides greater 2P x86 server blade density without compromise and maximum power-efficiency with
flexibility and choice.
HP ProLiant BL460c Server Blade
HP ProLiant BL460c Server Blade
HP ProLiant BL460c Server Blade
HP ProLiant BL460c Server Blade
DA - 12518
North America — Version 41 — February 16, 2010
HP ProLiant BL460c Server Blade
HP ProLiant BL460c Server Blade
HP ProLiant BL460c Server Blade
HP ProLiant BL460c Server Blade
5. Eight (8) PC2-5300, Fully Buffered DIMMs (DDR2-667)
Memory Slots
6. HP Smart Array E200i Controller with optional battery-
backed write cache (standard BTO models)
7. Two Mezzanine slots
8. Internal USB Connector (standard BTO models)
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