Huawei MU509-65 HSDPA Hardware Manual page 55

HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
components), including the conveyor belt, conveyor chain, guide wheel, and
Surface Mounting Technology (SMT) nozzle, must all be made of ESD materials
and be connected to the ground properly (check that the friction voltage is less
than 100 V).

Engineers that touch IC chips, boards, modules, and other ESD sensitive
components and assemblies must wear ESD wrist straps, ESD gloves, or ESD
finger cots properly. Engineers that sit when handling the components must all
wear ESD wrist straps.

Noticeable ESD warning signs must be attached to the packages and placement
areas of ESD sensitive components and assemblies.

Boards and IC chips must not be stacked randomly or be placed with other ESD
components.

Effective shielding measures must be taken on the ESD sensitive materials that
are transported or stored outside the EPA.
HUAWEI MU509-65 module does not include any protection against overvoltage.
Issue 01 (2016-04-08)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Electrical and Reliability Features
55