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SERVICE MANUAL
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength: 780 nm
Emission Duration: Continuous
Laser out-put Power: Less than 44.6 µW*
* This output is the value measured at a
distance of 200 mm from the objective lens
surface on the Optical Pick-up Block.
Frequency response
10 – 20,000 Hz
Wow and flutter
Below the measurable limit
Signal-to-noise ratio
94 dB
Outputs
BUS control output (8 pins)
Analog audio output (RCA pin)
MICROFILM
Model Name Using Similar Mechanism
CD Drive Mechanism Type
Optical Pick-up Name
SPECIFICATIONS
Currnet drain
Operating temperature
Dimensions
Mass
Power requirement
Supplied accessories
Design and specifications subject to change without notice.
COMPACT DISC CHANGER
CDX-715
US Model
Canadian Model
AEP Model
UK Model
800 mA (during CD playback)
800 mA (during loading or ejecting a disc)
–10˚C to +55˚C (14˚F to 131˚F)
Approx. 262 × 90 × 181.5 mm
× 3
× 7
3
5
1
(10
/
/
/
in.)
8
8
4
(w/h/d)
not incl. projecting parts and controls
Approx. 2.1 kg (4 lb. 10 oz.)
12 V DC car battery (negative ground)
Disc magazine (1)
Parts for installation and connections (1 set)
E Model
NEW
MG-250B-137
KSS-521A/J2N

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Summary of Contents for Sony CDX-715

  • Page 1 CDX-715 SERVICE MANUAL US Model Canadian Model AEP Model UK Model E Model Model Name Using Similar Mechanism CD Drive Mechanism Type MG-250B-137 Optical Pick-up Name KSS-521A/J2N SPECIFICATIONS Currnet drain 800 mA (during CD playback) System Compact disc digital audio system...
  • Page 2: Table Of Contents

    SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
  • Page 3 DISC MAGAZINE GETTING OUT PROCEDURE ON THE POWER SUPPLY IS OFF Remove the CASE (LOWER) assembly beforehand 1) Press the lever (stop) ass’y to arrow direction. 2) Removal the magazine ass’y. Note: Take out the magazine only when the tray is completely within the magazine.
  • Page 4: General

    SECTION 2 This section is extracted from instruction manual. GENERAL – 5 – – 6 –...
  • Page 5 – 7 –...
  • Page 6: Disassembly

    SECTION 3 DISASSEMBLY Note: Follow the disassembly procedure in the numerical order given. COVER (UPPER), FRONT PANEL ASS’Y 1 screw (PTT2.6 × 6) 1 screw (PTT2.6 × 6) 2 case (upper) 3 lever (FL) 1 screw (PTT2.6 × 6) 1 screw (PTT2.6 ×...
  • Page 7 JACK BOARD Remove the JACK board of the arrow. 1 ground point screw (+PTT2.6 × 6) 2 JACK board MAIN BOARD 6 three screws 1 main flexible board (CNJ12) 7 MAIN board 2 connector (CNP301) 3 screw 5 screw (BVTT2 × 4) (P1.4 ×...
  • Page 8 ELEVATOR MOTOR ASS’Y (M104) 1 screw (P2 × 2.2) 2 bracket (ELV motor) 3 elevator motor ass’y ESCUTCHEON 3 two claws 2 Remove the claw of the arrow A . 4 Remove the ditch of the arrow B . 5 Remove the escutcheon of the arrow C .
  • Page 9 CASE (UPPER) ASS’Y 1 screw (P2 × 2.2) 2 bracket (stopper upper) 4 three screws (B2 × 3) 6 Remove the edge of the arrow A . 4 two screws (B2 × 3) 7 Remove the case (upper) ass’y of the arrow B .
  • Page 10 RF BOARD 2 two screws 1 OP flexible board (PS2 × 4) (CNJ11) 3 two screws (PS2 × 4) 4 RF board 5 connector (CNP52) 5 two connectors (CNP11, 503) SLED MOTOR ASS’Y (M102), OPTICAL PICK-UP (KSS-512A/J2N) 1 two screws 2 sled motor ass’y (P2 ×...
  • Page 11 SW BOARD, SPINDLE MOTOR ASS’Y (M101) 8 two screws (P1.7 × 2.2) 3 spring (chucking) 6 retainer (disc) 4 screw 1 screw (P2 × 2.2) (P2 × 2.2) 5 bracket (CP) 9 Remove the spindle motor ass’y (M101) of the arrow. 2 SW board CHUCKING MOTOR ASS’Y (M103) 2 two screws (P2 ×...
  • Page 12: Mechanismdeck Assembly

    SECTION 4 MECHANISMDECK ASSEMBLY Note: Follow the assembly procedure in the numerical order given. OPTICAL PICK-UP COMPLETE ASS’Y 1 Move the lever (LOCK 3) in direction A , and return it a little in direction B from the position where the chuck plate is moved down to the lower limit.
  • Page 13 OPERATION CHECK 1 Confirm that the slider moves in direction C to move down the chuck plate if the gear (LOAD 1) is rotated in direction A or the chuck plate moves up and the slider moves in direction D if the gear is rotated in direction B .
  • Page 14 SLIDER (L) 1 Move the lever (STOP) ass’y in direction A until it gets stopped. 3 washer 2 slider (L) SLIDER (R) 4 polyethyelene slider 3 washer 1 slider (R) 5 polyethyelene washer 2 Engage the slots of slider (R) with the shafts.
  • Page 15 ADJUSTING PHASE OF SLIDERS (L, R) 1 Sliding the sliders (L, R) in the arrow direction, meet holes a and b of the sliders (L, R) with holes c and d of the case (LOWER) ass’y slider (R) case (LOWER) ass’y slider (L) GEAR (ELV2) / (ELV3) 4 retaining ring...
  • Page 16: Mechanical Adjustments

    7. After adjustment at addresses 5 to 6 is finished, check all op- erations from addresses 1 to 10 with the set placed vertically CDX-715 and horizontally respectively to confirm that the elevator shaft positions in a range between comb teeth A to B.
  • Page 17: Electrical Adjustments

    SECTION 6 ELECTRICAL ADJUSTMENTS Note: • TRACKING OFFSET CHECK • FOCUS GAIN ADJUSTMENT • When gain is lowered... 1. Perform adjustments as given. (COARSE ADJUSTMENT) The set does not play because of no focus operation. 2. Be sure to use the disc “YEDS-18” parts code: 3-702-101-01, but [RF BOARD] –...
  • Page 18: Diagrams

    CDX-715 SECTION 7 DIAGRAMS 7-1. BLOCK DIAGRAM – SERVO Section – DIGITAL SIGNAL PROCESSOR, FILTER CLV SERVO IC101 PD1 I-V AMP PCMD DATI DATA BCKO BCKI (Page 23) LRCK DETECTOR LRCI LRCK ASYMMETRY DIGITAL PLL SUMMING PD2 I-V AMP DEMODULATOR...
  • Page 19: Main Section

    Q201 SW202 MAGAZINE IN/OUT MAG.SW ELV.ON DETECT D311 REGULATOR CD.ON MICON +5V Q303 BU.CHK BUS INTERFACE D313 (FOR SONY BUS) DAC +5V, B+ SWITCH REGULATOR B.UP IC302 SERVO +5V Q304, 305 IC305 DATA ELEVATOR MOTOR DRIVE IC301 OUT1 ELV.R ELEVATOR...
  • Page 20: Printed Wiring Boards - Rf Section

    CDX-715 • Semiconductor 7-2. PRINTED WIRING BOARDS – RF Section – Location Ref. No. Location IC11 IC51 IC52 Note on Printed Wiring Boards: • Y : parts extracted from the conductor side. • : Through hole. • b : Pattern from the side which enables seeing.
  • Page 21: Schematic Diagram – Rf Section

    CDX-715 7-3. SCHEMATIC DIAGRAM – RF Section – • See page 25 for Note on Schematic Diagram. • See page 39 for Waveforms. • See page 41 and 42 for IC Block Diagrams. – 27 – – 28 –...
  • Page 22: Printed Wiring Board - Main Section - Main Board (Component Side)

    CDX-715 • Semiconductor 7-4. PRINTED WIRING BOARD – MAIN Section – MAIN Board (Component Side) Location • See page 32 for Note on Printed Wiring Board. • See page 33 to 36 for Schematic Diagram. (Component Side) Ref. No. Location...
  • Page 23: Main Section - Main Board (Conductor Side)

    CDX-715 – MAIN Section – MAIN Board (Conductor Side) • See page 33 to 36 for Schematic Diagram. • Semiconductor Location (Conductor Side) Ref. No. Location IC303 IC305 Q305 Note on Printed Wiring Board: • X : parts extracted from the component side.
  • Page 24: Schematic Diagram - Main Section - Main Board (1/2)

    CDX-715 7-5. SCHEMATIC DIAGRAM – MAIN Section – MAIN Board (1/2) • See page 39 and 40 for Waveforms. • See page 42 to 44 for IC Block Diagrams. • See page 45 and 46 for IC Pin Function Description.
  • Page 25: Main Section - Main Board (2/2)

    CDX-715 – MAIN Section – MAIN Board (2/2) • See page 40 for Waveforms. • See page 43 and 44 for IC Block Diagrams. • See page 29 to 32 for Printed Wiring Board. Note on Schematic Diagram: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
  • Page 26: Printed Wiring Board - Jack Section

    CDX-715 7-6. PRINTED WIRING BOARD – JACK Section – 7-7. SCHEMATIC DIAGRAM – JACK Section – Note on Schematic Diagram: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
  • Page 27 • Waveforms – RF Board – – MAIN Board (1/2) – 1 IC11 1 (FEO) 1 IC101 @¶ MDP 500 mV/DIV, 500 nsec/DIV 2.5 Vp-p 1.4 ± 0.3 Vp-p 3.8 µ s 2 IC11 2 (FEI) 2 IC101 $ª WDCK 50 mV/DIV, 1 µsec/DIV Approx.
  • Page 28 6 IC101 &¢ WFCK !¡ IC102 0 BCKO 5.3 Vp-p 5 Vp-p 137 µ s 472 ns 7 IC101 *ª XTAI !™ IC102 !¡ LRCKO 5.3 Vp-p 4.5 Vp-p 22.6 µ s 59 ns 8 IC201 #¡ EXTAL – MAIN Board (2/2) – !£...
  • Page 29: Ic Block Diagrams

    • IC Block Diagrams IC11 CXA1992BR (RF BOARD) – RF SUMMING PD2 IV PD1 IV FE_BIAS SENS2 ↓ SENS1 – LASER POWER CONTROL F IV AMP FE AMP C. OUT – E IV AMP – DFCT XRST – LEVEL S DATA FO.
  • Page 30 IC52, 301 BA6287F (RF BOARD, MAIN BOARD) OUT1 OUT2 DRIVER DRIVER VREF CONTROL LOGIC POWER SAVE IC101 CXD2530Q (MAIN BOARD) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 LRCK WDCK ASYE...
  • Page 31 IC202 AT24C16N-10SI-TR (MAIN BOARD) IC302 BA8272F-E2 (MAIN BOARD) START CYCLE H.V. GENERATOR TIMING & CONTROL START/ STOP LOGIC EEPROM CONTROL LOGIC DECODER RESET SLAVE ADDRESS 128 x 16 x 8 SWITCH REGISTER & COMPARATOR WORD ADDRESS COUNTER DEVICE ADDRESS BITS DECODER D OUT DATA...
  • Page 32 IC402 MB814400C-70PFTN CLOCK OSC A0–A9 XRAS XCAS COLUMN DECODER SENSE REFRESH AMP INPUT/OUTPUT CONTROL SWITCH MEMORY CELL IC601 TC9464FN-EL (MAIN BOARD) 14 13 MICROCOMPUTER INTERFACE INTERFACE CIRCUIT CIRCUIT DIGITAL FILTER CIRCUIT TIMING ATTENUATOR OPERATIONAL CIRCUIT GENERATOR DEEMPHASIS FILTER CIRCUIT D-∆ MODULATION CIRCUIT TEST OUTPUT OUTPUT...
  • Page 33: Ic Pin Function Description

    ESPXLT ESP latch pulse signal output to the CXD2522Q (IC401) “L” active System reset signal input from the SONY bus interface (IC302) and reset signal generator (IC304) “L”: reset For several hundreds msec. after the power supply rises, “L” is input, then it changes to “H”...
  • Page 34 Not used (open) C.OUT Track number count signal input from the CXA1992AR (IC11) BUS.ON Bus on/off control signal input from the SONY bus interface (IC302) “H”: bus on A/D.SW Analog/digital out selection signal output terminal “L”: digital out Not used (open) MGLK Magazine eject operation completion detect switch (SW201) input “L”: eject completed...
  • Page 35: Exploded Views

    SECTION 8 EXPLODED VIEWS NOTE: • -XX and -X mean standardized parts, so they • Items marked “*” are not stocked since they The components identified by mark ! or dotted line with mark are seldom required for routine service. Some may have some difference from the original ! are critical for safety.
  • Page 36 (2) MECHANISM DECK SECTION-1 (MG-250B-137) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 4-965-759-01 WASHER, POLYETHYLENE * 58 3-010-240-01 SLIDER (L) * 52 X-3373-239-1 SLIDER (R) ASSY 3-011-997-01 SPRING (STOPPER. LOWER) 3-010-244-01 SPRING (STOPPER. UPPER) 3-014-603-01 WASHER * 54 X-3373-243-1 CASE (UPPER) ASSY 3-736-073-01 SLIDER, POLYETHYLENE...
  • Page 37 (3) MECHANISM DECK SECTION-2 (MG-250B-137) M104 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 101 X-3373-223-1 CASE (LOWER) ASSY 3-010-249-01 GEAR (ELV 3) 3-010-266-01 SPRING (STOP LEVER), TENSION * 111 3-016-916-01 BRACKET (WORM RETAINER) * 103 3-010-250-01 BRACKET (ELV MOTOR) * 112 3-014-681-01 SHAFT (WORM RETAINER)
  • Page 38 (4) MECHANISM DECK SECTION-3 (MG-250B-137) (including r A) M103 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 151 3-010-269-01 BRACKET (LOAD MOTOR) A-3290-155-A CHASSIS (EVT) (MAIN) ASSY * 152 X-3373-230-1 BASE (WORM) ASSY 3-701-438-11 WASHER, 2.5 * 153 3-010-270-01 COVER (MOTOR L) 3-010-254-01 SHAFT (ROTARY PREVENTION C)
  • Page 39 (5) MECHANISM DECK SECTION-4 (MG-250B-137) M101 M102 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark X-3373-229-1 BASE (SLED) ASSY ! 209 8-820-010-05 OPTICAL PICK-UP KSS-521A/J2RP 3-010-258-01 GEAR (SLED MID) 1-664-626-11 OP FLEXIBLE BOARD 3-573-936-00 STOPPER, REEL 3-010-262-01 DETENT (SLED) A-3291-958-A SHAFT (SLED) ASSY 3-920-362-01 SCREW (ESCUTCHEON)
  • Page 40 SECTION 9 JACK MAIN ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the • Items marked “*” are not stocked since they The components identified by mark ! or dotted line with mark parts list may be different from the parts speci- are seldom required for routine service.
  • Page 41 MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C609 1-126-154-11 ELECT 47uF 6.3V IC403 8-759-242-76 IC TC7W08F C610 1-126-157-11 ELECT 10uF IC601 8-759-494-78 IC TC9464FN-EL C611 1-163-251-11 CERAMIC CHIP 100PF C620 1-126-157-11 ELECT 10uF < TRANSISTOR > C621 1-163-251-11 CERAMIC CHIP 100PF...
  • Page 42 MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R312 1-216-073-00 METAL CHIP 1/10W 1-162-970-11 CERAMIC CHIP 0.01uF R313 1-216-295-00 SHORT 1-104-700-11 CERAMIC CHIP 0.027uF R314 1-216-295-00 SHORT 1-162-970-11 CERAMIC CHIP 0.01uF R315 1-216-295-00 SHORT 1-109-982-11 CERAMIC CHIP R316 1-216-073-00 METAL CHIP 1/10W...
  • Page 43 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 1-216-851-11 METAL CHIP 330K 1/16W ************** HARDWARE LIST 1-216-837-11 METAL CHIP 1/16W ************** 1-216-847-11 METAL CHIP 150K 1/16W 1-218-273-11 RES, CHIP 510K 1/16W 7-627-852-07 SCREW, PRECISION +P 1.7X2.5 1-218-296-11 RES, CHIP 1/16W 7-685-792-09 SCREW +PTT 2.6X6 (S)
  • Page 44 CDX-715 Sony Corporation 98A0575-1 9-925-691-11 Personal & Mobile Communication Company Printed in Japan © 1998. 1 – 56 – Published by Quality Assurance Dept.

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