Reliability Features - Huawei ME909 Series Hardware Manual

HUAWEI ME909 Series Mini PCIe Module
Hardware Guide

5.7 Reliability Features

‎ T able 5-11 lists the test conditions and results of the reliability of the ME909 module .
Table 5-11 Test conditions and results of the reliability of the ME909 module
Item
Low-temperature
storage
High-temperature
storage
Low-temperature
working
High-temperature
working
Damp heat cycling
Temperature shock
Salty fog test
Issue 0.1 (2013-06-09)
 The above values are the average of some test samples.
 LTE test condition: 10 MHz bandwidth, QPSK, 1RB when testing max Tx power and full RB
when testing 1 dBm or 10 dBm.
Test Condition
Temperature: –40º C± 2º C
Test duration: 24 h
Temperature: 85º C± 2º C
Test duration: 24 h
Temperature: –20º C± 2º C
Test duration: 24 h
Temperature: 60º C± 2º C
Test duration: 24 h
High temperature: 55º C± 2º C
Low temperature: 25º C± 2º C
Humidity: 95%
Repetition times: 4
Test duration: 12 h+12 h
Low temperature: –40º C± 2º C
High temperature: 85º C± 2º C
Temperature change interval: < 30s
Test duration: 15 min
Repetition times: 100
Temperature: 35° C
Density of the NaCl solution: 5%± 1%
Spraying interval: 8 h
Duration of exposing the module to
the temperature of 35° C: 16 h
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Electrical and Reliability Features
Standard
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
IEC60068
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