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Product End-of-Life Disassembly Instr uctions
Product Category: Storage Enclosures
Marketing Name / Model
[List multiple models if applicable.]
HP/3PAR Drive Chassis 16-Disk (QL322A)
HP/3PAR Drive Chassis 16-Disk (QL243A)
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
18 to 26
0
0
0
0
0
10
2
0
0
0
0
Page 1
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Summary of Contents for HP QL322A
- Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
- Page 2 Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
- Page 3 Use the following diagram for power supply disassembly: AC PSU: EL-MF877-00 Page 3 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 4 Item Material Item Materials Hazards A Sheet Metal Power Socket Polycarbonate, steel... B Plastic Switch Polycarbonate, steel... C Steel Steeel, iron, plastic, PCB, copper Lead D Polycarbonate Large PCB Copper, aluminium alloy... Lead E ABS Small PCB Copper, aluminium alloy... Lead Remove Chassis cover screws.
- Page 5 Disconnect Fan connectors. Cut the tie wraps and disconnect from large PCBA. Remove 4 screws from the small PCBA. Disconnect from switch PCBA. Remove Support Tray. EL-MF877-00 Page 5 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 6 Remove the Connector PCBA Remove the large capacitor from the Small PCBA. Remove the 4 caps from the main PCBA. Remove standoffs and the large PCBA screws. DC PSU: Remove the power supply from the drive chassis using the same method as AC PSU: EL-MF877-00 Page 6 Template Revision B...
- Page 7 Use the same legend as AC PSU. Disassembling SBOD IO Modules: At the rear of the drive chassis, grasp each latch between Grip the latch handles and withdraw the the thumb and forefinger of each hand. Squeeze thumb and module. forefinger together to release the latch.
- Page 8 Disassembling Hard Drive Modules: Release the carrier handle by pressing Withdraw the module from the drive bay. the latch in the handle towards the right To remove hard drive: remove the 2 screws from the rear PCBA (if present) and remove the 4 screws from the bottom. EL-MF877-00 Page 8 Template Revision B...
- Page 9 Item Material Hazards Hard Disk Drive Aluminium alloy A380 Plain spring steel Zinc alloy 3 Polycarbonate Beryllium copper 190 alloy XHM. ASTM B194 1996 Lead Silicon Grease Lead All Screws, nuts and washers are zinc plated steel Disassembling Control Panel: At the rear of the drive chassis, remove the two screws Remove the four screws from the PCBA to bracket assy to shown and pull out the PCBA.
- Page 10 Item Material Hazards Aluminium Alloy 380 Lead Polycarbonate All Screws, nuts and washers are zinc plated steel Disassembling Center Plane (aka Mid-Plane) PCBA: Remove the EMI fingers from all of the drive bays. Remove one drive wall screw from each drive wall from the top, and one screw from each drive wall the bottom. Remove the three mid drive-walls.
- Page 11 Item Material Hazards ZINTEC A/F Aluminium Polycarbonate Lead Tin-lead plate Copper Lead ECP 0613/08 bright tin plate Polycarbonate with aluminium inserts Gaskets All Screws, nuts and washers are zinc plated steel EL-MF877-00 Page 11 Template Revision B PSG instructions for this template are available at EL-MF877-01...