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LG L1100 Service Manual

LG L1100 Service Manual

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L1100
P/N : MMBD0032801
Date: June, 2004 / Issue 1.0

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  • Page 1 Service Manual L1100 P/N : MMBD0032801 Date: June, 2004 / Issue 1.0...
  • Page 2 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the L1100...

  • Page 3: Table Of Contents

    Table of Contents 1. INTRODUCTION........4 4.10 Vibrator Trouble …………………………. 1.1 Purpose ..........…. 4.11 Keypad Backlight Trouble ………………. 1.2 Regulatory Information ......4.12 Folder Open/Close Trouble ………….…. 1.3 Abbreviations ......... 4.13 SIM Detect Trouble ……………………… 4.14 Earphone Trouble ……………………….. 2. General Performance .....… 7 4.15 Infrared Data Association Trouble ………...
  • Page 4 Table of Contents 9. PCB LAYOUT .....……………... 127 10. ENGINEERING MODE ....129 11. STANDALONE TEST ..... 130 11.1 Setting Method .........…. 130 12. EXPLODED VIEW & REPLACEMENT PART LIST..131 12.1 Exploded View .........…. 12.2 Replacement Parts <Mechanic components> ……………….. Replacement Parts <Main components>………………………...

  • Page 5: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the L1100 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
  • Page 6 E. Notice of Radiated Emissions The L1100 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

  • Page 7: Abbreviations

    1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current – Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milliwatt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electroluminescence Electrostatic Discharge...

  • Page 8: General Performance

    2. General Performance 2.1 Product Name L1100: Support GPRS (Class 10) 2.2 Supporting Standard Item Feature Comment E-GSM/ DCS/ PCS Tril Band with seamless handover Supporting Standard Phase 2+ SIM Toolkit : Class 1,2,3 E-GSM TX : 880 – 915 MHz E-GSM RX : 925 –...

  • Page 9: H/W Features

    2.4 H/W Features Item Feature Comment Form Factor Clam shell LCD (TFT 65K Color) Cell Size: Standard Capacity 4.5(L)×33.8(W)×49.7(H)mm Standard: Li-Ion, 820mAh(Min) Battery Packing Type: Hard Pack Size Standard: 89×50×24mm L×W×H Weight 90.5g With Battery Main PCB : 8Layers, 1t FPCB : 5Layers, 0.5t AVG TCVR 270 mA (GSM, Power Level 5)
  • Page 10 Item Feature Comment Antenna Fixed Type System connector 24 Pin Ear Phone Jack 3 Pole (φ2.5mm) PC synchronization CDROM Memory Flash : 128Mbit / SRAM : 64Mbit Speech coding FR, EFR, HR Data & Fax Built in Data & Fax support Vibrator Built in Vibrator IrDA...

  • Page 11: S/W Features

    2.5 S/W Features Item Feature Comment RSSI 0~5 level Antenna Battery Charging 0~4 level Key Volume 0~5 level Keypad Volume 0~5 level Effect sound volume 0~5 level Ring Volume 0~5 level Time/Date Display Text Input Multi-language Schedule/Ring Tone/Phonebook Quick Access Mode Camera/GPRS PC Sync Schedule/Phonebook/SMS...
  • Page 12 Item Feature Comment Mute Call Divert Call Barring Call Charge Call Duration SMS (EMS) Melody/Picture/Animation Send/Receive/Save WAP Browser WAP 2.0 Java CLDC v1.0.3 / MIDP v1.0.3 Wall Paper Max. 10 preset Download Melody/ Over the WAP Wallpaper (MMS) Long Message Max.

  • Page 13: H/W Circuit Description

    3. H/W Circuit Description 3.1 RF Transceiver General Description The RF parts consist of a transceiver part, a power amplifier part, a front-end module part, a voltage supply part, and a VC-TCXO part. The Aero I transceiver is composed of single RF chipset, Si4205-BM[U803] which is a triple and quad-band GSM/GPRS wireless communications.
  • Page 14 Figure 1. RF Receiver Block FL801 U803/Si4205 100KHz 100KHz Antenna Switch EGSM Baseband Baseband (TI) (TI) U102 U102 (Calypso) (Calypso) U101 U101 X801 (IOTA) ÷2:GSM (IOTA) 0˚/ ÷2:GSM 0˚/ VC-TCXO 90˚ 90˚ ÷1:DCS ÷1:DCS 26MHz 3.2.1. RF Front End RF front end consists of Antenna Switch(FL801), triple band LNAs integrated in transceiver(U803). The Received RF signals (EGSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz, PCS 1930MHz ~ 1990MHz) are fed into the antenna or mobile switch.
  • Page 15 3.2.2. IF A quadrate image-rejection mixer downconverts the RF signal to a 100kHz intermediate frequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 and 1989.9 MHz, and is divided by two for GSM 850 and EGSM 900 modes. The mixer output is amplified with an analog programmable gain amplifier (PGA), which is controlled with the AGAIN[2:0] bits in register 05h.

  • Page 16: Transmitter Part

    Transmit modes should always use fø = 200kHz. The IF and RF output frequencies are set by programming he N-Divider registers and also programmed via 3-wire interface with external system controller. Figure 2. Synthesizer Block X801 VC-TCXO U803/Si4205 26MHz ÷1,2 ÷65,130 ÷1,2 ÷65,130...
  • Page 17 Figure 3. RF Transmit Block FL801 PAM RF3146 (U804) Antenna Switch EGSM DCS/ PCS PA_BAND RFOD RFOG IF PLL Si4205 (U803) IF PLL RF PLL RF PLL Baseband Baseband (TI) (TI) U101 U101 ÷2 ÷2 IOTA IOTA EGSM U102 U102 Calypso ÷1 Calypso...

  • Page 18: Power Amplifier

    3.4 Power Amplifier The RF3146 [U804] is a quad-band EGSM 900/GSM 850/DCS/PCS power amplifier module that in corporates an indirect closed loop method of power control. The indirect closed loop is fully self-contained and it does not require loop optimization. It can be driven directly from the DAC output in the baseband circuit.

  • Page 19: Power Supplies And Control Signals

    3.6 Power Supplies and Control Signals An external regulator(U805) is used to provide DC power to RF part. Every RF component except power amp module uses this external regulator. Figure 6 External regulator Circuit -18-...

  • Page 20: Digital Baseband (Dbb) Processor

    3.7 Digital Baseband (DBB) Processor Figure 7. Top level block diagram of the Calypso G2(HERCROM400G2) 3.7.1. General Description CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone. This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro- Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bit SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS gates.

  • Page 21: Block Description

    3.7.2. Block Description CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA bus standard as interface with their associated application peripherals. CALYPSO is composed from the following blocks: • ARM7TDMIE : ARM7TDMI CPU core •...
  • Page 22 3.7.3 RF Interface (TPU, TSP Block) Calypso uses this interface to control IOTA_CS(ABB Processor) and AERO(RF Processor) with GSM Time Base Table 3-3. RF Interface Spec. TSP (Time Serial Port) Resource Interconnection Description TSPDO ABB & RF main Chip Control Data TSPEN0 ABB Control Data Enable Signal TSPEN1...
  • Page 23 SIM_PWRCTRL S IMIO SIM_CD SIMRST 100k 150p 0.1u 3.7.5. UART Interface L1100 has two UART Drivers as follow : UART1 : Hardware Flow Control / Fax & Data Modem UART2 : Handsfree Control / SW trace or IrDA Modem -22-...
  • Page 24 Figure 3-4. UART Interface spec. UART MODEM (UART1) Resource Name Description TX_MODEM Transmit Data RX_MODEM Receive Data CTS_MODEM Clear To Send RTS_MODEM Request To Send GPIO 3 Data Set Ready UART IrDA (UART2) Resource Name Description TXIR_IRDA TX_IRDA Infra-Red Transmit Pulse TX_IRDA Transmit Data(UART2) RXIR_IRDA...

  • Page 25: Analog Baseband (Abb) Processor

    3.7.6. GPIO Map In total 16 allowable resources, L1100 is using 13 resources except 3 resources dedicated to SIM and Memory. L1100 GPIO (General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table. Table 5. GPIO Map Table...
  • Page 26 • Battery charging control • 1.8V/3V SIM card Interface • Switch ON/OFF • 4 internal & 4external ADC channels Figure 9. Top level block diagram of the IOTA(TWL3014CGGM) -25-...
  • Page 27 3.8.2. Audio Signal Processing & Interface The voice codec circuitry processes analog audio components in the voice uplink (VUL) path and applies this signal to the voice signal interface for eventual baseband modulation. In the voice downlink (VDL) path, the codec circuitry changes voice component data received from the voice serial interface (VSP) into analog audio.
  • Page 28 3.8.3. Audio uplink processing The VUL path includes two input stages. The first stage is a microphone amplifier, compatible with electret microphones containing a FET buffer with open drain output. The microphone amplifier has a gain of typically 25.6 dB (±1 dB) and provides an external voltage of 2.0 V or 2.5 V to bias the microphone (MICBIAS).
  • Page 29 3.8.4. Audio downlink processing The VDL path receives speech samples at the rate of 8 kHz from the DSP via the VSP and converts them to analog signals to drive the external speech transducer. The digital speech coming from the DSP is first fed to a speech digital filter that has two functions.
  • Page 30 3.8.6. Voltage Regulation (VREG) There are 7 LDO (Low Drop Output) regulators in ABB chip. The output of these 7 LDOs are as following table. (Figure14) shows the power supply related blocks of DBB/ABB and their interfaces in L1100. -29-...
  • Page 31 Figure 14. Power Supply Scheme -30-...
  • Page 32 Table 3-6. LDO Output Table Output Voltage Usage VRDBB 1.5V Digital Core of DBB VRIO 2.8V Peripheral devices VRMEM 2.8V External memory VRRAM 2.8V LCD & peripheral devices VRABB 2.8V Analog Block of ABB VRSIM 2.85V SIM card driver VRRTC 1.5V RTC &...
  • Page 33 3.8.8. Charging Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC channel. Battery Block Indication and SPEC of L1100 is as follow. Figure 15. Battery Block Indication 4.2V~3.92V 3.91V~3.79V 3.78V~3.70V 3.69V~3.61V 3.60V~3.35V 1. Charging method: CC-CV 2.
  • Page 34 ▶ IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin. ▶ CHARGER_IC :When a charger voltage is above VBAT+0.4V on VCHG. 3.8.10. Memories L1100 using 128Mbit Flash + 64Mbit SRAM with 16 bit parallel data bus thru ADD01 ~ ADD22. 3.8.11. Display & FPCB Interface LCD module include: ▶...
  • Page 35 Connector Interface Spec. Table 3-8 Connector Interface Spec. MAIN BOARD LCD FPCB 60PIN CONN. CONNECTOR 60PIN CONN. CAMERA 20PIN CONN. LCM 40PIN CONN. V_SRAM L_D(0) L_D(0) C_MCLK V_SRAM L_D(1) L_D(1) C_PWR LCD_RESET L_D(2) L_D(2) C_PCLK LCD_RESET L_D(3) L_D(3) C_CD0 L_SUB_CS L_D(4) L_D(4) C_CD1...
  • Page 36 3.8.12. Keypad Switching & Scanning Table 3-9. Keypad Map KBC0 KBC1 KBC2 KBC3 KBC4 KBR0 LEFT RIGHT DOWN KBR1 CLEAR KBR2 [F1] VOL_UP KBR3 [F2] VOL_DOWN KBR4 [F3] DBB supports 25 Key Map and Switch-ON Key is connected directly to ABB as (Figure16 ). Figure 16.
  • Page 37 3.8.13. Keypad back-light Illumination There are 12 Deep Blue LEDs in Main Board for Keypad Backlight. Keypad Back-light is driven by ‘LEDB’ line from IOTA . Figure 17. Keypad Back-light Scheme 3.8.14. LCD Illumination There are 3 LEDs in the LCD module for LCD backlighting. MLED and SLED is connected driver ic of LCD module.
  • Page 38 3.8.15. Audio Circuit Figure 19. Microphone system When a call is established, MICBIAS signal goes up to ‘2.5V’ in the L1100. IOTA(ABB) provides both 2.0V and 2.5V for MICBIAS to circuit designer. VA201, VA202 are employed to enhance ESD immunity.
  • Page 39 Head set Jack Interface Figure 20. Ear-Jack interface When ear-mic set or head set plug is inserted into the receptacle, JACK_DETECT signal which is input of ADIN1 in ABB changes from ‘H’ to ‘L’. If hook button is pushed for a second to make a call, then HOOK_DETECT signal which is input of ADIN4 in ABB goes from ‘H’...
  • Page 40 Receiver Circuits MAIN PCB Figure 21. Receiver and MMS mode system switch A single analog switch is employed to support both voice and MMS sound mode with EAR_SPK. In the MMS mode the SPK_EN port sets ‘H’ , then the EAR_SPK will be connected with MIDI sound path (NO) and operate as loud speaker.
  • Page 41 MIDI SOUND circuit description MAIN PCB Figure 22. MIDI sound Circuit The YMU762 has features as described below. • Simultaneous generation of up to 40 tones: • Polyphonic synthesizer specification • Has built-in default tones for FM and Waveform table synthesizers in the ROM, and the tones can be downloaded to RAM.
  • Page 42 Receiver and Speaker circuit FPCB Figure XX. Receiver and Speaker Circuit of FPCB SPKN, SPKP signals from MIDI sound are connected to speaker through OUT1 and OUT2. EAR_N, EAR_P signals from ABB are connected to receiver through OUT3 and OUT4. -41-...

  • Page 43: Camera Circuit

    3.9. Camera Circuit Under camera action mode, CLC344E wholly controls LCD by itself to execute camera functions, while, under bypass mode, CLC344E lets all LCD driver-related signals bypass it, as if it does not exist at all in the system. Figure 23.
  • Page 44 Figure 24. CLC344E, Camera Chip Block Diagram The camera IC, CLC344E, is controlled through _RD, _WR, _MAIN_CS,_SUB_CS, CAM_HOLD, LCD_RESET, ADD[1-6], DATA[0-15] by PD751992GHH(DBB). In by-pass mode, CLC344E by passes all LCD control signal from PD751992GHH(DBB) to LCD module. In operating mode, CLC344E samples the image data from camera sensor connected on FPCB CN2 through C_CD[0-7], C_MCLK, C_PCLK, C_HS, C_VS, C_SDA, C_SCK, C_RST signals and controls the LCD module through L_A(1), L_D[0-15], L_WR, L_SUB_CS,L_MAIN_CS.
  • Page 45 Table 3-10. CLC344E Interface Port Name Description Write control to CLC344E or LCD module Read control. The phone do not read data from LCD chip CAM_INT Interrupt to DBB. It can be set to level or edge interrupt This signal determines the camera operation mode. Making high, CAM_HOLD disable all CLC344E functions CAM_RST...
  • Page 46 Figure 25. CLC344E, Camera Chip Circuit -45-...
  • Page 47 Figure 26. LCD Connection Thru CLC344E, Camera chip 3.9.2. CMOS Image Sensor General description of CIS Camera Module • Optical Size: 1/4 inch • Unit Pixel: 5.6 μm X 5.6 μm • Effective Resolution: 640X480, VGA • 8.5mm X 9.5mm X 6.6mm module size •...
  • Page 48 Figure 27. Camera Module Block Diagram S5C7322X S5K433LA03 Image Signal Processor CMOS Image Sensor Lens Unit Line Buffer Pixel Array 640(H)×480(V) Pre Processor Luminance Chroma Signal Signal Timing Processor Processor Controller Post Processor MCLK VSYNC RISC Processor Output Formatter HSYNC PCLK DATA0-7 (AE,AWB Processor)
  • Page 49 Figure 28. Camera Module Circuit MAIN BOARD FPCB -48-...

  • Page 50: Troubleshooting

    4. TROUBLESHOOTING 4.1 Main Components Placement CN401 FL701 SW801 CN701 FL701 J201 U801 U204 U401 U804 SW402 FL801 U803 SW401 U601 CAMERA KEY U602 U805 U203 X801 U101 U501 U201 U102 X101 J501 U302 CN802 CN803 MIC201 U502 Q301 Q301 LD301 -49-...

  • Page 51: Fpcb Components Placement

    4.2 FPCB Components Placement RECEIVER SPEAKER BACKUP BATTERY CN2-CAMERA CONNECTOR LCD AREA LCD CONNECTOR 60PIN FPCB CONNECTOR 4.3 Baseband Components -50-...

  • Page 52: Main Components

    4.4 Main Components (Description) MAIN LD301 Indicator LED U302 Memory(128M Flash+64M SRAM) CN401 VIBRATOR CONNECTOR U501 IrDA port CN803 IO connector U303 Indicate LED control switch CN701 FPCB connector Q402 Vibrator control TR X101 Crystal (32.768KHz) U201 MIDI chipset (YMU762) J501 SIM card connector U202...

  • Page 53: Power On Trouble

    4.5 Power On Trouble 4.5.1 Power On Sequence Connecting Battery • Power-On Key Detection • PWON signal goes to ABB and then ABB reset DBB by ON_OFF signal • ON_OFF turn low(1.5V) to HIGH(2.8V) and it resets Calypso 4.5.2 Check Points •...

  • Page 54: Charging Trouble

    4.6 Charging Trouble • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 5.2V • Charging temperature adc range • Charging time : under 3hours -. ~ -5℃ : not charging operation. • Charging current : 420mA -.
  • Page 55 Charging Procedure Trouble Shooting Setup • Connecting TA & Charger Detection • Connect Battery & TA to the handset. • Control the charging Current by ABB • Charging Current flows into the Battery Check Points Trouble Shooting Procedure • Connection of TA •...

  • Page 56: Lcd Display Trouble

    4.7 LCD Display Trouble LCD CONNECTOR MAIN CONNECTOR Check soldering around connector LCD Control Signals From Main Board • MLED , L_MAIN_CS, L_SUB_CS ,LCD_RESET, L_WR, LCD_ID • L_A(1), L_D(0)~L_D(15), IFMODE Check Points • The Assembly status of the LCD Module. •...
  • Page 57 START Refer to Power is supplied to Power On Trouble the board? Connection between Reconnect LCD Module and board is OK? Module Resolder the MAIN CN701, FPCB CN3,CN1 MAIN CN701, FPCB is soldered well? CN3,CN1 Resolder Paths of LCD control FB701~FB704 signals are OK? The board is broken.

  • Page 58: Receiver Trouble

    4.8 Receiver Trouble Block Diagram CN701 (CN3) Control Calypso SPKP/ YMU762 SPEAKER (U102) SPKN (U201) SPK_EN Analog SW (U203) EAR_SPK IOTA RCV_P/ EAR_P/ RECEIVER RC filter (U101) RCV_N EAR_N Melody Generation • U201(YMU762,MIDI) is controlled by DBB. • U201 generates 40poly MIDI sound and it is delivered to the speaker •...
  • Page 59 Speaker/Receiver CN701 Check the states MAIN these points ! Receiver Trouble Shooting Setup • Initialize GSM MS test equipment. • Connect PIF-UNION and power on. • Make a test call to 112. • Set audio part at test equipment as PRBS or continuous wave, not echo. •...
  • Page 60 4.8.1. Receiver Trouble START Set audio part at test equipment as PRBS or continuous wave, not echo. Set the audio volume max. ABB is out of order. Does sine wave appear Change the board. at R219, R222? Resolder the U203. SPK_EN signal is low? Otherwise change it.
  • Page 61 4.8.2. Speaker Trouble START Enter into Engineering Mode and → go to menu “Baseband → Alert Ring” Resolder the U203 Does sine wave appear SPK_EN signal is high? otherwise Change it. at C206, C207? Reconnect FPCB to Connection CN701 between FPCB and CN701 is OK? V_SRAM Resolder the U201...

  • Page 62: Microphone Trouble

    4.9 Microphone Trouble Circuit Diagram -61-...
  • Page 63 Microphone Signal Flow Check Points • MIC is enable by MICBIAS • Microphone bias • MICBIAS, MICP, MICN signals to ABB • Audio signal level of the microphone • Soldering of components Trouble Shooting Setup • Initialize GSM MS test equipment. MIC Bias •...
  • Page 64 START Connect the handset to network equipment and setup call. Resolder the The voltage of R217 The soldering of R214 R214 is 2.5V? is OK? ABB is out of order. Change the board. Soldering between MIC and Board is OK? Resolder the MIC Check the signal level at pin 1,2 of the MIC after putting...

  • Page 65: Vibrator Trouble

    4.10 Vibrator Trouble Block Diagram Vibrator Operation • Vibrator is controlled by MIDI chip • When vibrator signal is high, vibrator is enabled Check Points • VCC lines (V_SRAM) of MIDI chip • Vibrator signal path • The connection between the main board and vibrator module •...
  • Page 66 START Enter into Engineering Mode and select Vibrator Signal of pin2 of Q402 Voltage of C209 Change the board is 2.8V is OK? U201 is out of order Check the soldering of Pin3 of Q402 is 0V ? Resolder R405 R405 Change the Q402 Resolder R404...

  • Page 67: Keypad Backlight Trouble

    4.11 Keypad Backlight Trouble Block Diagram Backlight Operation • The keypad LED backlight is controlled with LEDB signal. • LEDB signal from ABB. • The LEDs are forward biased and turned on. Trouble Shooting Setup Check KEY_LED signal • Connect PIF-UNION to the phone, and power on. R422,R423 •...
  • Page 68 START Enter into Engineering Mode and select Keypad On The Voltage ABB is out of order. Check the soldering Of LEDB signal Change the Board. of R422,R423 is about 0V? Power off and Measure the Resistor Value of all LEDs. Is there anything that ABB is out of order.

  • Page 69: Folder Open/Close Trouble

    4.12 Folder Open/Close Trouble Block Diagram Flip Operation • There is a magnet to detect the Flip status, opened or closed. • If a magnet is close to the hall-effect switch(U401), the voltage at pin 2 of U401 goes to 0V. Otherwise, V_IO.
  • Page 70 Caution! If use PIF jig, the START remote switch is turned off. Folder open status. Not magnetized Resolder the The all paths connected R424,R426,R425 to U401 are OK? ABB is out of order. Pin1 of U401 is 2.8V? Change the Board. Pin2 of U401 is 2.8V? Replace the U401.

  • Page 71: Sim Detect Trouble

    4.13 SIM Detect Trouble Block Diagram V_IO V_SIM VRSIM DBBSIO SIM_IO DBBSCK SIM_CLK DBBSRST SIM_RST SIMCLK SIM_PWRCTRL S IMIO SIM_CD SIMRST 100k 150p 0.1u ⑥ ④ J501 ① ③ Check Points Connection between SIM and DBB • SIM_CLK, SIM_IO, SIM_RST •...
  • Page 72 START Insert the SIM Card Resolder the The soldering of SIM connector J501. is OK? Resolder the The all paths connected C502,C504,C501,R502 to J501 are OK? SIM card is broken. The SIM Card is OK? Change the SIM Card. The ABB(IOTA) is broken. Change the board.

  • Page 73: Earphone Trouble

    4.14 Earphone Trouble Block Diagram EAR_JACK SPEC Receiver Earphone Detecting Operation • The DBB read JACK_DETECT port periodically and if the voltage of “JACK_DETECT” goes to 0V, it detects ear-jack inserted. •The ABB operates A/D conversion continuously and if the voltage of “HOOK_DETECT” node goes to about 40mV, it detects hook switch is pushed in call state.
  • Page 74 The audio Signal to ear- The audio Signal to ear- “JACK_DETECT” Point mic (C219) mic (R215,R216) “HOOK_DETECT” The audio Signal from The audio Signal from signal(R220,C228) ear-mic (R232,C223,R298) Ear-mic (R299) -73-...
  • Page 75 cf) PRBS : Pseudo Random Bit Sequence START Insert the earphone into the headset. Does the Audio profile change 1. Earphone detection problem to the earphone mode? Set the audio part of test equipment to PRBS or continuous wave mode Can you Soldering hear the sound...
  • Page 76 1. Earphone detection problem The Voltage The soldering Resolder the at JACK_DETECT point Of R223,R225,C232 R223,R225,C232. is 0V? is OK? Pin3 and Pin4 of J201 Change the J201. are open? The ABB is out of order. Change the board. -75-...
  • Page 77 2. Sending Path problem Set audio part of the test equipment to the echo mode. The voltage at R299 Resolder the is 0.99V ~ 1.03V? R210,R212,R299 A few tens or hundreds Resolder soldering of C223 of mV of signals at C223 the C223 is OK? are measured ?

  • Page 78: Infrared Data Association Trouble

    4.15 Infrared Data Association Trouble Block Diagram Infrared Signal Flow • Infrared is enable by SD • TX_IRDA,RX_IRDA,SD_IRDA signals from DBB Check Points • Check the power supply. • Check the soldering of Components • Check the IrDA Transceiver -77-...
  • Page 79 Trouble Shooting Setup • Enter the engineering mode. • Go to menu ‘Baseband → IrDA Test’ Tx_IrDA Rx_IrDA Trouble Shooting Procedure SD_IrDA • Check the SD,TX, RX signal. • Check the soldering. • Check the IrDA Transceiver. Tx_IrDA Rx_IrDA Searching… Enabled (TX_IrDA) Enabled(RX_IrDA) -78-...
  • Page 80 START Set configuration like Fig 1. Execute PCSync program (ContentsBank.exe) Resolder the The power is supplied to U501? C503 The soldering of U501 is OK? Resolder the U501. The signal “TX_IrDA, RX_IrDA” Change the U501. are measured? The DBB is broken. Change the board.

  • Page 81: Camera Trouble

    4.16 Camera Trouble SETTING : Connect PIF, and set remote switch ON at PIF Checking Flow START Does the LCD Go to the LCD trouble itself has no trouble Set the camera button ON Check Check the voltage of Pin3 of Q601 is the voltage of Pin1 of Change the main board 2.85V...
  • Page 82 Test Points U602 U601 FPCB CN2 -81-...
  • Page 83 RF Rx pass Trouble Shooting START E5515C : Test Mode CH62, 7 level setting (TCH) CH62, -60 dBm setting (BCCH) Spectrum Analyzer setting Oscilloscope setting Check Regulator Circuit Check VCTCXO Circuit Check PLL Control Signal Check ANT SW & Mobile SW Check Rx I/Q Re-download SW &...

  • Page 84: Checking Regulator Circuit

    Checking Regulator Circuit (Rx pass continued) Check Pin 1 Regulator circuit is OK See next page to check 2.85V? VCTCXO circuit Pin 3 High? Replace U805 Check U102 Pin 3 U803 Ch2 : Pin 5 2.85V Si4205 U805 Ch1 : Pin 3 2.67V Pin 5 -83-...

  • Page 85: Checking Vctcxo Circuit

    Checking VCTCXO Circuit (Rx pass continued) Check Pin 3 of X801 VCTCXO circuit is OK See next page to check 26MHz ? ANT SW & Mobile SW Pin 4 2.85V ? Replace X801 Check U805 Pin4 Pin3 U803 Pin 3 Si4205 26MHz Pin 4...
  • Page 86 Checking PLL Circuit (Rx pass continued) S_DATA Check S_CLK, S_CLK S_EN, S_DATA S_EN Signal is Download SW U803 normal? 26MHz Si4205 X801 PLL circuit is OK. See nest page to check ANT SW & Mobile SW S_EN S_EN S_DATA S_DATA S_CLK S_CLK -85-...
  • Page 87 Checking ANT SW & Mobile SW (1) (Rx pass continued) Check SW801 Pin 1,2 with no RF cable connected Short ? Replace SW801 Check SW801 Pin 1,2 with RF cable connected Open ? Replace SW801 Rx standalone mode Check VC1, VC2, VC3 of FL801 is needed (Table 3-1) VC1,VC2,VC3=Low or Replace...
  • Page 88 Checking ANT SW & Mobile SW (2) (Rx pass continued) SW801 ANT SW801 RF Pin5 VC3 Pin 7 VC1 U801 FL801 Pin 2 VC2 -87-...
  • Page 89 Checking Rx I/Q (Rx pass continued) Check I/Q Replace U803 I/Q is normal? Redownload the software & Calibration RXQP U803 Si4205 RXIP RXIN RXIP RXQP RXQN -88-...
  • Page 90 RF Tx pass Trouble Shooting START E5515C : Test Mode CH62, 7 level setting (TCH) CH62, -60 dBm setting (BCCH) Spectrum Analyzer setting Oscilloscope setting Check Regulator Circuit Check VCTCXO Circuit Check PLL Control Signal Check Tx I/Q Check PAM Control Signal Check ANT SW &...
  • Page 91 Checking Regulator Circuit (Tx pass continued) Check Pin 1 Regulator circuit is OK. See next page to check 2.85V ? VCTCXO circuit Pin 3 High ? Replace U805 Check U102 Pin 3 U803 Ch2 : Pin 5 2.85V Si4205 U805 Ch1 : Pin 3 2.67V Pin 5 -90-...
  • Page 92 Checking VCTCXO Circuit (Tx pass continued) Check Pin 3 of X801 VCTCXO circuit is OK 26MHz ? See next page to check ANT SW & Mobile SW Replace X801 Pin 4 2.85V ? Check U805 Pin4 Pin3 U803 Pin 3 Si4205 26MHz Pin 4...
  • Page 93 Checking PLL Circuit (Tx pass continued) S_DATA Check S_CLK, S_CLK S_EN, S_DATA S_EN Signal is Download SW U803 normal? 26MHz Si4205 X801 PLL circuit is OK. See nest page to check ANT SW & Mobile SW S_EN S_EN S_DATA S_DATA S_CLK S_CLK -92-...
  • Page 94 Checking Tx I/Q (Tx pass continued) Check I/Q Normal? Replace U101 Redownload the software and calibration U803 TXIP Si4205 TXQN TXIN TXQP TXIP U101 TXQP ( IOTA) -93-...

  • Page 95: Checking Pam Control Signal

    Checking PAM Control Signal (Tx pass continued) Check APC, PA_ON, PA_BAND Normal? Download the SW Control signal is OK. See next page to Check ANT SW & Mobile SW (VRAMP) U804 RF3146 PA_ON PA_ON PA_BAND -94-...
  • Page 96 Checking ANT SW & Mobile SW (1) (Tx pass continued) Tx standalone mode Check RF Level FL801 Pin 15,17 is needed (Table 3-1) ≥ -63dBm Replace U804 Check VC1, VC2,VC3 of FL801 VC1,VC2=Low & VC3=High or Replace the board VC1,VC3=Low & VC2=High ? Check FL801 Pin 11 Replace ≥...
  • Page 97 Checking ANT SW & Mobile SW (2) (Tx pass continued) SW801 ANT SW801 RF Pin 7 VC1 Pin5 VC3 U801 FL801 Pin 2 VC2 -96-...

  • Page 98: Assembly Instruction

    5. ASSEMBLY INSTRUCTION 5.1 Disassembly -97-...
  • Page 100 -99-...
  • Page 101 -100-...

  • Page 102: Download

    6. DOWNLOAD 6.1 Download Setup 6.1.1 In case of using the Data kit Figure 6-1 Describes Download Setup Preparation • Target Handset • Data kit • Battery • IBM compatible PC supporting RS-232 with Windows 98 or newer If you use data kit, you should have a battery with the voltage above 3.7V. 6.1.2 In case of using the PIF Preparation •...

  • Page 103: Download Procedure

    6.2 Download Procedure 1. Execute Fluid_GUI.exe and select “Erase/Program flash” menu. -104-...
  • Page 104 2. Click the “Add” button. Then, choose m0 file which is going to download. -105-...
  • Page 105 3. You must choose three programming options in programming options box. One is to decide whether you erase entire flash. If m0 file which is going to download have the change of pcm structure for current target’s m0 file, you must erase entire flash memory. The second programming option is to decide whether you erase bootloader.
  • Page 106 4. Press “Global Settings” menu. Choose a correct serial port and set the configuration as below. -107-...
  • Page 107 5. After checking programming options, Click “Erase/Program” button. If you click “Erase/Program” button, you will be able to see that “(reset target)” is displayed in the “Output” window. And then if you push shortly the “Power key” of the mobile, downloading will be started. -108-...
  • Page 108 6. Wait for downloading to be finished. -109-...
  • Page 109 7. If downloading is finished, we can switch on the mobile. When you switch on the mobile first time after downloading, you must not remove the battery until switch-on procedure is completed. If you remove the battery before switch-on procedure is completed, we will not be able to save user data in the flash memory of the mobile.

  • Page 110: Service And Calibration

    7. SERVICE AND CALIBRATION 7.1 Service S/W 7.1.1 Overview This service S/W is used for Calibration and Standalone test. 7.1.2 Hardware and Software Environment • More than 486 computer • 16Mbyte RAM • Remained more than 10Mbyte in Hard Disk Memory •...
  • Page 111 A. Target System Frame This is for initializing the target phone. When you use this program to test L1100 phone, you have to initialize target at first. To initialize target phone, select target (L1100 is default) and COM port used at your computer and then click the Initialize button.
  • Page 112 C. TX APC Test Frame At this part, you can control transmit path of target phone. Serving Freq. Setting (TCH) You can set TCH of phone. The number means ARFCN of Traffic channel. Beacon Freq. Setting (BCH) You can set BCH of phone. The number means ARFCN of base station broadcasting channel. Power Level Setting First, you have to choose operating mode (GSM, DCS, PCS) according to TCH and BCH frequency that you selected before.

  • Page 113: Calibration

    E. User Command and Results Frame Whenever you click button or make some event in service software, every ordered event is displayed in this frame. You can also see calibration results here. F. Ramp shape button This button is for burst shape table. But it is deactivated in service software. 7.2 Calibration 7.2.1 Overview The calibration values of the phone reside on the Flash.
  • Page 114 7.2.3 Equipment Setup GSM Test Set(8960) GPIB Cable Mobile Switch Cable Power Supply GPIB Cable Battery Simulator Figure 7-1 Calibration Equipment List 7.2.4 Calibration steps A. RX Calibration In order for the RSSI measurements to be within the GSM specifications, some calibration is necessary. Also, due to AGC implementation, some AGC specific constants need calibration.
  • Page 115 f) Click the PM Start button. g) Repeat above procedure until the displayed number in Power Measurement window is 12. h) Click the Calculate button, then the service software calculate the channel compensation parameters. i) Saving updated calibration data into phone by clicking Calib Saving button. NOTE If the calibration does not done for all channels, 5 channels for EGSM 900 and 7 channels for DCS1800, the service software reports, “Please execute after measuring the PM”.
  • Page 116 Procedure a) Initialize phone by clicking Initialize button. b) Set the BCH and TCH of the phone 62 for E-GSM900 and 699 for DCS1800. Of cause you have to match test equipment’s BCH and TCH ARFCN with this value. For each power level, adjust the DAC value to get target power and click Test button.

  • Page 117: Circuit Diagram

    22/03 Designer TDO_ARM KBR(0:4) TDO_1 TDO_ARM 2004 RPWON RPWON RPWON VBAT VBAT VBAT 22/03 Checked _BSCAN 2004 JTAGEN _BSCAN DRAWING BB_MAIN NAME Approved DRAWING Iss. Notice No. Date Name V1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 119 -...

  • Page 118: Audio

    MICN Section Date Sign & Name Sheet/ Sheets MODEL L1100 22/03 C230 R224 Designer C231 2004 22/03 Checked 2004 DRAWING AUDIO NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 120 -...

  • Page 119: Memory

    R313 0.1u R315 BCLKX Section Date Sign & Name Sheet/ Sheets L1100 MODEL 22/03 Designer 2004 22/03 Checked 2004 DRAWING MEMORY NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 121 -...

  • Page 120: Mmi

    R422 LEDB Section Date Sign & Name Sheet/ L1100 Sheets R423 MODEL VA402 22/03 AVL5M02-200 Designer 2004 22/03 Checked 2004 DRAWING NAME Approved DRAWING V1.1 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 122 -...

  • Page 121: Peripheral

    100p 220K 220K C514 Section Date Sign & Name Sheet/ Sheets MODEL L1100 22/03 Designer 2004 22/03 Checked 2004 DRAWING Peripheral NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 123 -...

  • Page 122: Camera

    2.2u 0.01u (1608) R612 Section Date Sign & Name Sheet/ Sheets L1100 MODEL 22/03 Designer 2004 22/03 Checked 2004 DRAWING CAMERA NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 124 -...

  • Page 123: Lcd

    Sheet/ Sheets MODEL L1100 R706 22/03 LCD_BACKLIGHT EN_SET Designer R711 2004 MLED VA707 AVL5M02-200 SLED 22/03 Checked 2004 DRAWING C746 C747 NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.1 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 125 -...
  • Page 124 22/03 TEMPSENSE Designer 2004 RF_EN R834 4.7K C846 C849 C847 C848 22/03 0.01u 2.2u 1000p Checked (1608) 2004 DRAWING RF_AERO I NAME Approved DRAWING Iss. Notice No. Date Name V1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 126 -...

  • Page 125: Pcb Layout

    9. PCB LAYOUT - 127 -...
  • Page 126 9. PCB LAYOUT - 128 -...

  • Page 127: Engineering Mode

    10. ENGINEERING MODE Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*# “Select. Pressing END will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press ‘select’...

  • Page 128: Standalone Test

    11. STANDALONE TEST 11.1 Setting Method 11.1.1 COM Port In the “Dialog Menu”, select the values as explained below. • Port : select a correct COM port • Baudrate : 38400 • Leave the rest as default values 11.1.2 Tx Test 1.

  • Page 129: Exploded View & Replacement Part List

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW - 131 -...

  • Page 130: Replacement Parts

    PALLET(G7100 for Orange UK_EUR) Black MPCY02 PALLET MPCY0009502 PALLET(G7100 for Orange UK_Cap) Black AMBA00 MANUAL ASSY,OPERATION AMBA0034902 L1100 User Manual assay for UK Orange MMBB00 MANUAL,OPERATION MMBB0121102 L1100 User manual for Orange UK Dark APEY02 PHONE APEY0134801 Gray Dark ACGG00...
  • Page 131 TAPE,DECO MTAA0041801 L1100 TAPE DECO(FRONT) Silver Dark MWAG00 WINDOW,IRDA MWAG0005501 L1100 Blue ADBY00 DECO ASSY ADBY0003601 L1100 DECO ASSY ( TAPE + HINGE DECO) Silver MDAJ00 DECO,HINGE MDAJ0006101 L1100 DECO_HINGE Silver Metalic MTAA TAPE,DECO MTAA0041901 L1100 TAPE DECO HINGE Silver...
  • Page 132 MTAB0038101 PROTECTION TAPE(FOR SUB WINDOW) MTAZ00 TAPE MTAZ0029801 TAPE, LCD CONDUCTIVE Black MWAE00 WINDOW,CAMERA MWAE0002601 L1100 CAMERA WINDOW (pi 6.3*0.55T) ACGM00 COVER ASSY,REAR ACGM0030001 L1100 COVER ASSY, REAR Silver ACGM00 ANTENNA,GSM,FIXED SNGF0004101 3.0 ,-2 dBd,SILVER ,GSM+DCS+PCS,L1100,EXTERNAL 1.7 mm,3.5 mm,MSWR3(FZY) ,N ,STR ,- ,T OF HEAD=...

  • Page 133: Replacement Parts

    <Main component> Level Location No. Description Part Number Specification Color Remark Cobalt SACY00 PCB ASSY,FLEXIBLE SACY0018601 L1100 EUACO Blue BAT1 BATTERY,CELL,LITHIUM SBCL0001001 3 V,1.2 mAh,COIN ,ASAHI BATTERY (ML414NB/F9D) CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP...
  • Page 134 CAMERA SVCY0002501 CMOS ,VGA ,VGA,CIS SVLM00 LCD MODULE SVLM0008201 128*160(1.86 ,36.2*48.7 ,Main TFT Sub 4-Gray(96*64) TM SAFY PCB ASSY,MAIN SAFY0095801 L1100 EUA MLAB00 LABEL,A/S MLAB0001001 PCB A/S LAVEL MLAC00 LABEL,BARCODE MLAC0003301 EZ LOOKS(use for PCB ASSY MAIN(hardware)) SAFA00 PCB ASSY,MAIN,AUTO...
  • Page 135 Level Location No. Description Part Number Specification Color Remark C211 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C212 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C213 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C214 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C216 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP C217 CAP,CERAMIC,CHIP ECCH0000122...
  • Page 136 Level Location No. Description Part Number Specification Color Remark C509 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP C510 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C511 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C512 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C513 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP...
  • Page 137 Level Location No. Description Part Number Specification Color Remark C727 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP C728 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP C729 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP C730 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP C731 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP C732 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP C733 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP...
  • Page 138 Level Location No. Description Part Number Specification Color Remark C831 CAP,CERAMIC,CHIP ECCH0000140 560 pF,50V,K,X7R,HD,1005,R/TP C833 CAP,CERAMIC,CHIP ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP C835 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C836 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C838 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C839 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C841 CAP,CERAMIC,CHIP ECCH0000117...
  • Page 139 Level Location No. Description Part Number Specification Color Remark FB710 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead FB711 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead FB712 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead FB713 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead FB714 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead FB715 FILTER,BEAD,CHIP...
  • Page 140 Level Location No. Description Part Number Specification Color Remark Q402 TR,BJT,NPN EQBN0007101 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY Q403 TR,BJT,NPN EQBN0007001 SC-70 ,0.1 W,R/TP , Q601 TR,FET,P-CHANNEL EQFP0004501 SOT-323 ,0.29 W,1.8 V,0.86 A,R/TP ,P-Chanel MOSFET R101 RES,CHIP ERHY0000287 220K ohm,1/16W,J,1005,R/TP R102 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP...
  • Page 141 Level Location No. Description Part Number Specification Color Remark R221 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R222 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R223 RES,CHIP ERHY0000138 33K ohm,1/16W,F,1005,R/TP R224 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R225 RES,CHIP ERHY0000266 22K ohm,1/16W,J,1005,R/TP R231 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R232 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP...
  • Page 142 Level Location No. Description Part Number Specification Color Remark R416 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R419 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R420 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R421 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP R422 RES,CHIP ERHY0000207 20 ohm,1/16W,J,1005,R/TP R423 RES,CHIP ERHY0000207 20 ohm,1/16W,J,1005,R/TP R424 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP...
  • Page 143 Level Location No. Description Part Number Specification Color Remark R808 RES,CHIP ERHY0000223 150 ohm,1/16W,J,1005,R/TP R810 RES,CHIP ERHY0000210 30 ohm,1/16W,J,1005,R/TP R811 RES,CHIP ERHY0000224 180 ohm,1/16W,J,1005,R/TP R812 RES,CHIP ERHY0000224 180 ohm,1/16W,J,1005,R/TP R814 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP R815 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP R817 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP...
  • Page 144 Level Location No. Description Part Number Specification Color Remark U203 EUSY0077401 SOT23-6 ,6 PIN,R/TP ,SPDT ANALOG SWITCH U301 EUSY0147002 US8 ,8 PIN,R/TP ,DUAL 2-INPUT OR GATE 88-BALL FBGA ,88 PIN,R/TP ,128M (64M * 2) FLASH 64M U302 EUSY0160502 PSRAM U303 EUSY0077301 SC70-6/SOT23-6 ,6 PIN,R/TP , U401...

  • Page 145: Accessory

    12.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Level Location No. Description Part Number Specification Color Remark MHBY00 HANDSTRAP MHBY0001101 Neck Strap 400mm (CDMA,common use) Gray SBPL00 BATTERY PACK,LI-ION SBPL0072124 3.7 V,820 mAh,1 CELL,PRISMATIC ,S110 BATTERY(SV) Silver SGEY00...

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