Huawei MU509 Hardware Migration Manual page 3

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide
Revision History
Document
Version
01
02
03
04
05
06
07
08
Issue 08 (2016-12-12)
Date Chapter
2011-05-17
2013-10-11 All
All
2014-02-18
3.5
2014-10-11 All
2015-03-17 All
2015-10-27 All
2016-04-08 All
3.2.1
3.3.2
2016-12-12 1
2.3.1
2.3.1
HUAWEI Proprietary and Confidential
Copyright © HUAWEI Technologies Co., Ltd.
About This Document
Descriptions
Creation
Updated
Updated the description related to LED pins
Updated the description related to UART
pins
Updated the description related to PCM
audio pins
Updated antenna interface compatibility
design
Added the description related to MU709 and
ME909u-523
Added the description related to ME209u-
526
Added the description related to ME909s
Added the description related to MU509-65
Deleted Table 3-2 Differences of the antenna
interface in pad size and function
Updated stencil thickness from 0.15 mm to
0.12 mm
Updated Table 1-2 Overview of Huawei 30
mm × 30 mm LGA modules and Table 1-3
Differences of LGA Interfaces
Deleted the description related to MU609
Updated Table 2-9 Differences of the audio
interface
About This Document
3