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G522-0289-00
(IBM Order Number)
Advance Information
PowerPC 603
Hardware Specifications
The PowerPC 603 microprocessor is an implementation of the PowerPC™ family of
reduced instruction set computing (RISC) microprocessors. In this document, the term
'603' is used as an abbreviation for the phrase, 'PowerPC 603 microprocessor'. The
PowerPC 603 microprocessors are available from Motorola as MPC603 and from IBM as
PPC603. This document contains pertinent physical characteristics of the 603. For
functional characteristics refer to the PowePC 603 RISC Microprocessor User's Manual .
This document contains the following topics:
Topic
To locate any published errata or updates for this document, refer to the website at
http://www.mot.com/powerpc/ or at http://www.chips.ibm.com/products/ppc.
The PowerPC name, the PowerPC logotype, and PowerPC 603 are trademarks of International Business Machines Corporation, used by
Motorola under license from International Business Machines Corporation. FLOTHERM is a registered trademark of Flomerics Ltd., UK.
This document contains information on a new product under development by Motorola and IBM. Motorola and IBM reserve the right to
change or discontinue this product without notice.
©
Motorola Inc., 1997. All rights reserved.
Portions hereof
©
International Business Machines Corporation, 1991-1997. All rights reserved.
RISC Microprocessor
™
MPC603EC/D
(Motorola Order Number)
1/97
REV 3
™
Page
2
4
4
14
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Table of Contents
Related Manuals for Motorola PowerPC 603
Summary of Contents for Motorola PowerPC 603
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Page 1: Table Of Contents
Motorola under license from International Business Machines Corporation. FLOTHERM is a registered trademark of Flomerics Ltd., UK. This document contains information on a new product under development by Motorola and IBM. Motorola and IBM reserve the right to change or discontinue this product without notice. -
Page 2: Section 1.1, "Overview
1.1 Overview This section describes the features of the 603 and describes briefly how those units interact. The 603 is the first low-power implementation of the PowerPC microprocessor family of RISC microprocessors. The 603 implements the PowerPC architecture as it is specified for 32-bit addressing, which provides 32-bit effective (logical) addresses, integer data types of 8, 16, and 32 bits, and floating- point data types of 32 and 64 bits (single-precision and double-precision). - Page 3 1.2 Features This section summarizes features of the 603’s implementation of the PowerPC architecture. Major features of the 603 are as follows: • High-performance, superscalar microprocessor — As many as three instructions issued and retired per clock — As many as five instructions in execution per clock —...
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Page 4: Section 1.3, "General Parameters
• Integrated power management — Low-power 3.3 volt design — Internal processor/bus clock multiplier that provides 1/1, 2/1, 3/1 and 4/1 ratios — Three power saving modes—doze, nap, and sleep — Automatic dynamic power reduction when internal functional units are idle •... - Page 5 Value Rating θ ° C/W Motorola wire-bond CQFP package die junction-to-case thermal resistance (typical) θ ° C/W IBM C4-CQFP package die junction-to-heat sink base thermal resistance (typical) Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.
- Page 6 Table 4. DC Electrical Specifications (Continued) Vdd = 3.3 ± 5% V dc, GND = 0 V dc, 0 ≤ T ≤ 105 ° C Characteristic Symbol Unit Notes Output low voltage, I = 14 — Capacitance, V = 0 V, f = 1 MHz (excludes TS, ABB, DBB, and ARTRY) —...
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Page 7: Ac Electrical Characteristics
1.4.2 AC Electrical Characteristics This section provides the AC electrical characteristics for the 603. After fabrication, parts are sorted by maximum processor core frequency as shown in Section 1.4.2.1, “Clock AC Specifications” and tested for conformance to the AC specifications for that frequency. The processor core frequency is determined by the bus (SYSCLK) frequency and the settings of the PLL_CFG[0–3] signals. - Page 8 Figure 1 provides the SYSCLK input timing diagram. CVih SYSCLK CVil VM = Midpoint Voltage (1.4 V) Figure 1. SYSCLK Input Timing Diagram 1.4.2.2 Input AC Specifications Table 7 provides the input AC timing specifications for the 603 as defined in Figure 2 and Figure 3. Table 7.
- Page 9 Figure 2 provides the input timing diagram for the 603. SYSCLK ALL INPUTS VM = Midpoint Voltage (1.4 V) Figure 2. Input Timing Diagram Figure 3 provides the mode select input timing diagram for the 603. HRESET MODE PINS VM = Midpoint Voltage (1.4 V) Figure 3.
- Page 10 1.4.2.3 Output AC Specifications Table 8 provides the output AC timing specifications for the 603 as defined in Figure 4. Table 8. Output AC Timing Specifications Vdd = 3.3 ± 5% V dc, GND = 0 V dc, CL = 50 pF, 0 ≤ T ≤...
- Page 11 Figure 4 provides the output timing diagram for the 603. SYSCLK ALL OUTPUTS (Except TS, ABB, DBB, ARTRY ABB, DBB ARTRY VM = Midpoint Voltage (1.4 V) Figure 4. Output Timing Diagram 1.4.3 JTAG AC Timing Specifications Table 9 provides the JTAG AC timing specifications as defined in Figure 5 through Figure 8. Table 9.
- Page 12 Table 9. JTAG AC Timing Specifications (Independent of SYSCLK) (Continued) Vdd = 3.3 ± 5% V dc, GND = 0 V dc, C = 50 pF, 0 ≤ T ≤ 105 °C Characteristic Unit Notes Boundary-scan input data hold time —...
- Page 13 Figure 7 provides the boundary-scan timing diagram. Data Inputs Input Data Valid Data Outputs Output Data Valid Data Outputs Data Outputs Output Data Valid Figure 7. Boundary-Scan Timing Diagram Figure 8 provides the test access port timing diagram. TDI, TMS Input Data Valid Output Data Valid Output Data Valid...
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Page 14: Section 1.5, "Powerpc 603 Microprocessor Pin Assignments
1.5 PowerPC 603 Microprocessor Pin Assignments This section contains the pinout diagram for the 603 ceramic quad flat pack (CQFP) package as shown in Figure 9. OGND OVDD OVDD OGND TOP VIEW OGND OVDD OVDD OGND DBWO DRTRY AACK DBDIS... -
Page 15: Section 1.6, "Powerpc 603 Microprocessor Pinout Listing
1.6 PowerPC 603 Microprocessor Pinout Listing Table 10 provides the pinout listing for the 603 CQFP package. Table 10. PowerPC 603 Microprocessor Pinout Listing Signal Name Pin Number Active A[0–31] 179, 2, 178, 3, 176, 5, 175, 6, 174, 7, 170, 11, 169, 12, 168,... - Page 16 Table 10. PowerPC 603 Microprocessor Pinout Listing (Continued) Signal Name Pin Number Active 9, 19, 29, 39, 49, 65, 116, 132, 142, 152, 162, 172, 182, 206, Input HRESET Input Input LSSD_MODE Input L1_TSTCLK — Input L2_TSTCLK — Input Input...
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Page 17: Section 1.7, "Powerpc 603 Microprocessor Package Description
Description The following sections provide the package parameters and the mechanical dimensions for the 603. Note that the 603 is currently offered in two types of CQFP packages—the Motorola wire-bond CQFP and the IBM C4-CQFP. 1.7.1 Motorola Wire-Bond CQFP Package Description The following sections provide the package parameters and mechanical dimensions for the Motorola wire- bond CQFP package. - Page 18 1.7.1.2 Mechanical Dimensions of the Motorola Wire-Bond CQFP Package Figure 10 shows the mechanical dimensions for the Motorola wire-bond CQFP package. θI –H– θ2 *Reduced pin count shown for clarity. 60 pins per side Min. Max. 30.86 31.75 34.6 BSC 3.75...
- Page 19 1.7.2 IBM C4-CQFP Package Description The following sections provide the package parameters and mechanical dimensions for the IBM C4-CQFP package. 1.7.2.1 Package Parameters The package parameters for the IBM C4-CQFP are as provided in the following list. The package type is 32 mm x 32 mm, 240-pin ceramic quad flat pack.
- Page 20 1.7.2.2 Mechanical Dimensions of the IBM C4-CQFP Package Figure 11 shows the mechanical dimensions for the IBM C4-CQFP package. Epoxy Dam Solder-Bump Encapsulant Chip Radius Jmin Urethane Clip Leadframe Tape Cast Ceramic 0.08 0.13 TOTAL s *Reduced pin count shown for clarity. 60 pins per side 31.8 32.2 34.4...
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Page 21: Section 1.8, "System Design Information
CPU and VCO frequency of operation. The PLL configuration for the 603 is shown in Table 11 for nominal frequencies. Table 11. PowerPC 603 Microprocessor PLL Configuration CPU Frequency in MHz (VCO Frequency in MHz) PLL_CFG[0–3]... - Page 22 1.8.2 PLL Power Supply Filtering The AVdd power signal is provided on the 603 to provide power to the clock generation phased-lock loop. To ensure stability of the internal clock, the power supplied to the AVdd input signal should be filtered using a circuit similar to the one shown in Figure 12.
- Page 23 and may float in the high-impedance state for relatively long periods of time. Since the 603 must continually monitor these signals for snooping, this float condition may cause excessive power draw by the input receivers on the 603. It is recommended that these signals be pulled up through weak (10 KΩ) pull-up resistors or restored in some manner by the system.
- Page 24 Wakefield Engineering 617-245-5900 60 Audubon Rd. Wakefield, MA 01880 Aavid Engineering 603-528-3400 One Kool Path Laconia, NH 03247-0440 Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. 1.8.6.1 Internal Package Conduction Resistance For this packaging technology the intrinsic thermal conduction resistance (shown in Table 3) versus the external thermal resistance paths are shown in Figure 14 for a package with an attached heat sink mounted...
- Page 25 Silicone Sheet (0.006 inch) Bare Joint Floroether Oil Sheet (0.007 inch) Graphite/Oil Sheet (0.005 inch) Synthetic Grease 1 . 5 0 . 5 Contact Pressure (psi) Contact Pressure (psi) Figure 15. Thermal Performance of Select Thermal Interface Material The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment shock/vibration requirements.
- Page 26 Loctite Corporation 860-571-5100 1001 Trout Brook Crossing Rocky Hill, CT 06067 AI Technology (e.g., EG7655) 609-882-2332 1425 Lower Ferry Rd Trent, NJ 08618 The following section provides a heat sink selection example using one of the commercially available heat sinks. 1.8.6.3 Heat Sink Selection Example For preliminary heat sink sizing, the die-junction temperature can be expressed as follows: + θ...
- Page 27 Thermalloy #2328B Pin-fin Heat Sink (25 x 28 x 15 mm) Approach Airflow Velocity (m/s) Approach Airflow Velocity (m/s) Figure 16. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity of 7 °C/W, thus Assuming an air velocity of 0.5 m/s, we have an effective R = 30 °C + 5 °C + (2.2 °C/W +1.0 °C/W + 7 °C/W) * 3.0 W, resulting in a die-junction temperature of approximately 66 °C which is well within the maximum operating temperature of the component.
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Page 28: Section 1.9, "Ordering Information
66.67 MHz 0000 MPC603AFE66AC PPC603-FX-066-1 1.9.1 Motorola Part Number Key Figure 17 provides a detailed description of the Motorola part number for the 603. MPC 603 A FE XX X C Revision Level (Contact Motorola Sales Office) Product Code Application Modifier... -
Page 29: Appendix A General Handling Recommendations For The C4-Cqfp Package
Appendix A General Handling Recommendations for the C4-CQFP Package The following list provides a few guidelines for package handling: • Handle the electrostatic discharge sensitive (ESD) package with care before, during, and after processing. • Do not apply any load to exceed 3 Kg after assembly. •... - Page 30 During the card assembly process, no solvent can be used with the C4FP, and no more than 3 Kg of force must be applied normal to the top of the package prior to, during, or after card assembly. Other details of the card assembly process follow: Solder paste Either water soluble (for example, Alpha 1208) or no clean...
- Page 31 Neither Motorola nor IBM is to be considered an agent or representative of the other, and neither has assumed, created, or granted hereby any right or authority to the other, or to any third party, to assume or create any express or implied obligations on its behalf.