Package Outline - Philips Nexperia PNX2000 Product Data

Philips Semiconductors

12. Package outline

LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
y
108
109
pin 1 index
144
1
e
DIMENSIONS (mm are the original dimensions)
A
UNIT A A
1 2
max.
0.15 1.45
mm
1.6
0.05 1.35
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT486-1 136E23
Fig 7. LQFP package outline
9397 750 13928
Product data
X
73
36
w Z D
M
b
p
D
H
D
(1) (1)
A b c D E
3 p
0.27 0.20 20.1 20.1
0.25
0.17 0.09 19.9 19.9
REFERENCES
IEC JEDEC
MS-026
Rev. 03 – 23 August 2004
A
72
Z E
e
H
A
E
A
E
w
M
b
p
37
v
M A
B
v
M B
0 5 10 mm
scale
e H H L L
D E p
22.15 22.15 0.75
1
0.5
21.85 21.85 0.45
JEITA
PNX2000
Audio video input processor
2
A
1
L
p
L
detail X
(1) (1)
v w y Z Z
D E
1.4 1.4
0.2 0.08 0.08
1.1 1.1
EUROPEAN
ISSUE DATE
PROJECTION
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
SOT486-1
(A )
3
o
7
o
0
00-03-14
03-02-20
26 of 31