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Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP LD5511 Large Format Display
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
bezel and rear cover
Include the cartridges, print heads, tubes, vent
chambers, and service stations. 2
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
4
1
0
1
0
34
0
3
0
2
0
0
0
Page 1
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Summary of Contents for HP LD5511
- Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
- Page 2 refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable)
-
Page 3: Mechanical Instructions
11. Mechanical Instructions Step Figure Description Unscrew the screws and Rear remove the cover. COVER_SERVICE to remove the rear cover. Rear Disconnect the cover. connector. - Page 4 Remove the tapes and all the Boards screws to remove the main board and power board. Remove the Main screws to remove board. the main board.
- Page 5 Disconnect the Panel LVDS cable to remove tha panel. Unscrew the Speaker screws to remove and IR the speaker and board IR board.
- Page 6 Remove Unscrew the the Key screws to remove board the key board. Key board. Key board.
- Page 7 IR board IR board...