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Precautions for Soldering
(1)In case of solder reflow
Reflow is allowed only
within the temperature profile as shown in the figure below.
This Profile temperature is the sensor surface package temperature.
Reflow interval shall be within 7days under conditions, 10 to 30℃, 70%RH or less.
ＭＡＸ
250℃
220℃
190℃
150℃
1～5℃/s
85℃
25℃
(2)Other precautions
An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin of package inside.
Even if within the temperature profile above, there is the possibility that the gold wire in package is broken.
Please use after confirmation the conditions fully actual solder reflow machine.
GP2AP01VT10F
three
at the temperature and the time
1～5℃/s
MAX120s
12 / 18
1～5℃/s
MAX10s
MAX50s
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