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7-6-2 Chip parts replacement procedure
This unit uses chip components such as carbon
r esis tor. c er amic cap aci tor. tr ansistoc and diode
in
some circuits.
It also useS IC's of flat-pack
type. As the appearance of carbon resistor and
ceramic capacitor arc identicaL, destinguishment
of
each can be possible by
visual
check of
reference
address
of
silk-screen prine on the
printed cucuit board.
As the shape of transistor
and diode arc same, they also arc distinguished
by the reference address of silk-screen print.
TooLs:
Soldering iron: 20W
af possible, use soLdering
tip with heat-
controller of 270:10
0
C)
Desoldering metal braid ("SOLDER
or equivalent)
SoLder (of O.6mm dia. is recommended.)
Tweezers
Soldering Conditions:
Tip temperature; 270%lOoC
Solder within 2sec. per an electrode
TAUL"
Higher temperature or longer tip application
than specified may be damaged to the chip
component.
U)
Resistor and capacitor:
a. Add heat onto the chip-part by the top of
soldering
!ton
tip
and
slide
the
chip-parc
aside when the soLder is melted.
b. Confum visually with care thac there is no
pattern peeling, damage, and/or bridge where
the put was removed or its surrounding.
c. Presolder
the pattern into thin where the
part was removed.
d. Place a new chip-parr onto the pattern and
solder both sides.
CAUTION: Do not usc the chip-part again onCe
used.
Soldtlring Iron
(2)
Transistor: and diode
a. Cl.\t the leads of the semiconductor pace to
be removed with a cuuer.
b. Remove the each pin of semiconductor from
the pattern by tweezers while heating the
pin by soldering ir:on.
c. Confum visually with care that there is no
pattern peeling, damage, and/or: br:idge where
the part was removed or its surrounding.
d. Presolder
the pattern into thin where
the
part was removed.
e. Place a new semiconductor onto the pattern
and solder the leads.
Transistor
(.3)
IC (Ftacoopack type)
a. Cut the leads of the: IC to be: removed with
a cutter.
b. Remove the each pin of IC from the pattern
by
tweezers
while
beating
the
pin
by
soldering iron.
c. Confirm visually with cace tbat thece is no
pactern peeling, damage, and/or bridge wbe:re
the part was remove:d or its surrounding.
Flat·Pack Type
-74- .
d. Presolder
the pattern into thin where the
part was removed.
e. Plac e
a
new IC onto the pattern and solder
it.
f. Confum
by
a teseer
that each conduction
between IC's terminal and Copper pattern is
surely made.
g.
If not, resolder the portion.
-75-
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