Huawei ME909u-521 Hardware Manual page 24
Lte lga module
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Also See for ME909u-521:
- Acceptance inspection manual (13 pages) ,
- Hardware manual (82 pages) ,
- Hardware migration manual (70 pages)
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HUAWEI ME909u-521 LTE LGA Module
Hardware Guide
Pin
Pin Name
Pad
No.
Type
-
133
GND
-
134
GND
-
135
GND
-
136
GND
-
137
GND
-
138
GND
-
139
GND
-
140
GND
-
141
GND
-
142
GND
-
143
GND
-
144
GND
-
145
GND
Issue 05 (2017-12-15)
Description
Parameter
Thermal Ground
-
Pad, this pad need
thermal via
Thermal Ground
-
Pad, this pad need
thermal via
Thermal Ground
-
Pad, this pad need
thermal via
Thermal Ground
-
Pad, this pad need
thermal via
Thermal Ground
-
Pad, this pad need
thermal via
Thermal Ground
-
Pad, this pad need
thermal via
Thermal Ground
-
Pad, this pad need
thermal via
Thermal Ground
-
Pad, this pad need
thermal via
Thermal Ground
-
Pad, this pad need
thermal via
Thermal Ground
-
Pad, this pad need
thermal via
Thermal Ground
-
Pad, this pad need
thermal via
Thermal Ground
-
Pad, this pad need
thermal via
Thermal Ground
-
Pad, this pad need
thermal via
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description of the Application Interfaces
Min.
Typ.
Max.
(V)
(V)
(V)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Comments
-
-
-
-
-
-
-
-
-
-
-
-
-
24
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- Usim Card Interface
- Rf Antenna Interface
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