HP HSR6602-G Disassembly Instructions page 4

3.3 Material of the facility built
Facility Components
1
2
3.1
3.2
3.3
3
3.4
3.5
3.6
4
5
6
7
8
9
10
11
12
4. Revised record
Date Version
2012.11.21 V0
2013.07.19 V1
EL-MF877-00
Template Revision B
Material Weight(g)
Fe 84
Fe 150
Fe 42
Fe 41
Cable 10
Complex PCB 10
Fe 383
PC 50*5
Fe 96*2
Fe 313
Fe 2515
Fe 759
Complex PCB 100
Complex PCB 250
Complex PCB 1200
Be-Cu 6
Fe 4300
Author Modify content
Wu Xuejun Initial version
Liu Ziye Add the module JG776A and JG777A
Selective treatment for materials
Weight percentage
0.8%
1.4%
0.4%
0.4%
0.1%
The surface of PCB is greater
0.1%
than 10 square centimeters;
3.6%
2.4%
1.8%
3.0%
23.7%
7.2%
The surface of PCB is greater
0.9%
than 10 square centimeters;
The surface of PCB is greater
2.4%
than 10 square centimeters;
The surface of PCB is greater
11.3%
than 10 square centimeters;
0.1%
40.5%
and components
Details
Fe recycling
Fe recycling
Fe recycling
Fe recycling
Fe recycling
Fe recycling
Fe recycling
Fe recycling
Fe recycling
Cu recycling
Fe recycling
Page 4