TABLE OF CONTENTS
1.
Visual Display .............................................................. 1-1
Precautions ................................................................... 1-5
2.
...................................................... 2-1
3.
4.
4-7. Schematic Diagram - YM-A01 Board (2/2) - ............ 4-13
4-9. Printed Wiring Board - RG-A01 Board - .................. 4-19
4-14. Printed Wiring Board - DD-A02 Board - .................. 4-29
5.
6.
Confidential
PLM-A35E (AEP)
...................... 3-1
............................................. 5-1
............................ 6-1
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
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