LG 32SE3B-BE Service Manual page 19

L14 POWER BlOCK
Q2300-*1
+3.5V_ST
MMBT3906(NXP)
E
Q2300 NXP_RL_ON_TR
2N3906S-RTK
B
KEC_RL_ON_TR
E C
C
R2301
10K
B
+3.5V_ST
C
R9042
RL_ON 10K
B Q2303
MMBT3904(NXP)
E
+13V_A
VA8012
L6001
ADMC 5M 02 200L
UBW2012-121F
C8006 VA8011
0.1uF 20V
50V
+3.3V_NORMAL
+3.5V_ST
R7002
1K
R7003
100
C
R9037
10K
B Q2302
INV_CTL
MMBT3904(NXP)
E
Vout=1.25*(1+R2/R1)+Iadj*R2
+1.5V_DDR
+3.3V_NORMAL
L502
EAN62868801
BLM18PG121SN1D
IC501
IN OUT
ADJ/GND
C505
10uF
10V
1.3A
+5V_Normal & +5V_USB with OCP
+13V
OPT C509
10uF
R521
R9039
25V
10K 100K
POWER_ON/OFF_1
OPT
C506
100pF
50V
+3.3V_NORMAL
EN
C507
1
R519 4700pF
THERMAL
4.7K 50V
COMP
25
2
OPT SS
OPT OPT
R520 3
R516 R529
0
4.7K 4.7K ROSC
IC502
4
EN_SW2 TPS65282REGR
USB2_CTL 5
4A
EN_SW1
USB1_CTL 6
+3.3V_NORMAL
R522 R528
10K 10K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
+13V
L6002
UBW2012-121F
VA7004
C6001
20V
0.1uF
50V
P2300
SMAW200-H12S5K(BK)(LTR)
PWR_ON PDIM2 R7107 100
1 2
PWM2
GND D13V
3 4
D13V D13V
5 6
A13V A13V
7 8
GND GND
9 10
DRV_ON PDIM1 R7108 100
11 12 PWM1
13
'15 FHD POWER
+1.5V_DDR
L505
CB2012PK501T
R517 R523 ZD503
R1
1K 0 2.5V
1/16W
1%
C508
10uF
R518 10V
200 R2
1/16W
1%
C511
10uF
25V +13V
+5V_NORMAL
C514 L507
0.047uF
4.7uH
25V
BST
18
R1
LX_2
17
C517 C519
R532
LX_1 18K 82pF 22uF
16 50V 10V
1%
FB
15
R2
SW_IN_2
14
R533
SW_IN_1 3.3K
1%
13
C515
10uF
+5V_USB1 10V
R526
+5V_USB2
15K
5%
Vout=0.8*(1+R1/R2)
Parts No.501~600
+3.5V_ST
+13V +3.5V_POWER_DET
R542
100K
OPT
OPT
R540
R536 R549
0
14K 4.7K
1% RESET_IC_ROHM
IC503
BD48K28G
VDD VOUT R547 100
3 2
1
R537
GND C529
C516
5.1K
0.1uF
0.1uF
1%
25V 16V
RESET_IC_DIODES
IC503-*1
APX803D29
VCC RESET
3 2
1
GND
+1.10V_VDDC
+3.5V_ST
TPS5432DDAR
L508
CB2012PK501T
OPT
BOOT
C521 C523 C526 C527
0.1uF 10uF 10uF 0.1uF
16V 10V 10V 16V
VIN
+1.10V_VDDC
C528
L509
0.1uF
3.6uH
PH
16V
OPT
C520 C522 C524 GND
ZD504
0.1uF 22uF 22uF
2.5V
16V 10V 10V
C525 R544
50V
20K
R1
270pF 1%
R545 R2
47K
1%
Vout=0.808*(1+R1/R2)
+3.5V_ST
+3.5V_ST
IC7003
+3.5V_POWER_DET TPS563200
GND
VLS5045EXT-2R2N 1
L7008
2.2uH
SW
2
3A
L7006
BLM18PG121SN1D
VIN
3
OPT
C7040
C809 C7037 C7038
C7039
22uF
10uF 10uF 0.1uF
22uF
10V
25V 25V 25V 10V
Vout=0.765*(1+R1/R2)
PANEL_VCC
Power_DET
Now apply DIODES
R501
4.7K
C
B Q501
MMBT3904(NXP)
E
POWER_DET
TO IMPROVE DEEP OF PANEL_VCC
20141224
+3.3V_Normal
IC505 +3.3V_NORMAL
[EP]GND
C530
0.01uF
SS
R551
1 8
10K
EN
2 7
COMP
3 6
3A
C533
0.33uF
R550
16V
VSENSE
2.7K
4 5
1%
C531 C532
0.039uF 390pF
50V 50V
POWER_ON/OFF_1
VBST
6
EN
5 R1
VFB 1% 1%
4
150K 33K
R2
R7116 R7117
PANEL_VCC
+13V
L510
UBW2012-121F Q510
120OHM SSM3J332R
OPT
READY R562
C534
READY
C503 5.6K
0.1uF
10uF
25V C536 C501
R560 C502
16V
10uF 2.2uF
10uF
100K
16V 16V
16V
R561
TO IMPROVE RISING TIME OF PANEL_VCC
27K
20141224
C
R557
10K
B Q508
PANEL_CTL
MMBT3904(NXP)
E
R556
10K
+3.5V_ST +3.3V_NORMAL
Q509
L511
AO3435 BLM18PG121SN1D
C535 C537 C538
R552 R558
ZD505
2.2uF 0.1uF 22uF
10K 22K
5.6V
10V 16V 10V
R559
2.2K
C
R555
10K
B Q507
MMBT3904(NXP)
E
LS33B 14/10/09
Power Block
LGE Internal Use Only
R563
5.6K