HP StorageWorks EVA8000 Disassembly Instructions page 2

Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Philips Screwdriver
Description #2 Pry Tool
Description #3 ?
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
2.
3.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
* Printed Circuit Boards no longer require selective treatment. Can be disposed with the remainder of the assembly.
EL-MF877-00
Template Revision A
Controller front view.
Battery Assemblies shown
on left. Battery latch
indicated by arrow.
Remove Battery(s).
0
0
Tool Size (if
applicable)
2
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